204 research outputs found

    3D modeling and integration of current and future interconnect technologies

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    Title from PDF of title page viewed June 21, 2021Dissertation advisor: Masud H. ChowdhuryVitaIncludes bibliographical references (pages 133-138)Thesis (Ph.D.)--School of Computing and Engineering and Department of Physics and Astronomy. University of Missouri--Kansas City, 2021To ensure maximum circuit reliability it is very important to estimate the circuit performance and signal integrity in the circuit design phase. A full phase simulation for performance estimation of a large-scale circuit not only require a massive computational resource but also need a lot of time to produce acceptable results. The estimation of performance/signal integrity of sub-nanometer circuits mostly depends on the interconnect capacitance. So, an accurate model for interconnect capacitance can be used in the circuit CAD (computer-aided design) tools for circuit performance estimation before circuit fabrication which reduces the computational resource requirement as well as the time constraints. We propose a new capacitance models for interconnect lines in multilevel interconnect structures by geometrically modeling the electrical flux lines of the interconnect lines. Closed-form equations have been derived analytically for ground and coupling capacitance. First, the capacitance model for a single line is developed, and then the new model is used to derive expressions for the capacitance of a line surrounded by neighboring lines in the same and the adjacent layers above and below. These expressions are simple, and the calculated results are within 10% of Ansys Q3D extracted values. Through silicon via (TSV) is one of the key components of the emerging 3D ICs. However, increasing number of TSVs in smaller silicon area leads to some severe negative impacts on the performance of the 3D IC. Growing signal integrity issues in TSVs is one of the major challenges of 3D integration. In this paper, different materials for the cores of the vias and the interposers are investigated to find the best possible combination that can reduce crosstalk and other losses like return loss and insertion loss in the TSVs. We have explored glass and silicon as interposer materials. The simulation results indicate that glass is the best option as interposer material although silicon interposer has some distinct advantages. For via cores three materials - copper (Cu), tungsten (W) and Cu-W bimetal are considered. From the analysis it can concluded that W would be better for high frequency applications due to lower transmission coefficient. Cu offers higher conductivity, but it has larger thermal expansion coefficient mismatch with silicon. The performance of Cu-W bimetal via would be in between Cu and W. However, W has a thermal expansion coefficient close to silicon. Therefore, bimetal Cu-W based TSV with W as the outer layer would be a suitable option for high frequency 3D IC. Here, we performed the analysis in terms of return loss, transmission coefficient and crosstalk in the vias. Signal speed in current digital systems depends mainly on the delay of interconnects. To overcome this delay problem and keep up with Moore’s law, 3D integrated circuit (vertical integration of multiple dies) with through-silicon via (TSV) has been introduced to ensure much smaller interconnect lengths, and lower delay and power consumption compared to conventional 2D IC technology. Like 2D circuit, the estimation of 3D circuit performance depends on different electrical parameters (capacitance, resistance, inductance) of the TSV. So, accurate modeling of the electrical parameters of the TSV is essential for the design and analysis of 3D ICs. We propose a set of new models to estimate the capacitance, resistance, and inductance of a Cu-filled TSV. The proposed analytical models are derived from the physical shape and the size of the TSV. The modeling approach is comprehensive and includes both the cylindrical and tapered TSVs as well as the bumps. On-chip integration of inductors has always been very challenging. However, for sub- 14nm on-chip applications, large area overhead imposed by the on-chip capacitors and inductors has become a more severe concern. To overcome this issue and ensure power integrity, a novel 3D Through-Silicon-Via (TSV) based inductor design is presented. The proposed TSV based inductor has the potential to achieve both high density and high performance. A new design of a Voltage Controlled Oscillator (VCO) utilizing the TSV based inductor is also presented. The implementation of the VCO is intended to study the feasibility, performance, and real-world application of the proposed TSV based inductor.Introduction -- Background of capacitance modeling of on-chip interconnect -- Accurate modeling of interconnect capacitance in multilevel interconnect structures for sub 22nm technology -- Analysis of different materials and structures for through silicon via and through glass via in 3D integrated circuits -- Impacts of different shapes of through-silicon-via core on 3D IC performance -- Accurate electrical modeling of cu-filled through-silicon-via (TSV) -- Design and characterize TSV based inductor for high frequency voltage-controlled oscillator design -- Conclusion and future wor

