메쉬 기반의 클락 네트워크 설계 방법론

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2015. 2. 김태환.The clock distribution network in a synchronous digital circuit delivers a clock signal to every storage element i.e., clock sink in the circuit. However, since the continued technology scaling increases PVT (process-voltage-temperature) variation, the increase of clock skew variation is highly likely to cause performance degradation or system failure at run time. Recently, to mitigate the clock skew variation, many researchers have taken a profound interest in the clock mesh network. However, though the structure of clock mesh network is excellent in tolerating timing variation, it demands significantly high power consumption due to the use of excessive mesh wire and buffer resources. Thus, optimizing the resources required in the mesh clock synthesis while maintaining the variation tolerance is crucially important. The three major tasks that greatly affect the cost of resulting clock mesh are (1) mesh segment allocation, (2) mesh buffer allocation and sizing, and (3) clock sink binding to mesh segments. Previous clock mesh optimization approaches solve the three tasks sequentially, one by one at a time, to manage the run time complexity of the tasks at the expense of losing the quality of results. However, since the three tasks are tightly inter-related, simultaneously optimizing all three tasks is essential, if the run time is ever permitted, to synthesize an economical clock mesh network. In this dissertation, we propose an approach which is able to tackle the problem in an integrated fashion by combining the three tasks into an iterative framework of incremental updates and solving them simultaneously to find a globally optimal allocation of mesh resources while taking into account the clock skew tolerance constraints. The core parts of this dissertation are a precise analysis on the relation among the resource optimization tasks and an establishment of mechanism for effective and efficient integration of the tasks. In particular, to handle the run time problem, we propose a set of speed-up techniques i.e., modeling RC circuit for eliminating redundant matrix multiplications, exploiting sliding window scheme, and fast buffer sizing effect estimation, which are fitted into our context of fast clock skew estimation in mesh resource optimization as well as an invention of early decision policies. In summary, this dissertation presents the efficient design methodology for clock mesh synthesis with consideration on integration of three tasks and reduction of runtime complexity.Abstract i Contents iii List of Figures vi List of Tables x 1 Introduction 1 1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 Contributions of This Dissertation . . . . . . . . . . . . . . . . . . . 3 2 Background 5 2.1 Clock Distribution Network . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Clock Network Topologies . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 Design Metrics of Clock Network . . . . . . . . . . . . . . . . . . . 7 2.4 The Effects of Variations on Clock Skew . . . . . . . . . . . . . . . . 9 3 Clock Mesh Synthesis Flow 12 3.1 Elements of Clock Mesh . . . . . . . . . . . . . . . . . . . . . . . . 12 3.2 Conventional Clock Mesh Synthesis Overview . . . . . . . . . . . . . 13 3.3 Initial Grid Generation . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.4 Mesh Buffer Placement and Sizing . . . . . . . . . . . . . . . . . . . 14 3.5 Clock Mesh Optimization . . . . . . . . . . . . . . . . . . . . . . . . 17 4 Integrated Resource Allocation and Binding in Clock Mesh Synthesis 19 4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.2 Observations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.3 Framework of Clock Mesh Optimization . . . . . . . . . . . . . . . . 26 4.3.1 Incremental Resource Updates . . . . . . . . . . . . . . . . . 29 4.3.2 Constraints for Variation Tolerance . . . . . . . . . . . . . . 34 4.3.3 Early Decision Policies . . . . . . . . . . . . . . . . . . . . . 38 4.3.4 Time Complexity Analysis . . . . . . . . . . . . . . . . . . . 39 4.4 Fast Clock Skew Estimation Techniques . . . . . . . . . . . . . . . . 40 4.4.1 Partially Reusing Matrix Multiplication for Incremental Updates 41 4.4.2 Adopting Sliding Window Scheme . . . . . . . . . . . . . . . 43 4.4.3 Adjusting Delay Caused by Buffer Resizing . . . . . . . . . . 44 4.5 Experimental Results . . . . . . . . . . . . . . . . . . . . . . . . . . 46 4.5.1 Experimental Environments . . . . . . . . . . . . . . . . . . 46 4.5.2 Resource Requirement and Variation Tolerance Comparison . 48 4.5.3 Comparison with Clock Mesh Optimization using Worst Case Timing Analysis of Commercial Tool . . . . . . . . . . . . . 56 4.5.4 Analysis of the Effect of Proposed Techniques . . . . . . . . 58 4.5.5 Run Time Analysis . . . . . . . . . . . . . . . . . . . . . . . 61 4.5.6 Accuracy and Run Time of Fast Clock Skew Estimation . . . 63 4.5.7 Electromigration Analysis . . . . . . . . . . . . . . . . . . . 68 4.5.8 Run-time Analysis in Multi-thread Computing Environment . 70 4.6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 5 Conclusion 74 Abstract in Korean 84Docto

