23 research outputs found

    Integrate and scale:A source of spectrally separable photon pairs

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    Integrated photonics is a powerful contender in the race for a fault-tolerant quantum computer, claiming to be a platform capable of scaling to the necessary number of qubits. This necessitates the use of high-quality quantum states, which we create here using an all-around high-performing photon source on an integrated photonics platform. We use a photonic molecule architecture and broadband directional couplers to protect against fabrication tolerances and ensure reliable operation. As a result, we simultaneously measure a spectral purity of 99.1±0.199.1 \pm 0.1 %, a pair generation rate of 4.4±0.14.4 \pm 0.1 MHz mW2^{-2}, and an intrinsic source heralding efficiency of 94.0±2.994.0 \pm 2.9 %. We also see a maximum coincidence-to-accidental ratio of 1644±2631644 \pm 263. We claim over an order of magnitude improvement in the trivariate trade-off between source heralding efficiency, purity and brightness. Future implementations of the source could achieve in excess of 9999 % purity and heralding efficiency using state-of-the-art propagation losses

    Principles, fundamentals, and applications of programmable integrated photonics

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    [EN] Programmable integrated photonics is an emerging new paradigm that aims at designing common integrated optical hardware resource configurations, capable of implementing an unconstrained variety of functionalities by suitable programming, following a parallel but not identical path to that of integrated electronics in the past two decades of the last century. Programmable integrated photonics is raising considerable interest, as it is driven by the surge of a considerable number of new applications in the fields of telecommunications, quantum information processing, sensing, and neurophotonics, calling for flexible, reconfigurable, low-cost, compact, and low-power-consuming devices that can cooperate with integrated electronic devices to overcome the limitation expected by the demise of Moore¿s Law. Integrated photonic devices exploiting full programmability are expected to scale from application-specific photonic chips (featuring a relatively low number of functionalities) up to very complex application-agnostic complex subsystems much in the same way as field programmable gate arrays and microprocessors operate in electronics. Two main differences need to be considered. First, as opposed to integrated electronics, programmable integrated photonics will carry analog operations over the signals to be processed. Second, the scale of integration density will be several orders of magnitude smaller due to the physical limitations imposed by the wavelength ratio of electrons and light wave photons. The success of programmable integrated photonics will depend on leveraging the properties of integrated photonic devices and, in particular, on research into suitable interconnection hardware architectures that can offer a very high spatial regularity as well as the possibility of independently setting (with a very low power consumption) the interconnection state of each connecting element. Integrated multiport interferometers and waveguide meshes provide regular and periodic geometries, formed by replicating unit elements and cells, respectively. In the case of waveguide meshes, the cells can take the form of a square, hexagon, or triangle, among other configurations. Each side of the cell is formed by two integrated waveguides connected by means of a Mach¿Zehnder interferometer or a tunable directional coupler that can be operated by means of an output control signal as a crossbar switch or as a variable coupler with independent power division ratio and phase shift. In this paper, we provide the basic foundations and principles behind the construction of these complex programmable circuits. We also review some practical aspects that limit the programming and scalability of programmable integrated photonics and provide an overview of some of the most salient applications demonstrated so far.European Research Council; Conselleria d'Educació, Investigació, Cultura i Esport; Ministerio de Ciencia, Innovación y Universidades; European Cooperation in Science and Technology; Horizon 2020 Framework Programme.Pérez-López, D.; Gasulla Mestre, I.; Dasmahapatra, P.; Capmany Francoy, J. (2020). Principles, fundamentals, and applications of programmable integrated photonics. Advances in Optics and Photonics. 12(3):709-786. https://doi.org/10.1364/AOP.387155709786123Lyke, J. C., Christodoulou, C. G., Vera, G. A., & Edwards, A. H. (2015). An Introduction to Reconfigurable Systems. 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    Engineering Photon Sources for Practical Quantum Information Processing:If you liked it then you should have put a ring on it

