A novel approach for quality control system using sensor fusion of infrared and visual image processing for laser sealing of food containers

This paper presents a new mechatronic approach of using infrared thermography combined with image processing for the quality control of a laser sealing process for food containers. The suggested approach uses an on-line infrared system to assess the heat distribution within the container seal in order to guarantee the integrity of the process. Visual image processing is then used for quality assurance to guarantee optimum sealing. The results described in this paper show examples of the capability of the condition monitoring system to detect faults in the sealing process. The results found indicate that the suggested approach could form an effective quality control and assurance system

Thermosonic flip chip interconnection using electroplated copper column arrays

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Meteoroid and debris special investigation group data acquisition procedures

The entire LDEF spacecraft was examined by M&D SIG for impact (i.e., craters greater than or = 0.5 mm and penetrations greater than or = 0.3 mm in diameter) and related features (e.g., debris, secondaries). During the various detailed surveys conducted at NASA Kennedy, approx. 5,000 impact related features were photodocumented, and their locations measured and recorded; an additional approx. 30,000 smaller features were counted. The equipment and techniques used by the M&D SIG permitted the determination and recording of the locations and diameters of the 5,000 imaged features. A variety of experimental and LDEF structural hardware was acquired by the M&D SIG and is presently being examined and curated at NASA Johnson

Thin-film quantum dot photodiode for monolithic infrared image sensors

Imaging in the infrared wavelength range has been fundamental in scientific, military and surveillance applications. Currently, it is a crucial enabler of new industries such as autonomous mobility (for obstacle detection), augmented reality (for eye tracking) and biometrics. Ubiquitous deployment of infrared cameras (on a scale similar to visible cameras) is however prevented by high manufacturing cost and low resolution related to the need of using image sensors based on flip-chip hybridization. One way to enable monolithic integration is by replacing expensive, small-scale III-V-based detector chips with narrow bandgap thin-films compatible with 8- and 12-inch full-wafer processing. This work describes a CMOS-compatible pixel stack based on lead sulfide quantum dots (PbS QD) with tunable absorption peak. Photodiode with a 150-nm thick absorber in an inverted architecture shows dark current of 10(-6) A/cm(2) at 2 V reverse bias and EQE above 20% at 1440 nm wavelength. Optical modeling for top illumination architecture can improve the contact transparency to 70%. Additional cooling (193 K) can improve the sensitivity to 60 dB. This stack can be integrated on a CMOS ROIC, enabling order-of-magnitude cost reduction for infrared sensors

Feasibility study of silicon nitride protection of plastic encapsulated semiconductors

The application of low temperature silicon nitride protective layers on wire bonded integrated circuits mounted on lead frame assemblies is reported. An evaluation of the mechanical and electrical compatibility of both plasma nitride and photochemical silicon nitride (photonitride) passivations (parallel evaluations) of integrated circuits which were then encapsulated in plastic is described. Photonitride passivation is compatible with all wire bonded lead frame assemblies, with or without initial chip passivation. Plasma nitride passivation of lead frame assemblies is possible only if the chip is passivated before lead frame assembly. The survival rate after the environmental test sequence of devices with a coating of plasma nitride on the chip and a coating of either plasma nitride or photonitride over the assembled device is significantly greater than that of devices assembled with no nitride protective coating over either chip or lead frame

High and low threshold P-channel metal oxide semiconductor process and description of microelectronics facility

The fabrication techniques and detail procedures for creating P-channel Metal-Oxide-Semiconductor (P-MOS) integrated circuits at George C. Marshall Space Flight Center (MSFC) are described. Examples of P-MOS integrated circuits fabricated at MSFC together with functional descriptions of each are given. Typical electrical characteristics of high and low threshold P-MOS discrete devices under given conditions are provided. A general description of MSFC design, mask making, packaging, and testing procedures is included. The capabilities described in this report are being utilized in: (1) research and development of new technology, (2) education of individuals in the various disciplines and technologies of the field of microelectronics, and (3) fabrication of many types of specially designed integrated circuits which are not commercially feasible in small quantities for in-house research and development programs

Micro-manufacturing : research, technology outcomes and development issues

Besides continuing effort in developing MEMS-based manufacturing techniques, latest effort in Micro-manufacturing is also in Non-MEMS-based manufacturing. Research and technological development (RTD) in this field is encouraged by the increased demand on micro-components as well as promised development in the scaling down of the traditional macro-manufacturing processes for micro-length-scale manufacturing. This paper highlights some EU funded research activities in micro/nano-manufacturing, and gives examples of the latest development in micro-manufacturing methods/techniques, process chains, hybrid-processes, manufacturing equipment and supporting technologies/device, etc., which is followed by a summary of the achievements of the EU MASMICRO project. Finally, concluding remarks are given, which raise several issues concerning further development in micro-manufacturing

Enhancing pharmaceutical packaging through a technology ecosystem to facilitate the reuse of medicines and reduce medicinal waste

The idea of reusing dispensed medicines is appealing to the general public provided its benefits are illustrated, its risks minimized, and the logistics resolved. For example, medicine reuse could help reduce medicinal waste, protect the environment and improve public health. However, the associated technologies and legislation facilitating medicine reuse are generally not available. The availability of suitable technologies could arguably help shape stakeholders’ beliefs and in turn, uptake of a future medicine reuse scheme by tackling the risks and facilitating the practicalities. A literature survey is undertaken to lay down the groundwork for implementing technologies on and around pharmaceutical packaging in order to meet stakeholders’ previously expressed misgivings about medicine reuse (’stakeholder requirements’), and propose a novel ecosystem for, in effect, reusing returned medicines. Methods: A structured literature search examining the application of existing technologies on pharmaceutical packaging to enable medicine reuse was conducted and presented as a narrative review. Results: Reviewed technologies are classified according to different stakeholders’ requirements, and a novel ecosystem from a technology perspective is suggested as a solution to reusing medicines. Conclusion: Active sensing technologies applying to pharmaceutical packaging using printed electronics enlist medicines to be part of the Internet of Things network. Validating the quality and safety of returned medicines through this network seems to be the most effective way for reusing medicines and the correct application of technologies may be the key enabler

Automatic Color Inspection for Colored Wires in Electric Cables

In this paper, an automatic optical inspection system for checking the sequence of colored wires in electric cable is presented. The system is able to inspect cables with flat connectors differing in the type and number of wires. This variability is managed in an automatic way by means of a self-learning subsystem and does not require manual input from the operator or loading new data to the machine. The system is coupled to a connector crimping machine and once the model of a correct cable is learned, it can automatically inspect each cable assembled by the machine. The main contributions of this paper are: (i) the self-learning system; (ii) a robust segmentation algorithm for extracting wires from images even if they are strongly bent and partially overlapped; (iii) a color recognition algorithm able to cope with highlights and different finishing of the wire insulation. We report the system evaluation over a period of several months during the actual production of large batches of different cables; tests demonstrated a high level of accuracy and the absence of false negatives, which is a key point in order to guarantee defect-free productions