Demystifying the Characteristics of 3D-Stacked Memories: A Case Study for Hybrid Memory Cube

Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally associated with memories. A practical 3D-stacked memory is Hybrid Memory Cube (HMC), which provides significant access bandwidth and low power consumption in a small area. Although several studies have taken advantage of the novel architecture of HMC, its characteristics in terms of latency and bandwidth or their correlation with temperature and power consumption have not been fully explored. This paper is the first, to the best of our knowledge, to characterize the thermal behavior of HMC in a real environment using the AC-510 accelerator and to identify temperature as a new limitation for this state-of-the-art design space. Moreover, besides bandwidth studies, we deconstruct factors that contribute to latency and reveal their sources for high- and low-load accesses. The results of this paper demonstrates essential behaviors and performance bottlenecks for future explorations of packet-switched and 3D-stacked memories.Comment: EEE Catalog Number: CFP17236-USB ISBN 13: 978-1-5386-1232-

DAMOV: A New Methodology and Benchmark Suite for Evaluating Data Movement Bottlenecks

Data movement between the CPU and main memory is a first-order obstacle against improving performance, scalability, and energy efficiency in modern systems. Computer systems employ a range of techniques to reduce overheads tied to data movement, spanning from traditional mechanisms (e.g., deep multi-level cache hierarchies, aggressive hardware prefetchers) to emerging techniques such as Near-Data Processing (NDP), where some computation is moved close to memory. Our goal is to methodically identify potential sources of data movement over a broad set of applications and to comprehensively compare traditional compute-centric data movement mitigation techniques to more memory-centric techniques, thereby developing a rigorous understanding of the best techniques to mitigate each source of data movement. With this goal in mind, we perform the first large-scale characterization of a wide variety of applications, across a wide range of application domains, to identify fundamental program properties that lead to data movement to/from main memory. We develop the first systematic methodology to classify applications based on the sources contributing to data movement bottlenecks. From our large-scale characterization of 77K functions across 345 applications, we select 144 functions to form the first open-source benchmark suite (DAMOV) for main memory data movement studies. We select a diverse range of functions that (1) represent different types of data movement bottlenecks, and (2) come from a wide range of application domains. Using NDP as a case study, we identify new insights about the different data movement bottlenecks and use these insights to determine the most suitable data movement mitigation mechanism for a particular application. We open-source DAMOV and the complete source code for our new characterization methodology at https://github.com/CMU-SAFARI/DAMOV.Comment: Our open source software is available at https://github.com/CMU-SAFARI/DAMO

Performance Implications of NoCs on 3D-Stacked Memories: Insights from the Hybrid Memory Cube

Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for connecting their internal structural organizations. This novel usage of NoC, in addition to aiding processing-in-memory capabilities, enables numerous benefits such as high bandwidth and memory-level parallelism. However, the implications of NoCs on the characteristics of 3D-stacked memories in terms of memory access latency and bandwidth have not been fully explored. This paper addresses this knowledge gap by (i) characterizing an HMC prototype on the AC-510 accelerator board and revealing its access latency behaviors, and (ii) by investigating the implications of such behaviors on system and software designs

Retrospective: A Scalable Processing-in-Memory Accelerator for Parallel Graph Processing

Our ISCA 2015 paper provides a new programmable processing-in-memory (PIM) architecture and system design that can accelerate key data-intensive applications, with a focus on graph processing workloads. Our major idea was to completely rethink the system, including the programming model, data partitioning mechanisms, system support, instruction set architecture, along with near-memory execution units and their communication architecture, such that an important workload can be accelerated at a maximum level using a distributed system of well-connected near-memory accelerators. We built our accelerator system, Tesseract, using 3D-stacked memories with logic layers, where each logic layer contains general-purpose processing cores and cores communicate with each other using a message-passing programming model. Cores could be specialized for graph processing (or any other application to be accelerated). To our knowledge, our paper was the first to completely design a near-memory accelerator system from scratch such that it is both generally programmable and specifically customizable to accelerate important applications, with a case study on major graph processing workloads. Ensuing work in academia and industry showed that similar approaches to system design can greatly benefit both graph processing workloads and other applications, such as machine learning, for which ideas from Tesseract seem to have been influential. This short retrospective provides a brief analysis of our ISCA 2015 paper and its impact. We briefly describe the major ideas and contributions of the work, discuss later works that built on it or were influenced by it, and make some educated guesses on what the future may bring on PIM and accelerator systems.Comment: Selected to the 50th Anniversary of ISCA (ACM/IEEE International Symposium on Computer Architecture), Commemorative Issue, 202

An Experimental Evaluation of Machine Learning Training on a Real Processing-in-Memory System

Training machine learning (ML) algorithms is a computationally intensive process, which is frequently memory-bound due to repeatedly accessing large training datasets. As a result, processor-centric systems (e.g., CPU, GPU) suffer from costly data movement between memory units and processing units, which consumes large amounts of energy and execution cycles. Memory-centric computing systems, i.e., with processing-in-memory (PIM) capabilities, can alleviate this data movement bottleneck. Our goal is to understand the potential of modern general-purpose PIM architectures to accelerate ML training. To do so, we (1) implement several representative classic ML algorithms (namely, linear regression, logistic regression, decision tree, K-Means clustering) on a real-world general-purpose PIM architecture, (2) rigorously evaluate and characterize them in terms of accuracy, performance and scaling, and (3) compare to their counterpart implementations on CPU and GPU. Our evaluation on a real memory-centric computing system with more than 2500 PIM cores shows that general-purpose PIM architectures can greatly accelerate memory-bound ML workloads, when the necessary operations and datatypes are natively supported by PIM hardware. For example, our PIM implementation of decision tree is $27\times$ faster than a state-of-the-art CPU version on an 8-core Intel Xeon, and $1.34\times$ faster than a state-of-the-art GPU version on an NVIDIA A100. Our K-Means clustering on PIM is $2.8\times$ and $3.2\times$ than state-of-the-art CPU and GPU versions, respectively. To our knowledge, our work is the first one to evaluate ML training on a real-world PIM architecture. We conclude with key observations, takeaways, and recommendations that can inspire users of ML workloads, programmers of PIM architectures, and hardware designers & architects of future memory-centric computing systems

NDC: Analyzing the impact of 3D-stacked memory+logic devices on MapReduce workloads

pre-printWhile Processing-in-Memory has been investigated for decades, it has not been embraced commercially. A number of emerging technologies have renewed interest in this topic. In particular, the emergence of 3D stacking and the imminent release of Micron's Hybrid Memory Cube device have made it more practical to move computation near memory. However, the literature is missing a detailed analysis of a killer application that can leverage a Near Data Computing (NDC) architecture. This paper focuses on in-memory MapReduce workloads that are commercially important and are especially suitable for NDC because of their embarrassing parallelism and largely localized memory accesses. The NDC architecture incorporates several simple processing cores on a separate, non-memory die in a 3D-stacked memory package; these cores can perform Map operations with efficient memory access and without hitting the bandwidth wall. This paper describes and evaluates a number of key elements necessary in realizing efficient NDC operation: (i) low-EPI cores, (ii) long daisy chains of memory devices, (iii) the dynamic activation of cores and SerDes links. Compared to a baseline that is heavily optimized for MapReduce execution, the NDC design yields up to 15X reduction in execution time and 18X reduction in system energy