    Multi-material heterogeneous integration on a 3-D Photonic-CMOS platform

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    Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been achieved at low costs. However, some functionalities, such as optical memory, Pockels modulation, and magnetooptical activity, are challenging or impossible to acquire on group-IV materials alone. Heterogeneous integration promises to expand the range of capabilities within silicon photonics. Existing heterogeneous integration protocols are nonetheless not compatible with active silicon processes offered at most photonic foundries. In this work, we propose a novel heterogeneous integration platform that will enable wafer-scale, multi-material integration with active silicon-based photonics, requiring zero-change to existing foundry process. Furthermore, the platform will also pave the way to a class of high-performance devices. We propose a grating coupler design with peak coupling efficiency reaching 93%, an antenna with peak diffraction efficiency in excess of 97%, and a broadband adiabatic polarization rotator with conversion efficiency exceeding 99%

    Segmentation-Driven Tomographic Reconstruction.

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    Parallel software tool for decomposing and meshing of 3d structures

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    An algorithm for automatic parallel generation of three-dimensional unstructured computational meshes based on geometrical domain decomposition is proposed in this paper. Software package build upon proposed algorithm is described. Several practical examples of mesh generation on multiprocessor computational systems are given. It is shown that developed parallel algorithm enables us to reduce mesh generation time significantly (dozens of times). Moreover, it easily produces meshes with number of elements of order 5 · 107, construction of those on a single CPU is problematic. Questions of time consumption, efficiency of computations and quality of generated meshes are also considered

    Formulating a Strategy for Securing High-Speed Rail in the United States, Research Report 12-03

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    This report presents an analysis of information relating to attacks, attempted attacks, and plots against high-speed rail (HSR) systems. It draws upon empirical data from MTI’s Database of Terrorist and Serious Criminal Attacks Against Public Surface Transportation and from reviews of selected HSR systems, including onsite observations. The report also examines the history of safety accidents and other HSR incidents that resulted in fatalities, injuries, or extensive asset damage to examine the inherent vulnerabilities (and strengths) of HSR systems and how these might affect the consequences of terrorist attacks. The study is divided into three parts: (1) an examination of security principles and measures; (2) an empirical examination of 33 attacks against HSR targets and a comparison of attacks against HSR targets with those against non-HSR targets; and (3) an examination of 73 safety incidents on 12 HRS systems. The purpose of this study is to develop an overall strategy for HSR security and to identify measures that could be applied to HSR systems currently under development in the United States. It is hoped that the report will provide useful guidance to both governmental authorities and transportation operators of current and future HSR systems

    Microtechnologies for Discharge-based Sensors.

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    Microdischarge-based sensors are known to offer advantages such as the ability to operate at temperature extremes and to provide large output signals that do not require local amplification. This work is primarily directed at the design and microfabrication of pressure sensors that use differential microdischarge currents. Two approaches are evaluated. The first uses a common anode and reference cathode located on a glass substrate, whereas a sensing cathode is located on an opposing silicon diaphragm that is deflected by applied pressure. Leads are transferred by electroplated through-glass vias. The second uses a common cathode and reference anode located on a silicon substrate, whereas a sensing anode is located on a thin film diaphragm that deflects under applied pressure. Leads are transferred by through-wafer isolated bulk-silicon lead transfer (TWIST). Fabricated sensors with 200-”m diameter have footprints as small as 300×300 ”m2, and volume of ≈0.01 mm3, which is 150× smaller than prior work. The fractional differential current (I1-I2)/(I1+I2) increases monotonically from -0.7 to 0.2 as external pressure increases from 1 atm to 8 atm. The TWIST process can also be used to fabricate ultra-miniature capacitive pressure sensors with backside contacts that minimize the form factor and allow stacking of the sensor on interface electronics. A sensor with a 100-”m diameter diaphragm measures 150×150 ”m2 in size. Fabricated sensors with thicknesses of 3 ”m (C100t3) and 5 ”m (C100t5) have dynamic ranges of 20 MPa and 50 MPa, respectively. Pressure responses in the non-contact mode and the contact mode are 3.1 fF/MPa, 5.3 fF/MPa for C100t3, and 1.6 fF/MPa, 1.6 fF/Ma for C100t5, respectively. This thesis also describes a preliminary exploration of options to initiate microdischarges using scavenged energy – in this case from mechanical impact. A miniature high voltage generator is formed by connecting multiple electrode pairs in series on a single PZT element. This strategy amplifies voltage roughly in proportion to the electrode pair count; a three electrode-pair device is used to successfully initiate microdischarges with peak voltages exceeding 1.35 kV.PhDMechanical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111467/1/xinluo_1.pd

