Analysis of design strategies for RF ESD problems in CMOS circuits

This thesis analyses the design strategies used to protect RF circuits that are implemented in CMOS technologies. It investigates, in detail, the physical mechanisms involved when a ggNMOS structure is exposed to an ESD event and undergoes snapback. The understanding gained is used to understand why the performance of the current RF ESD clamp is poor and suggestions are made as to how the performance of ggNMOS clamps can be improved beyond the current body of knowledge. The ultimate aim is to be able to design effective ESD protection clamps whilst minimising the effect the circuit has on RF I/O signals. A current ggNMOS based RF ESD I/O protection circuit is analysed in detail using a Transmission Line Pulse (TLP) tester. This is shown to be a very effective diagnostic tool by showing many characteristics of the ggNMOS during the triggering and conducting phase of the ESD event and demonstrate deficiencies in the clamp design. The use of a FIB enhances the analysis by allowing the isolation of individual components in the circuit and therefore their analysis using the TLP tester. SPICE simulations are used to provide further commentary on the debate surrounding the specification required of a TLP tester for there to be a good correlation between a TLP test and the industry standard Human Body Model (HBM) ESD test. Finite element simulations are used to probe deeper in to the mechanisms involved when a ggNMOS undergoes snapback especially with regard to the contribution parasitic components within the ggNMOS make to the snapback process. New ggNMOS clamps are proposed which after some modification are shown to work. Some of the finite element experiments are repeated in a 0.18μπ7. process CMOS test chip and a comparison is made between the two sets of results. In the concluding chapter understanding that has been gained from previous chapters is combined with the published body of knowledge to suggest and explain improvements in the design of a ggNMOS for RF and standard applications. These improvements will improve homogeneity of ggNMOS operation thus allowing the device size to be reduced and parasitic loading for a given ESD performance. These techniques can also be used to ensure that the ESD current does not take an unintended path through the chip

Feedback methods for inductorless bandwidth extension and linearisation of post-amplifiers in optical receiver frontends

Optical communication is increasingly important in today's telecommunications. It is not only a key component in long-haul infrastructure, but is also being brought into new applications within the datacentre, at the circuit board and integrated circuit level, and in next generation mobile networks. This thesis proposes feedback tuning approaches in order to address two challenges within optical receiver analog frontend circuits: a) the dynamic response of a prior bandwidth extension technique; and b) linearity optimisation. To address dynamic response, we begin with an inductorless method of bandwidth extension using positive feedback loops. In a multi-stage post-amplifier with local positive feedback loops, we propose an approach which tunes each positive feedback gain separately, and demonstrate that this achieves better dynamic response and eye opening than the prior equal-feedback-gain approach. We additionally propose root-locus analysis as a means of characterising dynamic response, and suggest some design guidelines based on this analysis. To address linearity optimisation, we propose the use of an interleaving negative-feedback post-amplifier topology, previously proposed only for bandwidth extension. We investigate the relationship between the feedback gains and linearity and develop a design approach for linearity optimisation. We then designed and fabricated two 70 dB 6 GHz optical receiver circuits, making use of two different post-amplifiers, in order to compare different design approaches. We achieved a linearity of 0.08 dBVrms OIP3 (quasi-static) and a THD of 0.195\% at 1 GHz

Development of the readout electronics for the high luminosity upgrade of the CMS outer strip tracker

