Electron microscpy study of deformation and recrystallization behavior of pure tin for mitigation of whiskers

The clarification of whisker growth mechanism is a key to the mitigation of tin-whiskers. In order to confirm the growth model the present authors had proposed, the process of recrystallization of tin was investigated. A single crystal of tin was prepared by using a slow-cooling method and plate samples were prepared by using a spark-cutter and electro-polishing. Deformation was applied to the plate samples by scratching. The microstructural changes with time at room temperature after scratching were observed by scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). The experimental results showed clearly that recrystallization can proceed even at room temperature. A tensile test was also performed in order to investigate its ordinary deformation behavior. The present results have supported the model for tin whisker growth mechanism, suggesting that if the recrystallization phenomenon can be controlled to proceed homogenously in tin solder and plating, the whisker growth will be mitigated

Developing a dual-layer system for the mitigation of tin whiskers

There are very few studies that have investigated directly the effect of an oxide film on tin whisker growth, since the cracked oxide theory was proposed by Tu in 1994. The current work has investigated the effect of using an electrochemically formed oxide and both a molybdate conversion coating and a tungstate conversion coating on tin whisker growth from Sn-Cu electrodeposits on Cu, and compared it with that from a native air-formed oxide. X-ray photoelectron spectroscopy (XPS) has been used to investigate the effect of coating parameters on the thickness and composition of the oxide film. The XPS studies show that the oxide film formed using either of the conversion coating baths was significantly thicker than that produced from the potassium bicarbonate-potassium carbonate bath. Initial observations suggest that both the tungstate-based conversion coatings and the molybdate-based conversion coatings significantly reduced whisker growth by over 80 %, compared with a native air-formed oxide, and provide improved whisker mitigation compared with the electrochemically formed oxides. The current work has also investigated the potential of using a dual-layer system, comprised of both an electrochemically formed oxide bottom layer and an acrylic conformal coating top layer, for the mitigation of tin whisker growth. The electrochemically formed oxide used in the dual-layer system was produced at 2 V vs. Ag/AgCl while passing a charge of 60 mC cm-2 and the thickness of the conformal coating was aimed to be between ~5 μm to ~6 μm. This thickness was chosen to enable the study of whisker growth on a shorter time scale and to study the effect the electrochemically formed oxide had when used in conjunction. Initial observations showed that the dual-layer system provided improved whisker mitigation compared with both the electrochemically formed oxides and acrylic conformal coatings when used singularly. As part of the self-healing work, nanocapsules filled with the reactive agent were needed to be synthesised and the compatibility of them with different solvents needed to be studied. Capsules filled with the reactive agent were successfully synthesised, however, it was found that the capsules agglomerated and the size of the capsules, in some instances, were too large to be incorporated into a thin conformal coating. Regardless, the capsules were still analysed to check the compatibility with different solvents, to identify a suitable conformal coating mixture that would not dissolve the polymer shell of the capsules. It was observed that the capsules were stable in three out of the five solvents that were analysed, them being isopropanol (IPA), butanone and methylcyclohexane

ELECTROMECHANICAL INTERACTION ON THE DEFORMATION BEHAVIOR OF METALLIC MATERIALS

Metallic materials play important roles in providing electrical, thermal, and mechanical functions in electronic devices and systems. The understanding of the electrical-thermal-mechanical interaction caused by the passage of electric current with high density is important to improve the performance and reliability of electronic assembly and packaging. The electromechanical interaction on the deformation behavior of copper and tin is studied in this work. The electromechanical response of Cu strips was studied by passing a DC electric current. The electric resistance linearly increased with time before the occurrence of electric fusing. The electrothermal interaction led to the buckling of the Cu strips with the maximum deflection increasing with the increase of the electric current density. The total strain was found to be proportional to the square of the electric current density. A power law relation was used to describe the dependence of the time-to-fusing on the electric current density. Using the nanoindentation technique, the effect of electric current on the indentation deformation of copper and tin was studied. The reduced contact modulus of copper and tin decreased with increasing the electric current density. With the passage of a DC electric current, the indentation hardness of copper increased slightly with increasing electric current density. With the passage of an AC electric current, the indentation hardness of copper decreased with increasing the indentation deformation. With the passage of a DC electric current, the indentation hardness of tin decreased with increasing the indentation load, showing the normal indentation size effect. Both the limit of infinite depth and the characteristic length were dependent on the electric current density. Using the tensile creep technique, the creep deformation of pure tin was studied with the passage of a DC electric current. The steady state creep rate increased with the increase in temperature, tensile stress and electrical current density. For the same tensile stress and the same chamber temperature, the steady state creep rate increased linearly with the square of the electric current density. The electric current density has no significant effect on the stress exponent and activation energy of the tensile creep of tin for the experimental conditions