Flexible workforces and low profit margins: electronics assembly between Europe and China

This book investigates restructuring in the electronics industry and in particular the impact of a \u2018Chinese\u2019 labour regime on work and employ - ment practices in electronics assembly in Europe.1 Electronics is an extremely dynamic sector, characterized by an ever-changing organi - zational structure, as well as cut-throat competition, particularly in manufacturing. Located primarily in East Asia, electronics assembly has become notorious for poor working conditions, low unionisation and authoritarian labour relations. However, hostile labour relations and topdown HR policies are not unique to East Asia. They have become associated with the way the sector is governed more broadly, with a number of Western companies also coming to rely on such practices

Introduction

This book investigates restructuring in the electronics industry and in particular the impact of a \u2018Chinese\u2019 labour regime on work and employ - ment practices in electronics assembly in Europe.1 Electronics is an extremely dynamic sector, characterized by an ever-changing organi - zational structure, as well as cut-throat competition, particularly in manufacturing. Located primarily in East Asia, electronics assembly has become notorious for poor working conditions, low unionisation and authoritarian labour relations. However, hostile labour relations and topdown HR policies are not unique to East Asia. They have become associated with the way the sector is governed more broadly, with a number of Western companies also coming to rely on such practices

High-temperature microphone system

Pressure fluctuations in air or other gases in an area of elevated temperature are measured using a condenser microphone located in the area of elevated temperature and electronics for processing changes in the microphone capacitance located outside the area the area and connected to the microphone by means of high-temperature cable assembly. The microphone includes apparatus for decreasing the undesirable change in microphone sensitivity at high temperatures. The high temperature cable assembly operates as a half-wavelength transmission line in an AM carrier system and maintains a large temperature gradient between the two ends of the cable assembly. The processing electronics utilizes a voltage controlled oscillator for automatic tuning thereby increasing the sensitivity of the measuring apparatus

Design study of TDRS antenna gimbal system for LANDSAT-D

The conceptual design studies of a two axis antenna drive assembly for the TDRSS link communications subsystem for LANDSAT D are presented. The recommended antenna drive assembly is a simple and reliable design substantially similar to the antenna and solar array drives developed and space qualified for programs such as DSCS 2 and FltSatCom. The gimbal design tradeoff is presented, along with drive electronics

Viewfinder/tracking system for Skylab

Basic component of system is infrared spectrometer designed for manual target acquisition, pointing and tracking, and data-take initiation. System incorporates three main subsystems which include: (1) viewfinder telescope, (2) control panel and electronics assembly, and (3) IR-spectrometer case assembly

A Student-Centered Learning Approach to Design for Manufacturability: Meeting the Needs of an Often- Forgotten Customer

A hands-on learning module was implemented at Marquette University in 2012 to teach biomedical engineering students about basic manufacturing processes, lean manufacturing principles, and design for manufacturability. It incorporates active and student-centered learning as part of in-class assembly line simulations. Since then, it has evolved from three class periods to five. The module begins with two classroom presentations on manufacturing operations and electronics design, assembly, and testing. Students then participate in an in-class assembly line simulation exercise where they build and test an actual product per written work instructions. They reflect on this experience and suggest design and process changes to improve the assembly line process and quality, save time, and reduce cost and waste. At the end of the module students implement their suggested design and process improvements and repeat the exercise to determine the impact of their improvements. They learn of the importance of Design for Manufacturability, well-written work instructions, process design, and designing a product not only for the end user, but also for the assemblers and inspectors. Details of the module, and its implementation and assessment are presented along with student feedback and faculty observations

Technology transfer from NASA to targeted industries, volume 2

This volume contains the following materials to support Volume 1: (1) Survey of Metal Fabrication Industry in Alabama; (2) Survey of Electronics Manufacturing/Assembly Industry in Alabama; (3) Apparel Modular Manufacturing Simulators; (4) Synopsis of a Stereolithography Project; (5) Transferring Modular Manufacturing Technology to an Apparel Firm; (6) Letters of Support; (7) Fact Sheets; (8) Publications; and (9) One Stop Access to NASA Technology Brochure

Chemical patterning for the highly specific and programmed assembly of nanostructures

We have developed a new chemical patterning technique based on standard lithography-based processes to assemble nanostructures on surfaces with extraordinarily high selectivity. This patterning process is used to create patterns of aminosilane molecular layers surrounded by highly inert poly (ethylene glycol) (PEG) molecules. While the aminosilane regions facilitate nanostructure assembly, the PEG coating prevents adsorption of molecules and nanostructures, thereby priming the semiconductor substrate for the highly localized and programmed assembly of nanostructures. We demonstrate the power and versatility of this manufacturing process by building multilayered structures of gold nanoparticles attached to molecules of DNA onto the aminosilane patterns, with zero nanocrystal adsorption onto the surrounding PEG regions. The highly specific surface chemistry developed here can be used in conjunction with standard microfabrication and emerging nanofabrication technology to seamlessly integrate various nanostructures with semiconductor electronics

A Cooperative Sequential Adsorption Model in Two Dimensions with Experimental Applications for Ionic Self-Assembly of Nanoparticles

Self-assembly of nanoparticles is an important tool in nanotechnology, with numerous applications including thin films, electronics, and drug delivery. We study the deposition of ionic nanoparticles on a glass substrate both experimentally and theoretically. Our theoretical model consists of a stochastic cooperative adsorption and evaporation process on a two-dimensional lattice. By exploring the relationship between the initial concentration of nanoparticles in the colloidal solution and the density of particles deposited on the substrate, we relate the deposition rate of our theoretical model to the concentration.Comment: 7 pages, 6 figures; v2: major revisio