The High-luminosity upgrade of the LHC will deliver the dramatic increase in luminosity required for precision measurements and to probe Beyond the Standard Model theories. At the same time, it will present unprecedented challenges in terms of pileup and radiation degradation. The CMS experiment is set for an extensive upgrade campaign, which includes the replacement of the current Tracker with another all-silicon detector with improved performance and reduced mass. One of the most ambitious aspects of the future Tracker will be the ability to identify high transverse momentum track candidates at every bunch crossing and with very low latency, in order to include tracking information at the L1 hardware trigger stage, a critical and effective step to achieve triggers with high purity and low threshold. This thesis presents the development and the testing of the CMS Binary Chip 2 (CBC2), a prototype Application Specific Integrated Circuit (ASIC) for the binary front-end readout of silicon strip detectors modules in the Outer Tracker, which also integrates the logic necessary to identify high transverse momentum candidates by correlating hits from two silicon strip detectors, separated by a few millimetres. The design exploits the relation between the transverse momentum and the curvature in the trajectory of charged particles subject to the large magnetic field of CMS. The logic which follows the analogue amplification and binary conversion rejects clusters wider than a programmable maximum number of adjacent strips, compensates for the geometrical offset in the alignment of the module, and correlates the hits between the two sensor layers. Data are stored in a memory buffer before being transferred to an additional buffer stage and being serially read-out upon receipt of a Level 1 trigger. The CBC2 has been subject to extensive testing since its production in January 2013: this work reports the results of electrical characterization, of the total ionizing dose irradiation tests, and the performance of a prototype module instrumented with CBC2 in realistic conditions in a beam test. The latter is the first experimental demonstration of the Pt-selection principle central to the future of CMS. Several total-ionizing-dose tests highlighted no functional issue, but observed significant excess static current for doses <1 Mrad. The source of the excess was traced to static leakage current in the memory pipeline, and is believed to be a consequence of the high instantaneous dose delivered by the x-ray setup. Nevertheless, a new SRAM layout aimed at removing the leakage path was proposed for the CBC3. The results of single event upset testing of the chip are also reported, two of the three distinct memory circuits used in the chip were proven to meet the expected robustness, while the third will be replaced in the next iteration of the chip. Finally, the next version of the ASIC is presented, highlighting the additional features of the final prototype, such as half-strip resolution, additional trigger logic functionality, longer trigger latency and higher rate, and fully synchronous stub readout.Open Acces

Monolithic Integration of CMOS Charge Pumps for High Voltage Generation beyond 100 V

Monolithic integration of step-up DC-DC converters used to be one of the largest challenges in high voltage CMOS SoCs. Charge pumps are considered as the most promising solution regarding in- tegration levels compared to boost converter with bulky inductors. However, conventional charge pump architectures usually show significant drawbacks and reliability problems, when used as on- chip high voltage generators. Hence, innovative charge pump architectures are required to realize the monolithic integration of charge pumps in high voltage applications. In this dissertation, three 4-phase charge pump architectures with the dynamic body biasing tech- nique and clock schemes with dead time techniques were proposed to overcome drawbacks such as body effect and reverse current problem of traditional Pelliconi charge pump. The influences of high voltage CMOS sandwich capacitors on the voltage gain and power efficiency of charge pumps were extensively investigated. The most reasonable 4-phase charge pump architecture with a suitable configuration of high voltage sandwich capacitors regarding the voltage gain and power efficiency was chosen to implement two high voltage ASICs in an advanced 120 V 0.35 μm high voltage CMOS technology. The first test chip operates successfully and is able to generate up to 120 V from a 3.7 V low voltage DC supply, which shows the highest output voltage among all the reported fully integrated CMOS charge pumps. The measurement results confirmed the benefits of the proposed charge pump architectures and clock schemes. The second chip providing a similar output voltage has a reduced chip size mainly due to decreased capacitor areas by increased clock frequencies. Fur- thermore, the second chip with an on-chip clock generator works independently of external clock signals which shows the feasibility of integrated charge pumps as part of high voltage SoCs. Based on the successful implementation of those high voltage CMOS ASICs, further discussions on the stability of the output voltage, levels of integration and limitations in the negative high voltage generation of high voltage CMOS charge pumps are held with the aid of simulation or measurement results. Feed- back regulation by adjusting the clock frequency or DC power supply is able to stabilize the voltage performance effectively while being easily integrated on-chip. Increasing the clock frequency can significantly reduce the required capacitor values which results in reduced chip sizes. An application example demonstrates the importance of fully integrated high voltage charge pumps. Besides, a new design methodology for the on-chip high voltage generation using CMOS technolo- gies was proposed. It contains a general design flow focusing mainly on the feasibility and reliability of high voltage CMOS ASICs and design techniques for on-chip high voltage generators. In this dissertation, it is proven that CMOS charge pumps using suitable architectures regarding the required chip size and circuit reliability are able to be used as on-chip high voltage generators for voltages beyond 100 V . Several methods to improve the circuit performance and to extend the functionalities of high voltage charge pumps are suggested for future works

