Device modelling for bendable piezoelectric FET-based touch sensing system

Flexible electronics is rapidly evolving towards devices and circuits to enable numerous new applications. The high-performance, in terms of response speed, uniformity and reliability, remains a sticking point. The potential solutions for high-performance related challenges bring us back to the timetested silicon based electronics. However, the changes in the response of silicon based devices due to bending related stresses is a concern, especially because there are no suitable models to predict this behavior. This also makes the circuit design a difficult task. This paper reports advances in this direction, through our research on bendable Piezoelectric Oxide Semiconductor Field Effect Transistor (POSFET) based touch sensors. The analytical model of POSFET, complimented with Verilog-A model, is presented to describe the device behavior under normal force in planar and stressed conditions. Further, dynamic readout circuit compensation of POSFET devices have been analyzed and compared with similar arrangement to reduce the piezoresistive effect under tensile and compressive stresses. This approach introduces a first step towards the systematic modeling of stress induced changes in device response. This systematic study will help realize high-performance bendable microsystems with integrated sensors and readout circuitry on ultra-thin chips (UTCs) needed in various applications, in particular, the electronic skin (e-skin)

Ultra conformable and multimodal tactile sensors based on organic field-effect transistors

Cognitive psychology is the branch of psychology related to all the processes by which sensory input is transformed, processed and used. Academic and industrial research has always invested time and resources to develop devices capable to simulate the behavior of the organs where the perceptions are located. In recent years, in fact, there have been numerous discoveries related to new materials, and new devices, capable of reproducing, in a reliable manner, the sensory behavior of humans. Particular interest in scientific research has been aimed at understanding and reproducing of man's tactile sensations. It is known that, through the receptors of the skin, it is possible to detect sensations such as pain, changes in pressure and/or temperature. The development of tactile sensor technology had a significant increase in the last years of 1970s, thanks to the important surveys of Stojiljkovic, Harmon and Lumelsky who presented the firsts prototype of sensors for artificial skin applications, and summarized the main characteristics and requirements of tactile sensors. Recently, organic electronics has been deeply investigated as technology for the fabrication of tactile sensors using biocompatible materials, which can be deposited and processed on ultra flexible and ultra conformable substrates. In general, the most attractive property of these materials is mainly related to their high mechanical flexibility, which is mandatory for artificial skin applications. The main object of this PhD research activity was the development and optimization of an innovative technology for the realization of physical sensors able to detect pressure and temperature variations, which can be applied in the field of biomedical engineering and biorobotics. By exploiting the particular characteristics of the employed materials, such as mechanical flexibility, the proposed sensors are very suitable to be integrated with flexible structures (for example plastics) as a pressure and temperature sensor, and therefore, ideal for the realization of an artificial skin like. In Chapter 1, the basics of humans somatosensory system will be introduced: after a brief description of tactile thermoreceptors, mechanoreceptors and nociceptors, a definition of electronic skin and its characteristics will be provided. In Chapter 2, a wide analysis of the state of the art will be reported. Several and different examples of tactile sensor (in inorganic and organic technology) will be presented, underlining advantages and disadvantages for each approach. In Chapter 3, the firsts experimental results, obtained in the first part of my PhD program, will be presented. All the steps of the fabrication process of the devices will be described, as well as the measurement setup used for the electrical characterization of the sensors. In Chapter 4, the sensor structure optimization will be presented. It will be demonstrated how the presented devices are able to sense simultaneously thermal and mechanical stimuli. Moreover, it will be demonstrated that, thanks to an alternative and innovative fabrication process, the sensors can be transferred directly on skin, thus proving the suitability of the proposed sensor architecture for tactile applications