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    Integrated quantum photonics offers a promising route to the realisation of universal fault-tolerant quantum computers. Much progress has been made on the theoretical aspects of a future quantum information processor, reducing both error thresholds and circuit complexity. Currently, engineering efforts are focused on integrating the most valuable technologies for a photonic quantum computer; pure single-photon sources, low-loss phase shifters and passivecircuit components, as well as efficient single-photon detectors and corresponding electronics.Here, we present efforts to target the former under the constraints imposed by the latter. We engineer the spectral correlations of photons produced by a heralded single-photon source, such that they produce photons in pure quantum states (99.1±0.1 % purity), and enable additional optimisation using temporal shaping of the pump field. Our source also has a high intrinsicheralding efficiency (94.0 ± 2.9 %) and produces photon pairs at a rate (4.4 ± 0.1 MHz mW−2) which is an order of magnitude better than previously predicted by the literature for a resonant source of this purity. Additionally, we present tomographic methodologies that fully describe the photonic quantum states that we produce, without the use of analytical models, and as a means of verifying the quantum states we create, entitled – "Quantum-referenced SpontaneousEmission Tomography" (Q-SpET). We also design reconfigurable photonic circuits that can be operated at cryogenic temperatures, with zero static power consumption, entitled – "Cladding Layer Manipulation" (CLM). These devices function as on-chip phase shifters, enabling the local reconfiguration of circuit elements using established technologies but removing the need for active power consumption to maintain the reconfigured circuit. These devices are capable ofan Lπ = 12.3 ± 0.3 µm, a ∼7x reduction in length when compared to the thermo-optic phaseshifters used throughout this thesis. Finally, we investigate how pure photon sources operate as part of larger circuits within the typical design rules of photonic quantum circuits. Using this information to accurately model all of the spurious contributions to the final photonic quantumstate, which we call a form of nonlinear noise. This noise can decrease source purity to below 40 %, significantly affecting the fidelity of Hong-Ou-Mandel interference, and subsequently, our ability to reliably create fundamental resources for photonic quantum computers. All of this contributes to our design of a fundamental building block for integrated quantum photonic processors, the functionality of which can be predicted at scale, under the conditions imposed by the rest of the processor

    Security of Electrical, Optical and Wireless On-Chip Interconnects: A Survey

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    The advancement of manufacturing technologies has enabled the integration of more intellectual property (IP) cores on the same system-on-chip (SoC). Scalable and high throughput on-chip communication architecture has become a vital component in today's SoCs. Diverse technologies such as electrical, wireless, optical, and hybrid are available for on-chip communication with different architectures supporting them. Security of the on-chip communication is crucial because exploiting any vulnerability would be a goldmine for an attacker. In this survey, we provide a comprehensive review of threat models, attacks, and countermeasures over diverse on-chip communication technologies as well as sophisticated architectures.Comment: 41 pages, 24 figures, 4 table

    Analog Photonics Computing for Information Processing, Inference and Optimisation

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    This review presents an overview of the current state-of-the-art in photonics computing, which leverages photons, photons coupled with matter, and optics-related technologies for effective and efficient computational purposes. It covers the history and development of photonics computing and modern analogue computing platforms and architectures, focusing on optimization tasks and neural network implementations. The authors examine special-purpose optimizers, mathematical descriptions of photonics optimizers, and their various interconnections. Disparate applications are discussed, including direct encoding, logistics, finance, phase retrieval, machine learning, neural networks, probabilistic graphical models, and image processing, among many others. The main directions of technological advancement and associated challenges in photonics computing are explored, along with an assessment of its efficiency. Finally, the paper discusses prospects and the field of optical quantum computing, providing insights into the potential applications of this technology.Comment: Invited submission by Journal of Advanced Quantum Technologies; accepted version 5/06/202

    Energy-efficient architectures for chip-scale networks and memory systems using silicon-photonics technology

