Microsystems technology: objectives

This contribution focuses on the objectives of microsystems technology (MST). The reason for this is two fold. First of all, it should explain what MST actually is. This question is often posed and a simple answer is lacking, as a consequence of the diversity of subjects that are perceived as MST. The second reason is that a map of the somewhat chaotic field of MST is needed to identify sub-territories, for which standardization in terms of system modules an interconnections is feasible. To define the objectives a pragmatic approach has been followed. From the literature a selection of topics has been chosen and collected that are perceived as belonging to the field of MST by a large community of workers in the field (more than 250 references). In this way an overview has been created with `applications¿ and `generic issues¿ as the main characteristics

Contactless measurement of electric current using magnetic sensors

We review recent advances in magnetic sensors for DC/AC current transducers, especially novel AMR sensors and integrated fluxgates, and we make critical comparison of their properties. Most contactless electric current transducers use magnetic cores to concentrate the flux generated by the measured current and to shield the sensor against external magnetic fields. In order to achieve this, the magnetic core should be massive. We present coreless current transducers which are lightweight, linear and free of hysteresis and remanence. We also show how to suppress their weak point: crosstalk from external currents and magnetic fields

A test setup for the characterization of Lorentz-force MEMS magnetometers

© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Lorentz-force MEMS magnetometers are interesting candidates for the replacement of magnetometers in consumer electronics products. Plenty of works in the literature propose MEMS magnetometers, their readout circuits and modulations. However, during the standalone characterization of such MEMS devices, a great variety of instruments and strategies are used, making it very complex to compare results from different works in the literature. For this reason, this article proposes a test setup to characterize Lorentz-force MEMS magnetometers. The proposed setup is based around the use of an impedance analyzer for the driving of voltage and Lorentz-current of the MEMS in-phase and in quadrature, which allows the device Amplitude Modulation and Frequency Modulation characterization. The proposed solution is validated by using the designed circuit to characterize two CMOS-MEMS magnetometers with very different characteristics.This work was supported in part by the Spanish Ministry of Science, Innovation and Universities, the State Research Agency (AEI) under Project RTI2018-099766-B-I00, and in part by the European Social Fund (ESF).Peer ReviewedPostprint (published version

Monolithic sensor integration in CMOS technologies

© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Besides being mainstream for mixed-signal electronics, CMOS technology can be used to integrate micro-electromechanical system (MEMS) on a single die, taking advantage of the structures and materials available in feature sizes around 180 nm. In this article, we demonstrate that the CMOS back-end-of-line (BEOL) layers can be postprocessed and be opportunistically used to create several kinds of MEMS sensors exhibiting good or even excellent performance, such as accelerometers, pressure sensors, and magnetometers. Despite the limitations of the available mechanical and material properties in CMOS technology, due to monolithic integration, these are compensated by the significant reduction of parasitics and system size. Furthermore, this work opens the path to create monolithic integrated multisensor (and even actuator) chips, including data fusion and intelligent processing.This work was supported in part by Baolab Microsystems; in part by the Spanish Ministry of Science, Innovation and Universities (MCIN); in part by the State Research Agency (AEI); in part by the European Social Fund (ESF) under Project RTI2018-099766-B-I00; in part by MCIN/AEI/10.13039/501100011033 under Grant PID2021-123535OB-I00; and in part by ERDF, “A way of making Europe.” The associate editor coordinating the review of this article and approving it for publication was Prof. Jean-Michel Redoute.Peer ReviewedPostprint (author's final draft

Microfabricated Implantable Parylene-Based Wireless Passive Intraocular Pressure Sensors

This paper presents an implantable parylene-based wireless pressure sensor for biomedical pressure sensing applications specifically designed for continuous intraocular pressure (IOP) monitoring in glaucoma patients. It has an electrical LC tank resonant circuit formed by an integrated capacitor and an inductor coil to facilitate passive wireless sensing using an external interrogating coil connected to a readout unit. Two surface-micromachined sensor designs incorporating variable capacitor and variable capacitor/inductor resonant circuits have been implemented to realize the pressure-sensitive components. The sensor is monolithically microfabricated by exploiting parylene as a biocompatible structural material in a suitable form factor for minimally invasive intraocular implantation. Pressure responses of the microsensor have been characterized to demonstrate its high pressure sensitivity (> 7000 ppm/mmHg) in both sensor designs, which confirms the feasibility of pressure sensing with smaller than 1 mmHg of resolution for practical biomedical applications. A six-month animal study verifies the in vivo bioefficacy and biostability of the implant in the intraocular environment with no surgical or postoperative complications. Preliminary ex vivo experimental results verify the IOP sensing feasibility of such device. This sensor will ultimately be implanted at the pars plana or on the iris of the eye to fulfill continuous, convenient, direct, and faithful IOP monitoring

A 3D printed electromagnetic nonlinear vibration energy harvester

A 3D printed electromagnetic vibration energy harvester is presented. The motion of the device is in-plane with the excitation vibrations, and this is enabled through the exploitation of a leaf isosceles trapezoidal flexural pivot topology. This topology is ideally suited for systems requiring restricted out-of-plane motion and benefits from being fabricated monolithically. This is achieved by 3D printing the topology with materials having a low flexural modulus. The presented system has a nonlinear softening spring response, as a result of designed magnetic force interactions. A discussion of fatigue performance is presented and it is suggested that whilst fabricating, the raster of the suspension element is printed perpendicular to the flexural direction and that the experienced stress is as low as possible during operation, to ensure longevity. A demonstrated power of ~25 μW at 0.1 g is achieved and 2.9 mW is demonstrated at 1 g. The corresponding bandwidths reach up-to 4.5 Hz. The system's corresponding power density of ~0.48 mW cm−3 and normalised power integral density of 11.9 kg m−3 (at 1 g) are comparable to other in-plane systems found in the literature

Utilisation of microsystems technology in radio frequency and microwave applications

The market trends of the rapidly growing communication systems require new product architectures and services that are only realisable by utilising technologies beyond that of planar integrated circuits. Microsystems technology (MST) is one such technology which can revolutionise radio frequency (RF) and microwave applications. This article discusses the enabling potential of the MST to meet the stringent requirements of modern communication systems. RF MST fabrication technologies and actuation mechanisms empower conventional processes by alleviating the substrate effects on passive devices and provide product designers with high quality versatile microscale components which can facilitate system integration and lead to novel architectures with enhanced robustness and reduced power consumption. An insight on the variety of components that can be fabricated using the MST is given, emphasizing their excellent electrical performance and versatility. Research issues that need to be addressed are also discussed. Finally, this article discusses the main approaches for integrating MST devices in RF and microwave applications together with the difficulties that need to be overcome in order to make such devices readily available for volume-production.peer-reviewe