Design Of Microhotplate Based Gas Sensing System [TK7875. Z21 2008 f rb].

The purpose of this research is to design, fabricate and characterize a microhotplate based gas sensing system. Tujuan kajian ini adalah untuk merekabentuk, fabrikat dan mencirikan system pengesan gas berasaskan microhotplate

Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

Moisture Transport through Housing Materials Enclosing Critical Automotive Electronics

In automotive electronics, humidity-sensitive electronics are encapsulated by protective housings that are attached to the car body. Typical housing materials are comprised of polymer composites, through which moisture transport occurs. The objective of this paper is to provide a predictive capability for moisture transport through automotive housings enclosing a cavity with electronic modules. The temperature-dependent moisture properties including moisture diffusivity, solubility, and saturated concentration of three housing material candidates are characterized first. Then, the analogy between heat transfer and the mass transfer is implemented to model the moisture transport into the cavity enclosed by the housing materials. To cope with the transient boundary condition at the housing material and the cavity interface, the effective volume scheme is used, treating the cavity as an imaginary polymer with an extremely large diffusivity and “equivalent solubility.” The prediction is subsequently validated through an experimental setup designed to monitor the in-situ humidity condition inside the cavity sealed by the housing materials. The prediction and experimental results agree well with each other, which corroborates the validity of the FEA modeling and the measured moisture properties

From nanoscale to macroscale, using the atomic force microscope to quantify the role of few-asperity contacts in adhesion

The surface roughness of a few asperities and their influence on the work of adhesion is of scientific interest. Macroscale and nanoscale adhesion data have given seemingly inconsistent results. Despite the importance of bridging the gap between the two regimes, little experimental work has been done, presumably due to the difficulty of the experiment needed to determine how small amounts of surface roughness might influence adhesion data lying in between the two scales. To investigate the role of few-asperity contacts in adhesion, the pull-off force was measured between different sized AFM (Atomic-Force Microscope) tips that had different roughnesses and sample surfaces that had well-controlled material properties. The spring constant of the cantilever, the deflection of the cantilever, and the radius of the cantilever tip were measured before each experiment. There were seventeen tips of four different types, with radii from 200 nm to 60 ìm. The samples were unpatterned amorphous silicon dioxide die with two types of surface conditions: untreated and treated with a few angstroms of vapor deposited diphenylsiloxane. We observed that the pull-off force was independent of the radius of the AFM tip, which was contrary to all continuum-mechanics model predictions. To explain this behavior, we assumed that the interactions between the AFM tip and sample were additive, material properties were constant, and that the AFM tip, asperities, and sample surfaces were of uniform density. Based on these assumptions, we calculated a simple correction due to the measured Root Mean Square (RMS) surface roughness of the AFM tips. The simple correction for the RMS surface roughness resulted in the expected dependence of the pull-off force on radius, but the magnitudes were higher than expected. Commercial and heat-treated AFM tips had minimal surface roughness and result in magnitudes that were more reliable. The relative uncertainty for the pull-off force was estimated to be 10% and the work of adhesion was estimated to be 15%. In this thesis, we derive how the cantilever and tip parameters contribute to the measured pull-off force, show how the corrected results compare with theory, and demonstrate how the AFM probes were calibrated. Although much work is still needed, the work presented here should expand the understanding of adhesion between the nanoscale and macroscale

Transient thermography for detection of micro-defects in multilayer thin films

Delamination and cracks within the multilayer structure are typical failure modes observed in microelectronic and micro electro mechanical system (MEMS) devices and packages. As destructive detection methods consume large numbers of devices during reliability tests, non-destructive techniques (NDT) are critical for measuring the size and position of internal defects throughout such tests. There are several established NDT methods; however, some of them have significant disadvantages for detecting defects within multilayer structures such as those found in MEMS devices. This thesis presents research into the application of transient infrared thermography as a non-destructive method for detecting and measuring internal defects, such as delamination and cracks, in the multilayer structure of MEMS devices. This technique works through the use of an infrared imaging system to map the changing temperature distribution over the surface of a target object following a sudden change in the boundary conditions, such as the application of a heat source to an external surface. It has previously been utilised in various applications, such as damage assessment in aerospace composites and verification of printed circuit board solder joint manufacture, but little research of its applicability to MEMS structures has previously been reported. In this work, the thermal behaviour of a multilayer structure containing defects was first numerically analysed. A multilayer structure was then successfully modelled using COMSOL finite element analysis (FEA) software with pulse heating on the bottom surface and observing the resulting time varying temperature distribution on the top. The optimum detecting conditions such as the pulse heating energy, pulse duration and heating method were determined and applied in the simulation. The influences of thermal properties of materials, physical dimensions of film, substrate and defect and other factors that will influence the surface temperature gradients were analytically evaluated. Furthermore, a functional relationship between the defect size and the resulting surface temperature was obtained to improve the accuracy of estimating the physical dimensions and location of the internal defect in detection. Corresponding experiments on specimens containing artificially created defects in macro-scale revealed the ability of the thermographic method to detect the internal defect. The precision of the established model was confirmed by contrasting the experimental results and numerical simulations