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    Today's supercomputers and cloud systems run many data-centric applications such as machine learning, graph algorithms, and cognitive processing, which have large data footprints and complex data access patterns. With computational capacity of large-scale systems projected to rise up to 50GFLOPS/W, the target energy-per-bit budget for data movement is expected to reach as low as 0.1pJ/bit, assuming 200bits/FLOP for data transfers. This tight energy budget impacts the design of both chip-scale networks and main memory systems. Conventional electrical links used in chip-scale networks (0.5-3pJ/bit) and DRAM systems used in main memory (>30pJ/bit) fail to provide sustained performance at low energy budgets. This thesis builds on the promising research on silicon-photonic technology to design system architectures and system management policies for chip-scale networks and main memory systems. The adoption of silicon-photonic links as chip-scale networks, however, is hampered by the high sensitivity of optical devices towards thermal and process variations. These device sensitivities result in high power overheads at high-speed communications. Moreover, applications differ in their resource utilization, resulting in application-specific thermal profiles and bandwidth needs. Similarly, optically-controlled memory systems designed using conventional electrical-based architectures require additional circuitry for electrical-to-optical and optical-to-electrical conversions within memory. These conversions increase the energy and latency per memory access. Due to these issues, chip-scale networks and memory systems designed using silicon-photonics technology leave much of their benefits underutilized. This thesis argues for the need to rearchitect memory systems and redesign network management policies such that they are aware of the application variability and the underlying device characteristics of silicon-photonic technology. We claim that such a cross-layer design enables a high-throughput and energy-efficient unified silicon-photonic link and main memory system. This thesis undertakes the cross-layer design with silicon-photonic technology in two fronts. First, we study the varying network bandwidth requirements across different applications and also within a given application. To address this variability, we develop bandwidth allocation policies that account for application needs and device sensitivities to ensure power-efficient operation of silicon-photonic links. Second, we design a novel architecture of an optically-controlled main memory system that is directly interfaced with silicon-photonic links using a novel read and write access protocol. Such a system ensures low-energy and high-throughput access from the processor to a high-density memory. To further address the diversity in application memory characteristics, we explore heterogeneous memory systems with multiple memory modules that provide varied power-performance benefits. We design a memory management policy for such systems that allocates pages at the granularity of memory objects within an application

    Resource and thermal management in 3D-stacked multi-/many-core systems

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    Continuous semiconductor technology scaling and the rapid increase in computational needs have stimulated the emergence of multi-/many-core processors. While up to hundreds of cores can be placed on a single chip, the performance capacity of the cores cannot be fully exploited due to high latencies of interconnects and memory, high power consumption, and low manufacturing yield in traditional (2D) chips. 3D stacking is an emerging technology that aims to overcome these limitations of 2D designs by stacking processor dies over each other and using through-silicon-vias (TSVs) for on-chip communication, and thus, provides a large amount of on-chip resources and shortens communication latency. These benefits, however, are limited by challenges in high power densities and temperatures. 3D stacking also enables integrating heterogeneous technologies into a single chip. One example of heterogeneous integration is building many-core systems with silicon-photonic network-on-chip (PNoC), which reduces on-chip communication latency significantly and provides higher bandwidth compared to electrical links. However, silicon-photonic links are vulnerable to on-chip thermal and process variations. These variations can be countered by actively tuning the temperatures of optical devices through micro-heaters, but at the cost of substantial power overhead. This thesis claims that unearthing the energy efficiency potential of 3D-stacked systems requires intelligent and application-aware resource management. Specifically, the thesis improves energy efficiency of 3D-stacked systems via three major components of computing systems: cache, memory, and on-chip communication. We analyze characteristics of workloads in computation, memory usage, and communication, and present techniques that leverage these characteristics for energy-efficient computing. This thesis introduces 3D cache resource pooling, a cache design that allows for flexible heterogeneity in cache configuration across a 3D-stacked system and improves cache utilization and system energy efficiency. We also demonstrate the impact of resource pooling on a real prototype 3D system with scratchpad memory. At the main memory level, we claim that utilizing heterogeneous memory modules and memory object level management significantly helps with energy efficiency. This thesis proposes a memory management scheme at a finer granularity: memory object level, and a page allocation policy to leverage the heterogeneity of available memory modules and cater to the diverse memory requirements of workloads. On the on-chip communication side, we introduce an approach to limit the power overhead of PNoC in (3D) many-core systems through cross-layer thermal management. Our proposed thermally-aware workload allocation policies coupled with an adaptive thermal tuning policy minimize the required thermal tuning power for PNoC, and in this way, help broader integration of PNoC. The thesis also introduces techniques in placement and floorplanning of optical devices to reduce optical loss and, thus, laser source power consumption.2018-03-09T00:00:00
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