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2 research outputs found
Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test
Author
Bultitude
Chen
+27Â more
Chidambaram
Fang
Hongtao Chen
Ivey
Ji
Khazaka
Lee
Lin
Lis
Liu
Liu
Liu
Mingyu Li
Navarro
Qiang Guo
Shao
Shao
Siow
Siow
Siyu Sun
Soto
Tan
Wang
Wood
Zhao
Zhihao Zhang
Zhou
Publication venue
'Elsevier BV'
Publication date
Field of study
No full text
Crossref
Reliability of metal films and interfaces in power electronic devices
Author
Brincker Mads
Publication venue
Aalborg Universitetsforlag
Publication date
01/01/2018
Field of study
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VBN