    Lattice Boltzmann Methods for Turbulent Flows – Application to Coriolis Mass Flowmeter

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    Komplexe StrömungsphĂ€nomene machen es schwierig Ingenieursanwendungen so detailliert und genau zu simulieren, dass eine Charakterisierung und Verbesserung ihres Funktionsprinzips möglich ist. Diese Arbeit zeigt, dass die Lattice-Boltzmann-Methode (LBM) sehr gut fĂŒr diesen Zweck geeignet ist. Im Vordergrund stehen hierbei die Simulation und Modellierung von turbulenten Strömungen. Diese lassen sich auf Grund der hervorragenden Parallelisierbarkeit der LBM mit Large-eddy Simulationen an Stelle von Reynolds-gemittelten Navier--Stokes Modellen, die im industriellen Umfeld ĂŒblich sind, berechnen. Somit können komplexe transiente turbulente Strömungen simulativ untersucht werden. Die daraus gewonnenen Erkenntnisse dienen insbesondere der Auslegung und Optimierung von Bauteilen und Prozessen. Alle beschriebenen LBM Simulationen werden mit der Open Source Software OpenLB durchgefĂŒhrt. Dazu wird OpenLB erweitert, um eine Validierung von implementierten Turbulenzmodellen mittels kanonischer Strömungsformen zu ermöglichen. Des Weiteren wird ein Framework fĂŒr die Simulation von Fluid-Struktur Interaktion (FSI) geschaffen. Anfangs werden die Kollisionsoperatoren Bhatnagar--Gross--Krook (BGK), Entropic Lattice Boltzmann (ELB), Two-Relaxation-Time (TRT), Regularized Lattice Boltzmann (RLB) und Multiple-Relaxation-Time (MRT) in der Taylor-Green Vortex Strömung, einem klassischen Beispiel fĂŒr abklingende homogene isotrope Turbulenz (DHIT), untersucht. Hierbei liegt der Fokus auf StabilitĂ€t, Konsistenz und Genauigkeit der verwendeten Schemata. Die Studie beinhaltet den Vergleich der turbulenten kinetischen Energie, der Dissipationsrate der Energie und dem Energiespektrum zu einer Referenzlösung. Drei unterschiedliche Reynoldszahlen, Re=800\mathrm{Re}=800, Re=1600\mathrm{Re}=1600 und Re=3000\mathrm{Re}=3000, werden sowohl unter Verwendung einer akustischen als auch einer diffusiven Skalierung betrachtet, um den Einfluss der Lattice Machzahl zu charakterisieren. In stark unteraufgelösten Gitterkonfigurationen zeigt das BGK Schema ein instabiles Verhalten. Divergierende Simulationen unter der Verwendung des MRT Schemas sind auf eine starke AbhĂ€ngigkeit von der Lattice Machzahl zurĂŒckzufĂŒhren. Obwohl ELB die ViskositĂ€t verĂ€ndert, kann kein Verhalten, das einem WirbelviskositĂ€tsmodell entspricht, gefunden werden. Bei geringen Lattice Machzahlen zeigt das RLB Schema sehr geringe Energielevel bei hohen Wellenzahlen. Der ,,magic parameter" des TRT Schemas wird bestimmt im Hinblick auf den Energieeintrag. Trotzdem wird keine erhöhte StabilitĂ€t im Vergleich zum BGK Schema festgestellt. Insgesamt sollte die Lattice Machzahl bezĂŒglich des verwendeten Kollisonsschemas gewĂ€hlt werden, um die StabilitĂ€t zu gewĂ€hrleisten und die Genauigkeit zu verbessern. FĂŒr die Realisierung eines wandmodellierten Large-Eddy Simulation (NWM-LES) Ansatzes wird der BGK Kollisionsoperator ausgewĂ€hlt. Das Smagorinsky WirbelviskositĂ€tsmodell kommt hierbei zum Einsatz und wird in der turbulenten Grenzschicht mit der van Driest\u27schen DĂ€mpfungsfunktion verwendet. Der Einfluss verschiedener Implementierungen von Geschwindigkeitsrandbedingungen und Wandfunktionen wird in einer biperiodischen, voll ausgebildeten turbulenten Kanalströmung fĂŒr Schubspannungs-Reynoldszahlen von Reτ=1000\mathrm{Re}_\tau=1000, Reτ=2000\mathrm{Re}_\tau=2000 und Reτ=5200\mathrm{Re}_\tau=5200 untersucht. Die Validierung erfolgt mittels Daten einer direkten numerischen Simulation (DNS) fĂŒr