Thick-Film and LTCC Passive Components for High-Temperature Electronics

At this very moment an increasing interest in the field of high-temperature electronics is observed. This is a result of development in the area of wide-band semiconductors’ engineering but this also generates needs for passives with appropriate characteristics. This paper presents fabrication as well as electrical and stability properties of passive components (resistors, capacitors, inductors) made in thick-film or Low-Temperature Co-fired Ceramics (LTCC) technologies fulfilling demands of high-temperature electronics. Passives with standard dimensions usually are prepared by screen-printing whereas combination of standard screen-printing with photolithography or laser shaping are recommenced for fabrication of micropassives. Attainment of proper characteristics versus temperature as well as satisfactory long-term high-temperature stability of micropassives is more difficult than for structures with typical dimensions for thick-film and LTCC technologies because of increase of interfacial processes’ importance. However it is shown that proper selection of thick-film inks together with proper deposition method permit to prepare thick-film micropassives (microresistors, air-cored microinductors and interdigital microcapacitors) suitable for the temperature range between 150°C and 400°C

AC-coupled GaAs microstrip detectors with a new type of integrated bias resistors

Full size single-sided GaAs microstrip detectors with integrated coupling capacitors and bias resistors have been fabricated on 3'' substrate wafers. PECVD deposited SiO_2 and SiO_2/Si_3N_4 layers were used to provide coupling capacitaces of 32.5 pF/cm and 61.6 pF/cm, respectively. The resistors are made of sputtered CERMET using simple lift of technique. The sheet resistivity of 78 kOhm/sq. and the thermal coefficient of resistance of less than 4x10^-3 / degree C satisfy the demands of small area biasing resistors, working on a wide temperature range.Comment: 20 pages, 9 figures, to be published in NIM

Printed analogue filter structures

The authors report progress in conductive lithographic film (CLF) technology, which uses the offset lithographic printing process to form electrically conductive patterns on flexible substrates. Networks of planar passive components and interconnects fabricated simultaneously via the CLF process form notch filter networks at 85 kHz

Cantilever-based Resonant Microsensors with Integrated Temperature Modulation for Transient Chemical Analysis

This work introduces a resonant cantilever platform with integrated temperature modulation for real-time chemical sensing. Embedded heaters allow for rapid thermal cycling of individual sensors, thereby enabling real-time transient signal analysis without the need for a microfluidic setup to switch between analyte and reference gases. Compared to traditional mass-sensitive microsensors operating in steady state, the on-chip generation of signal transients provides additional information for analyte discrimination

Thermally-Reconfigurable Quantum Photonic Circuits at Telecom Wavelength by Femtosecond Laser Micromachining

The importance of integrated quantum photonics in the telecom band resides on the possibility of interfacing with the optical network infrastructure developed for classical communications. In this framework, femtosecond laser written integrated photonic circuits, already assessed for quantum information experiments in the 800 nm wavelength range, have great potentials. In fact these circuits, written in glass, can be perfectly mode-matched at telecom wavelength to the in/out coupling fibers, which is a key requirement for a low-loss processing node in future quantum optical networks. In addition, for several applications quantum photonic devices will also need to be dynamically reconfigurable. Here we experimentally demonstrate the high performance of femtosecond laser written photonic circuits for quantum experiments in the telecom band and we show the use of thermal shifters, also fabricated by the same femtosecond laser, to accurately tune them. State-of-the-art manipulation of single and two-photon states is demonstrated, with fringe visibilities greater than 95%. This opens the way to the realization of reconfigurable quantum photonic circuits on this technological platform

Design, development, and fabrication of a electronic analog microminiaturized electronic analog signal to discrete time interval converter

The microminiaturization of an electronic analog signal to discrete time interval converter is presented. Discrete components and integrated circuits comprising the converter were assembled on a thin-film ceramic substrate containing nichrome resistors with gold interconnections. The finished assembly is enclosed in a flat package measuring 3.30 by 4.57 centimeters. The module can be used whenever conversion of analog to digital signals is required, in particular for the purpose of regulation by means of pulse modulation. In conjunction with a precision voltage reference, the module was applied to control the duty cycle of a switching regulator within a temperature range of -55 C to +125 C, and an input voltage range of 10V to 35V. The output-voltage variation was less than + or - 300 parts per million, i.e., less than + or - 3mV for a 10V output