3D printed neuromorphic sensing systems

Thanks to the high energy efficiency, neuromorphic devices are spotlighted recently by mimicking the calculation principle of the human brain through the parallel computation and the memory function. Various bio-inspired \u27in-memory computing\u27 (IMC) devices were developed during the past decades, such as synaptic transistors for artificial synapses. By integrating with specific sensors, neuromorphic sensing systems are achievable with the bio-inspired signal perception function. A signal perception process is possible by a combination of stimuli sensing, signal conversion/transmission, and signal processing. However, most neuromorphic sensing systems were demonstrated without signal conversion/transmission functions. Therefore, those cannot fully mimic the function provides by the sensory neuron in the biological system. This thesis aims to design a neuromorphic sensing system with a complete function as biological sensory neurons. To reach such a target, 3D printed sensors, electrical oscillators, and synaptic transistors were developed as functions of artificial receptors, artificial neurons, and artificial synapses, respectively. Moreover, since the 3D printing technology has demonstrated a facile process due to fast prototyping, the proposed 3D neuromorphic sensing system was designed as a 3D integrated structure and fabricated by 3D printing technologies. A novel multi-axis robot 3D printing system was also utilized to increase the fabrication efficiency with the capability of printing on vertical and tilted surfaces seamlessly. Furthermore, the developed 3D neuromorphic system was easily adapted to the application of tactile sensing. A portable neuromorphic system was integrated with a tactile sensing system for the intelligent tactile sensing application of the humanoid robot. Finally, the bio-inspired reflex arc for the unconscious response was also demonstrated by training the neuromorphic tactile sensing system

Organic and CMOS biosensors for detection of telomerase expression

Organic and CMOS biosensors for detection of telomerase expressio

Tactile sensing chips with POSFET array and integrated interface electronics

This work presents the advanced version of novel POSFET (Piezoelectric Oxide Semiconductor Field Effect Transistor) devices based tactile sensing chip. The new version of the tactile sensing chip presented here comprises of a 4 x 4 array of POSFET touch sensing devices and integrated interface electronics (i.e. multiplexers, high compliance current sinks and voltage output buffers). The chip also includes four temperature diodes for the measurement of contact temperature. Various components on the chip have been characterized systematically and the overall operation of the tactile sensing system has been evaluated. With new design the POSFET devices have improved performance (i.e. linear response in the dynamic contact forces range of 0.01–3N and sensitivity (without amplification) of 102.4 mV/N), which is more than twice the performance of their previous implementations. The integrated interface electronics result in reduced interconnections which otherwise would be needed to connect the POSFET array with off-chip interface electronic circuitry. This research paves the way for CMOS (Complementary Metal Oxide Semiconductor) implementation of full on-chip tactile sensing systems based on POSFETs

A spiking and adapting tactile sensor for neuromorphic applications

The ongoing research on and development of increasingly intelligent artificial systems propels the need for bio inspired pressure sensitive spiking circuits. Here we present an adapting and spiking tactile sensor, based on a neuronal model and a piezoelectric field-effect transistor (PiezoFET). The piezoelectric sensor device consists of a metal-oxide semiconductor field-effect transistor comprising a piezoelectric aluminium-scandium-nitride (AlxSc1-xN) layer inside of the gate stack. The so augmented device is sensitive to mechanical stress. In combination with an analogue circuit, this sensor unit is capable of encoding the mechanical quantity into a series of spikes with an ongoing adaptation of the output frequency. This allows for a broad application in the context of robotic and neuromorphic systems, since it enables said systems to receive information from the surrounding environment and provide encoded spike trains for neuromorphic hardware. We present numerical and experimental results on this spiking and adapting tactile sensor

Device Modelling of Silicon Based High-Performance Flexible Electronics

The area of flexible electronics is rapidly expanding and evolving. With applications requiring high speed and performance, ultra-thin silicon-based electronics has shown its prominence. However, the change in device response upon bending is a major concern. In absence of suitable analytical and design tool friendly model, the behavior under bent condition is hard to predict. This poses challenges to circuit designer working in the bendable electronics field, in laying out a design that can give a precise response in a stressed condition. This paper presents advances in this direction and investigates the effect of compressive and tensile stress on the performance of NMOS and PMOS transistor and a touch sensor comprising a transistor and piezoelectric capacitor