Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

Design synthesis for dynamically reconfigurable logic systems

Dynamic reconfiguration of logic circuits has been a research problem for over four decades. While applications using logic reconfiguration in practical scenarios have been demonstrated, the design of these systems has proved to be a difficult process demanding the skills of an experienced reconfigurable logic design expert. This thesis proposes an automatic synthesis method which relieves designers of some of the difficulties associated with designing partially dynamically reconfigurable systems. A new design abstraction model for reconfigurable systems is proposed in order to support design exploration using the presented method. Given an input behavioural model, a technology server and a set of design constraints, the method will generate a reconfigurable design solution in the form of a 3D floorplan and a configuration schedule. The approach makes use of genetic algorithms. It facilitates global optimisation to accommodate multiple design objectives common in reconfigurable system design, while making realistic estimates of configuration overheads and of the potential for resource sharing between configurations. A set of custom evolutionary operators has been developed to cope with a multiple-objective search space. Furthermore, the application of a simulation technique verifying the lll results of such an automatic exploration is outlined in the thesis. The qualities of the proposed method are evaluated using a set of benchmark designs taking data from a real reconfigurable logic technology. Finally, some extensions to the proposed method and possible research directions are discussed

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Processor-In-Memory (PIM) Based Architectures for PetaFlops Potential Massively Parallel Processing

The report summarizes the work performed at the University of Notre Dame under a NASA grant from July 15, 1995 through July 14, 1996. Researchers involved in the work included the PI, Dr. Peter M. Kogge, and three graduate students under his direction in the Computer Science and Engineering Department: Stephen Dartt, Costin Iancu, and Lakshmi Narayanaswany. The organization of this report is as follows. Section 2 is a summary of the problem addressed by this work. Section 3 is a summary of the project's objectives and approach. Section 4 summarizes PIM technology briefly. Section 5 overviews the main results of the work. Section 6 then discusses the importance of the results and future directions. Also attached to this report are copies of several technical reports and publications whose contents directly reflect results developed during this study

Methodologies and Toolflows for the Predictable Design of Reliable and Low-Power NoCs

There is today the unmistakable need to evolve design methodologies and tool ows for Network-on-Chip based embedded systems. In particular, the quest for low-power requirements is nowadays a more-than-ever urgent dilemma. Modern circuits feature billion of transistors, and neither power management techniques nor batteries capacity are able to endure the increasingly higher integration capability of digital devices. Besides, power concerns come together with modern nanoscale silicon technology design issues. On one hand, system failure rates are expected to increase exponentially at every technology node when integrated circuit wear-out failure mechanisms are not compensated for. However, error detection and/or correction mechanisms have a non-negligible impact on the network power. On the other hand, to meet the stringent time-to-market deadlines, the design cycle of such a distributed and heterogeneous architecture must not be prolonged by unnecessary design iterations. Overall, there is a clear need to better discriminate reliability strategies and interconnect topology solutions upfront, by ranking designs based on power metric. In this thesis, we tackle this challenge by proposing power-aware design technologies. Finally, we take into account the most aggressive and disruptive methodology for embedded systems with ultra-low power constraints, by migrating NoC basic building blocks to asynchronous (or clockless) design style. We deal with this challenge delivering a standard cell design methodology and mainstream CAD tool ows, in this way partially relaxing the requirement of using asynchronous blocks only as hard macros

ENERGY-AWARE OPTIMIZATION FOR EMBEDDED SYSTEMS WITH CHIP MULTIPROCESSOR AND PHASE-CHANGE MEMORY

Over the last two decades, functions of the embedded systems have evolved from simple real-time control and monitoring to more complicated services. Embedded systems equipped with powerful chips can provide the performance that computationally demanding information processing applications need. However, due to the power issue, the easy way to gain increasing performance by scaling up chip frequencies is no longer feasible. Recently, low-power architecture designs have been the main trend in embedded system designs. In this dissertation, we present our approaches to attack the energy-related issues in embedded system designs, such as thermal issues in the 3D chip multiprocessor (CMP), the endurance issue in the phase-change memory(PCM), the battery issue in the embedded system designs, the impact of inaccurate information in embedded system, and the cloud computing to move the workload to remote cloud computing facilities. We propose a real-time constrained task scheduling method to reduce peak temperature on a 3D CMP, including an online 3D CMP temperature prediction model and a set of algorithm for scheduling tasks to different cores in order to minimize the peak temperature on chip. To address the challenging issues in applying PCM in embedded systems, we propose a PCM main memory optimization mechanism through the utilization of the scratch pad memory (SPM). Furthermore, we propose an MLC/SLC configuration optimization algorithm to enhance the efficiency of the hybrid DRAM + PCM memory. We also propose an energy-aware task scheduling algorithm for parallel computing in mobile systems powered by batteries. When scheduling tasks in embedded systems, we make the scheduling decisions based on information, such as estimated execution time of tasks. Therefore, we design an evaluation method for impacts of inaccurate information on the resource allocation in embedded systems. Finally, in order to move workload from embedded systems to remote cloud computing facility, we present a resource optimization mechanism in heterogeneous federated multi-cloud systems. And we also propose two online dynamic algorithms for resource allocation and task scheduling. We consider the resource contention in the task scheduling

Design, Extraction, and Optimization Tool Flows and Methodologies for Homogeneous and Heterogeneous Multi-Chip 2.5D Systems

Chip and packaging industries are making significant progress in 2.5D design as a result of increasing popularity of their application. In advanced high-density 2.5D packages, package redistribution layers become similar to chip Back-End-of-Line routing layers, and the gap between them scales down with pin density improvement. Chiplet-package interactions become significant and severely affect system performance and reliability. Moreover, 2.5D integration offers opportunities to apply novel design techniques. The traditional die-by-die design approach neither carefully considers these interactions nor fully exploits the cross-boundary design opportunities. This thesis presents chiplet-package cross-boundary design, extraction, analysis, and optimization tool flows and methodologies for high-density 2.5D packaging technologies. A holistic flow is presented that can capture all parasitics from chiplets and the package and improve system performance through iterative optimizations. Several design techniques are demonstrated for agile development and quick turn-around time. To validate the flow in silicon, a chip was taped out and studied in TSMC 65nm technology. As the holistic flow cannot handle heterogeneous technologies, in-context flows are presented. Three different flavors of the in-context flow are presented, which offer trade-offs between scalability and accuracy in heterogeneous 2.5D system designs. Inductance is an inseparable part of a package design. A holistic flow is presented that takes package inductance into account in timing analysis and optimization steps. Custom CAD tools are developed to make these flows compatible with the industry standard tools and the foundry model. To prove the effectiveness of the flows several design cases of an ARM Cortex-M0 are implemented for comparitive study

Design and application of reconfigurable circuits and systems

Open Acces

High Level Synthesis for Packet Processing Pipelines

Packet processing is an essential function of state-of-the-art network routers and switches. Implementing packet processors in pipelined architectures is a well-known, established technique, albeit different approaches have been proposed. The design of packet processing pipelines is a delicate trade-off between the desire for abstract specifications, short development time, and design maintainability on one hand and very aggressive performance requirements on the other. This thesis proposes a coherent design flow for packet processing pipelines. Like the design process itself, I start by introducing a novel domain-specific language that provides a high-level specification of the pipeline. Next, I address synthesizing this model and calculating its worst-case throughput. Finally, I address some specific circuit optimization issues. I claim, based on experimental results, that my proposed technique can dramatically improve the design process of these pipelines, while the resulting performance matches the expectations of hand-crafted design. The considered pipelines exhibit a pseudo-linear topology, which can be too restrictive in the general case. However, especially due to its high performance, such an architecture may be suitable for applications outside packet processing, in which case some of my proposed techniques could be easily adapted. Since I ran my experiments on FPGAs, this work has an inherent bias towards that technology; however, most results are technology-independent