Semiconductor Device Modeling, Simulation, and Failure Prediction for Electrostatic Discharge Conditions

Electrostatic Discharge (ESD) caused failures are major reliability issues in IC industry. Device modeling for ESD conditions is necessary to evaluate ESD robustness in simulation. Although SPICE model is accurate and efficient for circuit simulations in most cases, devices under ESD conditions operate in abnormal status. SPICE model cannot cover the device operating region beyond normal operation. Thermal failure is one of the main reasons to cause device failure under ESD conditions. A compact model is developed to predict thermal failure with circuit simulators. Instead of considering the detailed failure mechanisms, a failure temperature is introduced to indicate device failure. The developed model is implemented by a multiple-stage thermal network. P-N junction is the fundamental structure for ESD protection devices. An enhanced diode model is proposed and is used to simulate the device behaviors for ESD events. The model includes all physical effects for ESD conditions, which are voltage overshoot, self-heating effect, velocity saturation and thermal failure. The proposed model not only can fit the I-V and transient characteristics, but also can predict failure for different pulses. Safe Operating Area (SOA) is an important factor to evaluate the LDMOS performance. The transient SOA boundary is considered as power-defined. By placing the failure monitor under certain conditions, the developed modeling methodology can predict the boundary of transient SOA for any short pulse stress conditions. No matter failure happens before or after snapback phenomenon. Weibull distribution is popular to evaluate the dielectric lifetime for CVS. By using the transformative version of power law, the pulsing stresses are converted into CVS, and TDDB under ESD conditions for SiN MIMCAPs is analyzed. The thickness dependency and area independency of capacitor breakdown voltage is observed, which can be explained by the constant ?E model instead of conventional percolation model

High efficiency wide-band line drivers in low voltage CMOS using Class-D techniques

In this thesis, the applicability of Class-D amplifiers to integrated wide-band communication line driver applications is studied. While Class-D techniques can address some of the efficiency limitations of linear amplifier structures and have shown promising results in low frequency applications, the low frequency techniques and knowledge need further development in order to improve their practicality for wide band systems. New structures and techniques to extend the application of Class-D to wide-band communication systems, in particular the HomePlug AV wire- line communication standard, will be proposed. Additionally, the digital processing requirements of these wide-band systems drives rapid movement towards nanometer technology nodes and presents new challenges which will be addressed, and new opportunities which will be exploited, for wide-band integrated Class-D line drivers. There are three main contributions of this research. First, a model of Class-D efficiency degradation mechanisms is created, which allows the impact of high-level design choices such as supply voltage, process technology and operating frequency to be assessed. The outcome of this section is a strategy for pushing the high efficiency of Class-D to wide band communication applications, with switching frequencies up to many hundreds of Megahertz. A second part of this research considers the design of efficient, fast and high power Class-D output stages, as these are the major efficiency and bandwidth bottleneck in wide-band applications. A novel NMOS-only totem pole output stage with a fast, integrated drive structure will be proposed. In a third section, a complete wide-band Class-D line driver is designed in a 0.13μm digital CMOS process. The line driver is systematically designed using a rigorous development methodology and the aims are to maximise the achievable signal bandwidth while minimising power dissipation. Novel circuits and circuit structures are proposed as part of this section and the resulting fabricated Class-D line driver test chip shows an efficiency of 15% while driving a 30MHz wide signal with an MTPR of 22dB, at 33mW injected power

