Integrated Voltage Regulators with Thin-Film Magnetic Power Inductors

Integration of alternative materials and devices with CMOS will expand functionality and improve performance of established applications in the era of diminishing returns from Moore's Law scaling. In particular, integration of thin-film magnetic materials will enable improvements in energy efficiency of digital computing applications by enabling integrated power conversion and management with on-chip power inductors. Integrated voltage reg- ulators will also enable fine-grained power management, by providing dynamic scaling of the supply voltage in concert with the clock frequency of synchronous logic to throttle power consumption at periods of low computational demand. Implementation of integrated power conversion requires high capacity energy storage devices. This is best achieved with integration of thin-film magnetic materials for high quality on-chip power inductors. This thesis describes a body of work conducted to develop integrated switch-mode voltage regulators with thin-film magnetic power inductors. Soft-magnetic materials and inductor topologies are selected and optimized, with intent to maximize efficiency and current density of the integrated regulators. Custom integrated circuits are designed and fabricated in 45nm-SOI to provide the control system and power-train necessary to drive the power inductors. A silicon interposer is designed and fabricated in collaboration with IBM Research to integrate custom power inductors by 2.5D chip stacking, enabling power conversion with current density greater than 10A/mm2. The concepts and designs developed from this work will enable significant improvements in performance-per-watt of future microprocessors

Reinventing Integrated Photonic Devices and Circuits for High Performance Communication and Computing Applications

The long-standing technological pillars for computing systems evolution, namely Moore\u27s law and Von Neumann architecture, are breaking down under the pressure of meeting the capacity and energy efficiency demands of computing and communication architectures that are designed to process modern data-centric applications related to Artificial Intelligence (AI), Big Data, and Internet-of-Things (IoT). In response, both industry and academia have turned to \u27more-than-Moore\u27 technologies for realizing hardware architectures for communication and computing. Fortunately, Silicon Photonics (SiPh) has emerged as one highly promising ‘more-than-Moore’ technology. Recent progress has enabled SiPh-based interconnects to outperform traditional electrical interconnects, offering advantages like high bandwidth density, near-light speed data transfer, distance-independent bitrate, and low energy consumption. Furthermore, SiPh-based electro-optic (E-O) computing circuits have exhibited up to two orders of magnitude improvements in performance and energy efficiency compared to their electronic counterparts. Thus, SiPh stands out as a compelling solution for creating high-performance and energy-efficient hardware for communication and computing applications. Despite their advantages, SiPh-based interconnects face various design challenges that hamper their reliability, scalability, performance, and energy efficiency. These include limited optical power budget (OPB), high static power dissipation, crosstalk noise, fabrication and on-chip temperature variations, and limited spectral bandwidth for multiplexing. Similarly, SiPh-based E-O computing circuits also face several challenges. Firstly, the E-O circuits for simple logic functions lack the all-electrical input handling, raising hardware area and complexity. Secondly, the E-O arithmetic circuits occupy vast areas (at least 100x) while hardly achieving more than 60% hardware utilization, versus CMOS implementations, leading to high idle times, and non-amortizable area and static power overheads. Thirdly, the high area overhead of E-O circuits hinders them from achieving high spatial parallelism on-chip. This is because the high area overhead limits the count of E-O circuits that can be implemented on a reticle-size limited chip. My research offers significant contributions to address the aforementioned challenges. For SiPh-based interconnects, my contributions focus on enhancing OPB by mitigating crosstalk noise, addressing the optical non-linearity-related issues through the development of Silicon-on-Sapphire-based photonic interconnects, exploring multi-level signaling, and evaluating various device-level design pathways. This enables the design of high throughput (\u3e1Tbps) and energy-efficient (\u3c1pJ/bit) SiPh interconnects. In the context of SiPh-based E-O circuits, my contributions include the design of a microring-based polymorphic E-O logic gate, a hybrid time-amplitude analog optical modulator, and an indium tin oxide-based silicon nitride microring modulator and a weight bank for neural network computations. These designs significantly reduce the area overhead of current E-O computing circuits while enhancing the energy-efficiency, and hardware utilization

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed