Experiments and simulations of MEMS thermal sensors for wall shear-stress measurements in aerodynamic control applications

MEMS thermal shear-stress sensors exploit heat-transfer effects to measure the shear stress exerted by an air flow on its solid boundary, and have promising applications in aerodynamic control. Classical theory for conventional, macroscale thermal shear-stress sensors states that the rate of heat removed by the flow from the sensor is proportional to the 1/3-power of the shear stress. However, we have observed that this theory is inconsistent with experimental data from MEMS sensors. This paper seeks to develop an understanding of MEMS thermal shear-stress sensors through a study including both experimental and theoretical investigations. We first obtain experimental data that confirm the inadequacy of the classical theory by wind-tunnel testing of prototype MEMS shear-stress sensors with different dimensions and materials. A theoretical analysis is performed to identify that this inadequacy is due to the lack of a thin thermal boundary layer in the fluid flow at the sensor surface, and then a two-dimensional MEMS shear-stress sensor theory is presented. This theory incorporates important heat-transfer effects that are ignored by the classical theory, and consistently explains the experimental data obtained from prototype MEMS sensors. Moreover, the prototype MEMS sensors are studied with three-dimensional simulations, yielding results that quantitatively agree with experimental data. This work demonstrates that classical assumptions made for conventional thermal devices should be carefully examined for miniature MEMS devices

IC-integrated flexible shear-stress sensor skin

This paper reports the successful development of the first IC-integrated flexible MEMS shear-stress sensor skin. The sensor skin is 1 cm wide, 2 cm long, and 70 /spl mu/m thick. It contains 16 shear-stress sensors, which are arranged in a 1-D array, with on-skin sensor bias, signal-conditioning, and multiplexing circuitry. We further demonstrated the application of the sensor skin by packaging it on a semicylindrical aluminum block and testing it in a subsonic wind tunnel. In our experiment, the sensor skin has successfully identified both the leading-edge flow separation and stagnation points with the on-skin circuitry. The integration of IC with MEMS sensor skin has significantly simplified implementation procedures and improved system reliability

Control of the weakly damped System with the embedded system support

This paper deals with the experimental verification of the importance of embedded systems with an applied MEMS sensor in controlling weakly damped systems. The aim is to suppress actively residual oscillations. The model of a planar physical pendulum with a prismatic joint was chosen for the experiment. The sensor made by MEMS technology, in which three-axis gyroscope and three-axis accelerometer are integrated, has been used for sensing the angle of deflection of the load from the equilibrium position. The simulation model represents the crane arm with a moving carriag

Listening to MEMS: An acoustic vibrometer

new way to characterize vibrating MEMS devices is presented. Using an acoustic particle velocity sensor the coupled sound field is measured, which is a measure for the movement of the MEMS device. We present several possible applications of this measurement method. It can be used as a read-out system for a mass flow sensor, and for characterization of in- and out-of-plane movements of MEMS devices. The method is an interesting alternative to laser scanning vibrometry due to its small size and low complexity; furthermore, it allows the user to `listen' directly to MEMS devices

A parametrized three-dimensional model for MEMS thermal shear-stress sensors

This paper presents an accurate and efficient model of MEMS thermal shear-stress sensors featuring a thin-film hotwire on a vacuum-isolated dielectric diaphragm. We consider three-dimensional (3-D) heat transfer in sensors operating in constant-temperature mode, and describe sensor response with a functional relationship between dimensionless forms of hotwire power and shear stress. This relationship is parametrized by the diaphragm aspect ratio and two additional dimensionless parameters that represent heat conduction in the hotwire and diaphragm. Closed-form correlations are obtained to represent this relationship, yielding a MEMS sensor model that is highly efficient while retaining the accuracy of three-dimensional heat transfer analysis. The model is compared with experimental data, and the agreement in the total and net hotwire power, the latter being a small second-order quantity induced by the applied shear stress, is respectively within 0.5% and 11% when uncertainties in sensor geometry and material properties are taken into account. The model is then used to elucidate thermal boundary layer characteristics for MEMS sensors, and in particular, quantitatively show that the relatively thick thermal boundary layer renders classical shear-stress sensor theory invalid for MEMS sensors operating in air. The model is also used to systematically study the effects of geometry and material properties on MEMS sensor behavior, yielding insights useful as practical design guidelines

Exploratory Research on MEMS Technology for Air-Conditioning and Heat-Pumps

This report details the efforts to exploit micro-electrical-mechanical-systems (MEMS) and micro device technologies to improve control of multi-channel evaporators by reducing maldistribution among channels, and increase capacity and efficiency of current vapor-compression refrigeration chillers and heat-pumps. Besides summarizing the market potential of MEMS technology for use in evaporators and micro-heat-pumps, the report describes the accomplishments of an experimental investigation of refrigerant-side maldistribution in multi-channel plate heat exchangers (PHE's). A special test facility designed for the purpose of studying the maldistribution of refrigerant in evaporators is described in the report. The facility allows maldistribution caused by either normal superheat temperature control, or induced by the user in controlled amounts, to be measured and quantified. Four different techniques were used to detect the presence of liquid droplets in the stream of superheated vapor at the evaporator exit, an indication of maldistributed flow. They are: Helium-Neon laser, beaded thermocouple, static mixer and newly designed heated MEMS sensor. Comparison of the four techniques shows that the MEMS sensor designed and fabricated in this project has the highest potential for indicating maldistribution, manifested by entrained liquid droplets, in multi-channel evaporators. A complete set of test results in the time and frequency domain is show in graphical form in the appendices. The design, fabrication, calibration, and testing of the MEMS serpentine resistance sensor is also reported, along with a control scheme and strategy for implementing the MEMS sensor in multi-channel evaporator systems

Study of a MEMS-based Shack-Hartmann wavefront sensor with adjustable pupil sampling for astronomical adaptive optics

We introduce a Shack-Hartmann wavefront sensor for adaptive optics that enables dynamic control of the spatial sampling of an incoming wavefront using a segmented mirror microelectrical mechanical systems (MEMS) device. Unlike a conventional lenslet array, subapertures are defined by either segments or groups of segments of a mirror array, with the ability to change spatial pupil sampling arbitrarily by redefining the segment grouping. Control over the spatial sampling of the wavefront allows for the minimization of wavefront reconstruction error for different intensities of guide source and different atmospheric conditions, which in turn maximizes an adaptive optics system's delivered Strehl ratio. Requirements for the MEMS devices needed in this Shack-Hartmann wavefront sensor are also presented

MEMS flow sensors for nano-fluidic applications

This paper presents micromachined thermal sensors for measuring liquid flow rates in the nanoliter-per-minute range. The sensors use a boron-doped polysilicon thinfilm heater that is embedded in the silicon nitride wall of a microchannel. The boron doping is chosen to increase the heater’s temperature coefficient of resistance within tolerable noise limits, and the microchannel is suspended from the substrate to improve thermal isolation. The sensors have demonstrated a flow rate resolution below 10 nL/min, as well as the capability for detecting micro bubbles in the liquid. Heat transfer simulation has also been performed to explain the sensor operation and yielded good agreement with experimental data