Index to NASA Tech Briefs, 1972

Abstracts of 1972 NASA Tech Briefs are presented. Four indexes are included: subject, personal author, originating center, and Tech Brief number

Bioresorbable Materials on the Rise: From Electronic Components and Physical Sensors to In Vivo Monitoring Systems

Over the last decade, scientists have dreamed about the development of a bioresorbable technology that exploits a new class of electrical, optical, and sensing components able to operate in physiological conditions for a prescribed time and then disappear, being made of materials that fully dissolve in vivo with biologically benign byproducts upon external stimulation. The final goal is to engineer these components into transient implantable systems that directly interact with organs, tissues, and biofluids in real-time, retrieve clinical parameters, and provide therapeutic actions tailored to the disease and patient clinical evolution, and then biodegrade without the need for device-retrieving surgery that may cause tissue lesion or infection. Here, the major results achieved in bioresorbable technology are critically reviewed, with a bottom-up approach that starts from a rational analysis of dissolution chemistry and kinetics, and biocompatibility of bioresorbable materials, then moves to in vivo performance and stability of electrical and optical bioresorbable components, and eventually focuses on the integration of such components into bioresorbable systems for clinically relevant applications. Finally, the technology readiness levels (TRLs) achieved for the different bioresorbable devices and systems are assessed, hence the open challenges are analyzed and future directions for advancing the technology are envisaged

NASA Tech Briefs Index, 1978

Approximately 601 announcements of new technology derived from the research and development activities of the National Aeronautics and Space Administration are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electron systems; physical sciences; materials; life sciences; mechanics; machinery; fabrication technology; and mathematics and information sciences

Beyond solid-state lighting: Miniaturization, hybrid integration, and applications og GaN nano- and micro-LEDs

Gallium Nitride (GaN) light-emitting-diode (LED) technology has been the revolution in modern lighting. In the last decade, a huge global market of efficient, long-lasting and ubiquitous white light sources has developed around the inception of the Nobel-price-winning blue GaN LEDs. Today GaN optoelectronics is developing beyond lighting, leading to new and innovative devices, e.g. for micro-displays, being the core technology for future augmented reality and visualization, as well as point light sources for optical excitation in communications, imaging, and sensing. This explosion of applications is driven by two main directions: the ability to produce very small GaN LEDs (microLEDs and nanoLEDs) with high efficiency and across large areas, in combination with the possibility to merge optoelectronic-grade GaN microLEDs with silicon microelectronics in a fully hybrid approach. GaN LED technology today is even spreading into the realm of display technology, which has been occupied by organic LED (OLED) and liquid crystal display (LCD) for decades. In this review, the technological transition towards GaN micro- and nanodevices beyond lighting is discussed including an up-to-date overview on the state of the art

Multifunctional vertical interconnections of multilayered flexible substrates for miniaturised POCT devices

Point-of-care testing (POCT) is an emerging technology which can lead to an eruptive change of lifestyle and medication of population against the traditional medical laboratory. Since living organisms are intrinsically flexible and malleable, the flexible substrate is a necessity for successful integration of electronics in biological systems that do not cause discomfort during prolonged use. Isotropic conductive adhesives (ICAs) are attractive to wearable POCT devices because ICAs are environmentally friendly and allow a lower processing temperature than soldering which protects heat-sensitive components. Vertical interconnections and optical interconnections are considered as the technologies to realise the miniaturised high-performance devices for the future applications. This thesis focused on the multifunctional integration to enable both electrical and optical vertical interconnections through one via hole that can be fabricated in flexible substrates. The functional properties of the via and their response to the external loadings which are likely encountered in the POCT devices are the primary concerns of this PhD project. In this thesis, the research of curing effect on via performance was first conducted by studying the relationship between curing conditions and material properties. Based on differential scanning calorimetry (DSC) analysis results, two-parameter autocatalytic model (Sestak-Berggren model) was established as the most suitable curing process description of our typical ICA composed of epoxy-based binders and Ag filler particles. A link between curing conditions and the mechanical properties of ICAs was established based on the DMA experiments. A series of test vehicles containing vias filled with ICAs were cured under varying conditions. The electrical resistance of the ICA filled vias were measured before testing and in real time during thermal cycling tests, damp heat tests and bending tests. A simplified model was derived to represent rivet-shaped vias in the flexible printed circuit boards (FPCBs) based on the assumption of homogenous ICAs. An equation was thus proposed to evaluate the resistance of the model. Vias with different cap sizes were also tested, and the equation was validated. Those samples were divided into three groups for thermal cycling test, damp heat ageing test and bending test. Finite element analysis (FEA) was used to aid better understanding of the electrical conduction mechanisms. Based on theoretical equation and simulation model, the fistula-shape ICA via was fabricated in flexible PCB. Its hollow nature provides the space for integrations of optical or fluidic circuits. Resistance measurements and reliability tests proved that carefully designed and manufactured small bores in vias did not comprise the performance. Test vehicles with optoelectrical vias were made through two different approaches to prove the feasibility of multifunctional vertical interconnections in flexible substrates. A case study was carried out on reflection Photoplethysmography (rPPG) sensors manufacturing, using a specially designed optoelectronic system. ICA-based low-temperature manufacture processes were developed to enable the integration of these flexible but delicate substrates and components. In the manufacturing routes, a modified stencil printing setup, which merges two printing-curing steps (vias forming and components bonding) into one step, was developed to save both time and energy. The assembled probes showed the outstanding performance in functional and physiological tests. The results from this thesis are anticipated to facilitate the understanding of ICA via conduction mechanism and provide an applicable tool to optimise the design and manufacturing of optoelectrical vias

