Architecting SkyBridge-CMOS

As the scaling of CMOS approaches fundamental limits, revolutionary technology beyond the end of CMOS roadmap is essential to continue the progress and miniaturization of integrated circuits. Recent research efforts in 3-D circuit integration explore pathways of continuing the scaling by co-designing for device, circuit, connectivity, heat and manufacturing challenges in a 3-D fabric-centric manner. SkyBridge fabric is one such approach that addresses fine-grained integration in 3-D, achieves orders of magnitude benefits over projected scaled 2-D CMOS, and provides a pathway for continuing scaling beyond 2-D CMOS. However, SkyBridge fabric utilizes only single type transistors in order to reduce manufacture complexity, which limits its circuit implementation to dynamic logic. This design choice introduces multiple challenges for SkyBridge such as high switching power consumption, susceptibility to noise, and increased complexity for clocking. In this thesis we propose a new 3-D fabric, similar in mindset to SkyBridge, but with static logic circuit implementation in order to mitigate the afore-mentioned challenges. We present an integrated framework to realize static circuits with vertical nanowires, and co-design it across all layers spanning fundamental fabric structures to large circuits. The new fabric, named as SkyBridge-CMOS, introduces new technology, structures and circuit designs to meet the additional requirements for implementing static circuits. One of the critical challenges addressed here is integrating both n-type and p-type nanowires. Molecular bonding process allows precise control between different doping regions, and novel fabric components are proposed to achieve 3-D routing between various doping regions. Core fabric components are designed, optimized and modeled with their physical level information taken into account. Based on these basic structures we design and evaluate various logic gates, arithmetic circuits and SRAM in terms of power, area footprint and delay. A comprehensive evaluation methodology spanning material/device level to circuit level is followed. Benchmarking against 16nm 2-D CMOS shows significant improvement of up to 50X in area footprint and 9.3X in total power efficiency for low power applications, and 3X in throughput for high performance applications. Also, better noise resilience and better power efficiency can be guaranteed when compared with original SkyBridge fabrics

A fully integrated SRAM-based CMOS arbitrary waveform generator for analog signal processing

This dissertation focuses on design and implementation of a fully-integrated SRAM-based arbitrary waveform generator for analog signal processing applications in a CMOS technology. The dissertation consists of two parts: Firstly, a fully-integrated arbitrary waveform generator for a multi-resolution spectrum sensing of a cognitive radio applications, and an analog matched-filter for a radar application and secondly, low-power techniques for an arbitrary waveform generator. The fully-integrated low-power AWG is implemented and measured in a 0.18-¥ìm CMOS technology. Theoretical analysis is performed, and the perspective implementation issues are mentioned comparing the measurement results. Moreover, the low-power techniques of SRAM are addressed for the analog signal processing: Self-deactivated data-transition bit scheme, diode-connected low-swing signaling scheme with a short-current reduction buffer, and charge-recycling with a push-pull level converter for power reduction of asynchronous design. Especially, the robust latch-type sense amplifier using an adaptive-latch resistance and fully-gated ground 10T-SRAM bitcell in a 45-nm SOI technology would be used as a technique to overcome the challenges in the upcoming deep-submicron technologies.Ph.D.Committee Chair: Kim, Jongman; Committee Member: Kang, Sung Ha; Committee Member: Lee, Chang-Ho; Committee Member: Mukhopadhyay, Saibal; Committee Member: Tentzeris, Emmanouil

U-DVS SRAM design considerations

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.Includes bibliographical references (leaves 73-78).With the continuous scaling down of transistor feature sizes, the semiconductor industry faces new challenges. One of these challenges is the incessant increase of power consumption in integrated circuits. This problem has motivated the industry and academia to pay significant attention to low-power circuit design for the past two decades. Operating digital circuits at lower voltage levels was shown to increase energy efficiency and lower power consumption. Being an integral part of the digital systems, Static Random Access Memories (SRAMs), dominate the power consumption and area of modern integrated circuits. Consequently, designing low-power high density SRAMs operational at low voltage levels is an important research problem. This thesis focuses on and makes several contributions to low-power SRAM design. The trade-offs and potential overheads associated with designing SRAMs for a very large voltage range are analyzed. An 8T SRAM cell is designed and optimized for both sub-threshold and above-threshold operation. Hardware reconfigurability is proposed as a solution to power and area overheads due to peripheral assist circuitry which are necessary for low voltage operation. A 64kbit SRAM has been designed in 65nm CMOS process and the fabricated chip has been tested, demonstrating operation at power supply levels from 0.25V to 1.2V. This is the largest operating voltage range reported in 65nm semiconductor technology node. Additionally, another low voltage SRAM has been designed for the on-chip caches of a low-power H.264 video decoder. Power and performance models of the memories have been developed along with a configurable interface circuit. This custom memory implemented with the low-power architecture of the decoder provides nearly 10X power savings.by Mahmut E. Sinangil.S.M