This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on Chip-Laminate-Chip (CLC) technology. Internal IO interface inside CLC module has been modeled and compared with Stack-Chip (SC) implementation. Thermal analysis, including comparison against Stack-Chip and System-ona-Chip (SoC) is also presented. It is demonstrated that CLC technology provides significant performance advantage over conventional SiP technologies and has great impact on future system-level integration. 1