Chemical Current-Conveyor: a new approach in biochemical computation

Biochemical sensors that are low cost, small in size and compatible with integrated circuit technology play an essential part in the drive towards personalised healthcare and the research described in this thesis is concerned with this area of medical instrumentation. A new biochemical measurement system able to sense key properties of biochemical fluids is presented. This new integrated circuit biochemical sensor, called the Chemical Current-Conveyor, uses the ion sensitive field effect transistor as the input sensor combined with the current-conveyor, an analog building-block, to produce a range of measurement systems. The concept of the Chemical Current-Conveyor is presented together with the design and subsequent fabrication of a demonstrator integrated circuit built on conventional 0.35μm CMOS silicon technology. The silicon area of the Chemical Current-Conveyor is (92μm x 172μm) for the N-channel version and (99μm x 165μm) for the P-channel version. Power consumption for the N-channel version is 30μW and 43μW for the P-channel version with a full load of 1MΩ. The maximum sensitivity achieved for pH measurement was 46mV per pH. The potential of the Chemical Current Conveyor as a versatile biochemical integrated circuit, able to produce output information in an appropriate form for direct clinical use has been confirmed by applications including measurement of (i) pH, (ii) buffer index ( ), (iii) urea, (iv) creatinine and (v) urea:creatinine ratio. In all five cases the device has been demonstrated successfully, confirming the validity of the original aim of this research project, namely to produce a versatile and flexible analog circuit for many biochemical measurement applications. Finally, the thesis closes with discussion of another potential application area for the Chemical Current Conveyor and the main contributions can be summarised by the design and development of the first: ISFET based current-conveyor biochemical sensor, called 'Chemical Current Conveyor, CCCII+' has been designed and developed. It is a general purpose biochemical analog building-block for several biochemical measurements. Real-time buffer capacity measurement system, based on the CCCII+, which exploits the imbedded analog computation capability of the CCCII+. Real-time enzyme based CCCII+ namely, Creatinine-CCCII+ and Urea-CCCII+ for real-time monitoring system of renal system. The system can provide outputs of 3 important parameters of the renal system, namely (i) urea concentration, (ii) creatinine concentration, and (ii) urea to creatinine ratio

Self-diagnosis implantable optrode for optogenetic stimulation

PhD ThesisAs a cell type-specific neuromodulation method, optogenetic technique holds remarkable potential for the realisation of advanced neuroprostheses. By genetically expressing light-sensitive proteins such as channelrhodopsin-2 (ChR2) in cell membranes, targeted neurons could be controlled by blue light. This new neuromodulation technique could then be applied into extensive brain networks and be utilised to provide effective therapies for neurological disorders. However, the development of novel optogenetic implants is still a key challenge in the field. The major requirements include small device dimensions, suitable spatial resolution, high safety, and strong controllability. In particular, appropriate implantable electronics are expected to be built into the device, accomplishing a new-generation intelligent optogenetic implant. To date, different microfabrication techniques, such as wave-guided laser/light-emitting diode (LED) structure and μLED-on-optrode structure, have been widely explored to create and miniaturise optogenetic implants. However, although these existing devices meet the requirements to some extent, there is still considerable room for improvement. In this thesis, a Complementary Metal-Oxide-Semiconductor (CMOS)-driven μLED approach is proposed to develop an advanced implantable optrode. This design is based on the μLED-on-optrode structure, where Gallium Nitride (GaN) μLEDs can be directly bonded to provide precise local light delivery and multi-layer stimulation. Moreover, an in-built diagnostic sensing circuitry is designed to monitor optrode integrity and degradation. This self-diagnosis function greatly improves system reliability and safety. Furthermore, in-situ temperature sensors are incorporated to monitor the local thermal effects of light emitters. This ensures both circuitry stability and tissue health. More importantly, external neural recording circuitry is integrated into the implant, which could observe local neural signals in the vicinity of the stimulation sites. Therefore, a CMOS-based multi-sensor optogenetic implant is achieved, and this closed-loop neural interface is capable of performing multichannel optical neural stimulation and electrical neural recording simultaneously. This optrode is expected to represent a promising neural interface for broad neuroprosthesis applications