Turbulenzstatistiken erster und zweiter Ordnung. Die Anwendung dieses Ansatzes auf einen Coriolis Massendurchflussmesser (CMF) zeigt, dass der Druckverlust bis zu einer Reynoldszahl Re=127800\mathrm{Re}=127800 beschrieben werden kann. Des Weiteren wird der entwickelte NWM-LES LBM Ansatz mit OpenFOAM, einer Open Source Implementierung der finititen Volumen Methode (FVM) fĂŒr komplexe turbulente Strömungen, die relevant fĂŒr Verbrennungsmotoren sind, verglichen. Der zuvor entwickelte und validierte LBM Ansatz wird mit einer Geschwindigkeitsrandbedingung fĂŒr gekrĂŒmmte RĂ€nder erweitert. Die Ergebnisse beider Strömungslöser werden mit Daten eines Particle Image Velocimetry (PIV) Experiments verglichen. Die Validierung umfasst sowohl die zeitgemittelten als auch die quadratisch gemittelten (RMS) Geschwindigkeitsfelder. ZusĂ€tzlich wird sowohl die Laufzeit der Simulation als auch die Dauer der unterschiedlichen Gittergenerierungsprozesse bestimmt. Die Performanceanalyse der getesteten Konfiguration zeigt, dass OpenLB 32-mal schneller ist als OpenFOAM. Folglich ist der entwickelte NWM-LES LBM Ansatz dazu in der Lage, komplexe turbulente Strömungen in einer Ingenieursanwendung akkurat und mit einem verringerten Rechenaufwand zu beschreiben. Wirbel induzierte Vibrationen (VIV) sind ein weiterer wichtiger Anwendungsfall fĂŒr Ingenieursapplikationen. FĂŒr die Untersuchung dieser werden verschiedene Fluid-Struktur AnsĂ€tze fĂŒr LBM implementiert, verglichen und evaluiert. Die zwei untersuchten Klassen sind die Moving Boundary Methods (MBM) und die Partially Saturated Methods (PSM). Als erstes wird die GalilĂ€ische Invarianz von aerodynamischen Koeffizienten fĂŒr die einzelnen Schemata untersucht. Dazu wird das BGK Schema verwendet, um einen exzentrisch positionierten Zylinder in einer Couette Strömung zu simulieren. Überdies werden verschiedene Volumenapproximationsmethoden fĂŒr PSM und AuffĂŒllmechanismen fĂŒr MBM verglichen. Sowohl die Gitterkonvergenz als auch die Konvergenz der GalilĂ€ischen Invarianz werden betrachtet. Die Studie der VIV-PhĂ€nomene umfasst einen transvers oszillierenden Zylinder in einem Freistrom bei einer Reynoldszahl von Re=100\mathrm{Re}=100. Dabei werden freie und erzwungene Oszillation betrachtet, um bekannte PhĂ€nomene, wie Lock-in und Lock-out Zonen, zu untersuchen. Die Ergebnisse zeigen, dass sowohl MBM als auch PSM eine gute Übereinstimmung zu Literaturdaten aufweisen, womit die Eignung fĂŒr VIV-Simulationen bestĂ€tigt werden kann. Schließlich wird ein Fluid-Struktur Interaktionsansatz unter der Verwendung eines MBM Ansatzes fĂŒr die Simulation eines CMFs realisiert. Hierbei wird OpenLB mit Elmer, einer Open Source Implementierung der Finite-Elemente-Methode, gekoppelt, um auch die Strukturdynamik zu beschreiben. Ein gestaffelter Kopplungsansatz zwischen den beiden Softwarepaketen wird prĂ€sentiert. Das Finite-Elemente-Gitter wird durch das Gittergenerierungstool Gmsh erstellt, um einen kompletten Open Source Workflow zu garantieren. ZunĂ€chst werden die Eigenmoden des CMFs berechnet und mit Messdaten verglichen. Die daraus bestimmte Anregungsfrequenz wird zur Bestimmung des Phasenshifts in einer partitionierten voll gekoppelten FSI Simulation verwendet. Der berechnete Phasenshift zeigt eine gute Übereinstimmung mit den Messdaten und bestĂ€tigt, dass dieses Modell in der Lage ist, das Funktionsprinzip eines CMFs zu beschreiben. Die durchgefĂŒhrten Studien zeigen das große Potential der LBM fĂŒr die Simulation von Ingenieursapplikationen, insbesondere wenn turbulente Strömungen betrachtet werden
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