NASA Tech Briefs, June 2001

Topics covered include: Sensors; Electronic Components and Systems; Software Engineering; Materials; Manufacturing/Fabrication; physical Sciences; Information Sciences

Advanced Air Bag Technology Assessment

As a result of the concern for the growing number of air-bag-induced injuries and fatalities, the administrators of the National Highway Traffic Safety Administration (NHTSA) and the National Aeronautics and Space Administration (NASA) agreed to a cooperative effort that "leverages NHTSA's expertise in motor vehicle safety restraint systems and biomechanics with NASAs position as one of the leaders in advanced technology development... to enable the state of air bag safety technology to advance at a faster pace..." They signed a NASA/NHTSA memorandum of understanding for NASA to "evaluate air bag to assess advanced air bag performance, establish the technological potential for improved technology (smart) air bag systems, and identify key expertise and technology within the agency (i.e., NASA) that can potentially contribute significantly to the improved effectiveness of air bags." NASA is committed to contributing to NHTSAs effort to: (1) understand and define critical parameters affecting air bag performance; (2) systematically assess air bag technology state of the art and its future potential; and (3) identify new concepts for air bag systems. The Jet Propulsion Laboratory (JPL) was selected by NASA to respond to the memorandum of understanding by conducting an advanced air bag technology assessment. JPL analyzed the nature of the need for occupant restraint, how air bags operate alone and with safety belts to provide restraint, and the potential hazards introduced by the technology. This analysis yielded a set of critical parameters for restraint systems. The researchers examined data on the performance of current air bag technology, and searched for and assessed how new technologies could reduce the hazards introduced by air bags while providing the restraint protection that is their primary purpose. The critical parameters which were derived are: (1) the crash severity; (2) the use of seat belts; (3) the physical characteristics of the occupants; (4) the proximity of the occupants to the airbag module; (5) the deployment time, which includes the time to sense the need for deployment, the inflator response parameters, the air bag response, and the reliability of the air bag. The requirements for an advanced air bag technology is discussed. These requirements includes that the system use information related to: (1) the crash severity; (2) the status of belt usage; (3) the occupant category; and (4) the proximity to the air bag to adjust air bag deployment. The parameters for the response of the air bag are: (1) deployment time; (2) inflator parameters; and (3) air bag response and reliability. The state of occupant protection advanced technology is reviewed. This review includes: the current safety restraint systems, and advanced technology characteristics. These characteristics are summarized in a table, which has information regarding the technology item, the potential, and an date of expected utilization. The use of technology and expertise at NASA centers is discussed. NASA expertise relating to sensors, computing, simulation, propellants, propulsion, inflatable systems, systems analysis and engineering is considered most useful. Specific NASA technology developments, which were included in the study are: (1) a capacitive detector; (2) stereoscopic vision system; (3) improved crash sensors; (4) the use of the acoustic signature of the crash to determine crash severity; and (5) the use of radar antenna for pre-crash sensing. Information relating to injury risk assessment is included, as is a summary of the areas of the technology which requires further development

NASA Tech Briefs, May 2002

Topics include: a technology focus on engineering materials, electronic components and circuits, software, mechanics, machinery/automation, manufacturing, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs

Low Frequency Electric Field Imaging

abstract: Electric field imaging allows for a low cost, compact, non-invasive, non-ionizing alternative to other methods of imaging. It has many promising industrial applications including security, safely imaging power lines at construction sites, finding sources of electromagnetic interference, geo-prospecting, and medical imaging. The work presented in this dissertation concerns low frequency electric field imaging: the physics, hardware, and various methods of achieving it. Electric fields have historically been notoriously difficult to work with due to how intrinsically noisy the data is in electric field sensors. As a first contribution, an in-depth study demonstrates just how prevalent electric field noise is. In field tests, various cables were placed underneath power lines. Despite being shielded, the 60 Hz power line signal readily penetrated several types of cables. The challenges of high noise levels were largely addressed by connecting the output of an electric field sensor to a lock-in amplifier. Using the more accurate means of collecting electric field data, D-dot sensors were arrayed in a compact grid to resolve electric field images as a second contribution. This imager has successfully captured electric field images of live concealed wires and electromagnetic interference. An active method was developed as a third contribution. In this method, distortions created by objects when placed in a known electric field are read. This expands the domain of what can be imaged because the object does not need to be a time-varying electric field source. Images of dielectrics (e.g. bodies of water) and DC wires were captured using this new method. The final contribution uses a collection of one-dimensional electric field images, i.e. projections, to reconstruct a two-dimensional image. This was achieved using algorithms based in computed tomography such as filtered backprojection. An algebraic approach was also used to enforce sparsity regularization with the L1 norm, further improving the quality of some images.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

NASA Tech Briefs, November 2002

Topics include: a technology focus on engineering materials, electronic components and systems, software, mechanics, machinery/automation, manufacturing, bio-medical, physical sciences, information sciences book and reports, and a special section of Photonics Tech Briefs