Fault modeling, delay evaluation and path selection for delay test under process variation in nano-scale VLSI circuits

Delay test in nano-scale VLSI circuits becomes more difficult with shrinking technology feature sizes and rising clock frequencies. In this dissertation, we study three challenging issues in delay test: fault modeling, variational delay evaluation and path selection under process variation. Previous research of fault modeling on resistive spot defects, such as resistive opens and bridges in the interconnect, and resistive shorts in devices, lacked an accurate fault model. As a result it was difficult to perform fault simulation and select the best vectors. Conventional methods to compute variational delay under process variation are either slow or inaccurate. On the problem of path selection under process variation, previous approaches either choose too many paths, or missed the path that is necessary to be tested. We present new solutions in this dissertation. A new fault model that clearly and comprehensively expresses the relationship between electrical behaviors and resistive spots is proposed. Then the effect of process variations on path delays is modeled with a linear function and a fast method to compute coefficients of the linear function is also derived. Finally, we present the new path pruning algorithms that efficiently prune unimportant paths for test, and as a result we select as few as possible paths for test while the fault coverage is satisfied. The experimental results show that the new solutions are efficient and accurate

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated separately. In addition, these dies can be fabricated in different technologies. The effect of different sources of variations on 3-D circuits, consequently, differ from 2-D ICs. As technology scales, these variations significantly affect the performance of circuits. Therefore, it is increasingly important to accurately and efficiently model different sources of variations in 3-D ICs. The process, voltage, and temperature variations in 3-D ICs are investigated in this dissertation. Related modeling and design techniques are proposed to design a robust 3-D IC. Process variations in 3-D ICs are first analyzed. The effect of process variations on synchronization and 3-D clock distribution networks, is carefully studied. A novel statistical model is proposed to describe the timing variation in 3-D clock distribution networks caused by process variations. Based on this model, different topologies of 3-D clock distribution networks are compared in terms of skew variation. A set of guidelines is proposed to design 3-D clock distribution networks with low clock uncertainty. Voltage variations are described by power supply noise. Power supply noise in 3-D ICs is investigated considering different characteristics of potential 3-D power grids in this thesis. A new algorithm is developed to fast analyze the steady-state IR-drop in 3-D power grids. The first droop of power supply noise, also called resonant supply noise, is usually the deepest voltage drop in power distribution networks. The effect of resonant supply noise on 3-D clock distribution networks is investigated. The combined effect of process variations and power supply noise is modeled by skitter consisting of both skew and jitter. A novel statistical model of skitter is proposed. Based on this proposed model and simulation results, a set of guidelines has been proposed to mitigate the negative effect of process and voltage variations on 3-D clock distribution networks. Thermal issues in 3-D ICs are considered by carefully modeling thermal through silicon vias (TTSVs) in this dissertation. TTSVs are vertical vias which do not carry signals, dedicated to facilitate the propagation of heat to reduce the temperature of 3-D ICs. Two analytic models are proposed to describe the heat transfer in 3-D circuits related to TTSVs herein, providing proper closed-form expressions for the thermal resistance of the TTSVs. The effect of different physical and geometric parameters of TTSVs on the temperature of 3-D ICs is analyzed. The proposed models can be used to fast and accurately estimate the temperature to avoid the overuse of TTSVs occupying a large portion of area. A set of models and design techniques is proposed in this dissertation to describe and mitigate the deleterious effects of process, voltage, and temperature variations in 3-D ICs. Due to the continuous shrink in the feature size of transistors, the large number of devices within one circuit, and the high operating frequency, the effect of these variations on the performance of 3-D ICs becomes increasingly significant. Accurately and efficiently estimating and controlling these variations are, consequently, critical tasks for the design of 3-D ICs