Additive nanomanufacturing: a review

Additive manufacturing has provided a pathway for inexpensive and flexible manufacturing of specialized components and one-off parts. At the nanoscale, such techniques are less ubiquitous. Manufacturing at the nanoscale is dominated by lithography tools that are too expensive for small- and medium-sized enterprises (SMEs) to invest in. Additive nanomanufacturing (ANM) empowers smaller facilities to design, create, and manufacture on their own while providing a wider material selection and flexible design. This is especially important as nanomanufacturing thus far is largely constrained to 2-dimensional patterning techniques and being able to manufacture in 3-dimensions could open up new concepts. In this review, we outline the state-of-the-art within ANM technologies such as electrohydrodynamic jet printing, dip-pen lithography, direct laser writing, and several single particle placement methods such as optical tweezers and electrokinetic nanomanipulation. The ANM technologies are compared in terms of deposition speed, resolution, and material selection and finally the future prospects of ANM are discussed. This review is up-to-date until April 2014

Center for Space Microelectronics Technology

The 1991 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the Center during the past year. The report lists 193 publications, 211 presentations, and 125 new technology reports and patents

The 2023 terahertz science and technology roadmap

Terahertz (THz) radiation encompasses a wide spectral range within the electromagnetic spectrum that extends from microwaves to the far infrared (100 GHz–∼30 THz). Within its frequency boundaries exist a broad variety of scientific disciplines that have presented, and continue to present, technical challenges to researchers. During the past 50 years, for instance, the demands of the scientific community have substantially evolved and with a need for advanced instrumentation to support radio astronomy, Earth observation, weather forecasting, security imaging, telecommunications, non-destructive device testing and much more. Furthermore, applications have required an emergence of technology from the laboratory environment to production-scale supply and in-the-field deployments ranging from harsh ground-based locations to deep space. In addressing these requirements, the research and development community has advanced related technology and bridged the transition between electronics and photonics that high frequency operation demands. The multidisciplinary nature of THz work was our stimulus for creating the 2017 THz Science and Technology Roadmap (Dhillon et al 2017 J. Phys. D: Appl. Phys. 50 043001). As one might envisage, though, there remains much to explore both scientifically and technically and the field has continued to develop and expand rapidly. It is timely, therefore, to revise our previous roadmap and in this 2023 version we both provide an update on key developments in established technical areas that have important scientific and public benefit, and highlight new and emerging areas that show particular promise. The developments that we describe thus span from fundamental scientific research, such as THz astronomy and the emergent area of THz quantum optics, to highly applied and commercially and societally impactful subjects that include 6G THz communications, medical imaging, and climate monitoring and prediction. Our Roadmap vision draws upon the expertise and perspective of multiple international specialists that together provide an overview of past developments and the likely challenges facing the field of THz science and technology in future decades. The document is written in a form that is accessible to policy makers who wish to gain an overview of the current state of the THz art, and for the non-specialist and curious who wish to understand available technology and challenges. A such, our experts deliver a 'snapshot' introduction to the current status of the field and provide suggestions for exciting future technical development directions. Ultimately, we intend the Roadmap to portray the advantages and benefits of the THz domain and to stimulate further exploration of the field in support of scientific research and commercial realisation

NASA Tech Briefs Index 1978

Tech Briefs are short announcements of new technology derived from the research and development activities of the National Aeronautics and Space Administration. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This Index to NASA Tech Briefs contains abstracts and four indexes -- subject, personal author, originating Center, and Tech Brief number -- for 1978 Tech Briefs