200 research outputs found
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Cross-Layer Pathfinding for Off-Chip Interconnects
Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects
A Survey of Prediction and Classification Techniques in Multicore Processor Systems
In multicore processor systems, being able to accurately predict the future provides new optimization opportunities, which otherwise could not be exploited. For example, an oracle able to predict a certain application\u27s behavior running on a smart phone could direct the power manager to switch to appropriate dynamic voltage and frequency scaling modes that would guarantee minimum levels of desired performance while saving energy consumption and thereby prolonging battery life. Using predictions enables systems to become proactive rather than continue to operate in a reactive manner. This prediction-based proactive approach has become increasingly popular in the design and optimization of integrated circuits and of multicore processor systems. Prediction transforms from simple forecasting to sophisticated machine learning based prediction and classification that learns from existing data, employs data mining, and predicts future behavior. This can be exploited by novel optimization techniques that can span across all layers of the computing stack. In this survey paper, we present a discussion of the most popular techniques on prediction and classification in the general context of computing systems with emphasis on multicore processors. The paper is far from comprehensive, but, it will help the reader interested in employing prediction in optimization of multicore processor systems
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On thermal sensor calibration and software techniques for many-core thermal management
The high power density of a many-core processor results in increased temperature which negatively impacts system reliability and performance. Dynamic thermal management applies thermal-aware techniques at run time to avoid overheating using temperature information collected from on-chip thermal sensors. Temperature sensing and thermal control schemes are two critical technologies for successfully maintaining thermal safety. In this dissertation, on-line thermal sensor calibration schemes are developed to provide accurate temperature information.
Software-based dynamic thermal management techniques are proposed using calibrated thermal sensors. Due to process variation and silicon aging, on-chip thermal sensors require periodic calibration before use in DTM. However, the calibration cost for thermal sensors can be prohibitively high as the number of on-chip sensors increases. Linear models which are suitable for on-line calculation are employed to estimate temperatures at multiple sensor locations using performance counters. The estimated temperature and the actual sensor thermal profile show a very high similarity with correlation coefficient ~0.9 for SPLASH2 and SPEC2000 benchmarks.
A calibration approach is proposed to combine potentially inaccurate temperature values obtained from two sources: thermal sensor readings and temperature estimations. A data fusion strategy based on Bayesian inference, which combines information from these two sources, is demonstrated. The result shows the strategy can effectively recalibrate sensor readings in response to inaccuracies caused by process variation and environmental noise. The average absolute error of the corrected sensor temperature readings is
A dynamic task allocation strategy is proposed to address localized overheating in many-core systems. Our approach employs reinforcement learning, a dynamic machine learning algorithm that performs task allocation based on current temperatures and a prediction regarding which assignment will minimize the peak temperature. Our results show that the proposed technique is fast (scheduling performed in \u3c1 \u3ems) and can efficiently reduce peak temperature by up to 8 degree C in a 49-core processor (6% on average) versus a leading competing task allocation approach for a series of SPLASH-2 benchmarks. Reinforcement learning has also been applied to 3D integrated circuits to allocate tasks with thermal awareness
Understanding multidimensional verification: Where functional meets non-functional
Abstract Advancements in electronic systems' design have a notable impact on design verification technologies. The recent paradigms of Internet-of-Things (IoT) and Cyber-Physical Systems (CPS) assume devices immersed in physical environments, significantly constrained in resources and expected to provide levels of security, privacy, reliability, performance and low-power features. In recent years, numerous extra-functional aspects of electronic systems were brought to the front and imply verification of hardware design models in multidimensional space along with the functional concerns of the target system. However, different from the software domain such a holistic approach remains underdeveloped. The contributions of this paper are a taxonomy for multidimensional hardware verification aspects, a state-of-the-art survey of related research works and trends enabling the multidimensional verification concept. Further, an initial approach to perform multidimensional verification based on machine learning techniques is evaluated. The importance and challenge of performing multidimensional verification is illustrated by an example case study
Predictive Reliability and Fault Management in Exascale Systems: State of the Art and Perspectives
© ACM, 2020. This is the author's version of the work. It is posted here by permission of ACM for your personal use. Not for redistribution. The definitive version was published in ACM Computing Surveys, Vol. 53, No. 5, Article 95. Publication date: September 2020. https://doi.org/10.1145/3403956[EN] Performance and power constraints come together with Complementary Metal Oxide Semiconductor technology scaling in future Exascale systems. Technology scaling makes each individual transistor more prone to faults and, due to the exponential increase in the number of devices per chip, to higher system fault rates. Consequently, High-performance Computing (HPC) systems need to integrate prediction, detection, and recovery mechanisms to cope with faults efficiently. This article reviews fault detection, fault prediction, and recovery techniques in HPC systems, from electronics to system level. We analyze their strengths and limitations. Finally, we identify the promising paths to meet the reliability levels of Exascale systems.This work has received funding from the European Union's Horizon 2020 (H2020) research and innovation program under the FET-HPC Grant Agreement No. 801137 (RECIPE). Jaume Abella was also partially supported by the Ministry of Economy and Competitiveness of Spain under Contract No. TIN2015-65316-P and under Ramon y Cajal Postdoctoral Fellowship No. RYC-2013-14717, as well as by the HiPEAC Network of Excellence. Ramon Canal is partially supported by the Generalitat de Catalunya under Contract No. 2017SGR0962.Canal, R.; Hernández Luz, C.; Tornero-Gavilá, R.; Cilardo, A.; Massari, G.; Reghenzani, F.; Fornaciari, W.... (2020). Predictive Reliability and Fault Management in Exascale Systems: State of the Art and Perspectives. ACM Computing Surveys. 53(5):1-32. https://doi.org/10.1145/3403956S132535Abella, J., Hernandez, C., Quinones, E., Cazorla, F. J., Conmy, P. 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DESIGN METHODOLOGIES FOR RELIABLE AND ENERGY-EFFICIENT MULTIPROCESSOR SYSTEM
Ph.DDOCTOR OF PHILOSOPH
Dynamically Reconfigurable Systolic Array Accelerators: A Case Study with Extended Kalman Filter and Discrete Wavelet Transform Algorithms
Field programmable grid arrays (FPGA) are increasingly being adopted as the primary on-board computing system for autonomous deep space vehicles. There is a need to support several complex applications for navigation and image processing in a rapidly responsive on-board FPGA-based computer. This requires exploring and combining several design concepts such as systolic arrays, hardware-software partitioning, and partial dynamic reconfiguration. A microprocessor/co-processor design that can accelerate two single precision oating-point algorithms, extended Kalman lter and a discrete wavelet transform, is presented. This research makes three key contributions. (i) A polymorphic systolic array framework comprising of recofigurable partial region-based sockets to accelerate algorithms amenable to being mapped onto linear systolic arrays. When implemented on a low end Xilinx Virtex4 SX35 FPGA the design provides a speedup of at least 4.18x and 6.61x over a state of the art microprocessor used in spacecraft systems for the extended Kalman lter and discrete wavelet transform algorithms, respectively. (ii) Switchboxes to enable communication between static and partial reconfigurable regions and a simple protocol to enable schedule changes when a socket\u27s contents are dynamically reconfigured to alter the concurrency of the participating systolic arrays. (iii) A hybrid partial dynamic reconfiguration method that combines Xilinx early access partial reconfiguration, on-chip bitstream decompression, and bitstream relocation to enable fast scaling of systolic arrays on the PolySAF. This technique provided a 2.7x improvement in reconfiguration time compared to an o-chip partial reconfiguration technique that used a Flash card on the FPGA board, and a 44% improvement in BRAM usage compared to not using compression
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