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1 research outputs found
Failure mechanisms of microbolometer thermal imager sensors using chip-scale packaging
Author
Backer
Blackwell
+18 more
Budzier
Elßner
Fraunhofer IMS
Holger Vogt
Kruse
Kruse
Li
Madou
Marasco
Michael Elßner
Moraja
Murphy
Niklaus
Niklaus
Premachandran
Rogalski
Roxhed
Wood
Publication venue
'Elsevier BV'
Publication date
Field of study
No full text
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