Near-Memory Address Translation

Memory and logic integration on the same chip is becoming increasingly cost effective, creating the opportunity to offload data-intensive functionality to processing units placed inside memory chips. The introduction of memory-side processing units (MPUs) into conventional systems faces virtual memory as the first big showstopper: without efficient hardware support for address translation MPUs have highly limited applicability. Unfortunately, conventional translation mechanisms fall short of providing fast translations as contemporary memories exceed the reach of TLBs, making expensive page walks common. In this paper, we are the first to show that the historically important flexibility to map any virtual page to any page frame is unnecessary in today's servers. We find that while limiting the associativity of the virtual-to-physical mapping incurs no penalty, it can break the translate-then-fetch serialization if combined with careful data placement in the MPU's memory, allowing for translation and data fetch to proceed independently and in parallel. We propose the Distributed Inverted Page Table (DIPTA), a near-memory structure in which the smallest memory partition keeps the translation information for its data share, ensuring that the translation completes together with the data fetch. DIPTA completely eliminates the performance overhead of translation, achieving speedups of up to 3.81x and 2.13x over conventional translation using 4KB and 1GB pages respectively.Comment: 15 pages, 9 figure

Variation-Tolerant Non-Uniform 3D Cache Management in Memory Stacked Multi-Core Processors

Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures such as DRAMs. DRAMs are built using minimized transistors with presumably uniform speed in an organized array structure. Process variation can introduce latency disparity among different memory arrays. With the proliferation of 3D stacking technology, DRAMs become a favorable choice for stacking on top of a multi-core processor as a last level cache for large capacity, high bandwidth, and low power. Hence, variations in bank speed create a unique problem of non-uniform cache accesses in the 3D space.In this thesis, we investigate cache management techniques for tolerating process variation in a 3D DRAM stacked onto a multi-core processor. We modeled the process variation in a 4-layer DRAM memory to characterize the latency variations among different banks. As a result, the notion of fast and slow banks from the core's standpoint is no longer associated with their physical distances with the banks. They are determined by the different bank latencies due to process variation. We develop cache migration schemes that utilize fast banks while limiting the cost due to migration. Our experiments show that there is a great performance benefit in exploiting fast memory banks through migration. On average, a variation-aware management can improve the performance of a workload over the baseline (where the speed of the slowest bank is assumed for all banks) by 17.8%. We are also only 0.45% away in performance from an ideal memory where no PV is present

Understanding the impact of 3D stacked layouts on ILP

Journal Article3D die-stacked chips can alleviate the penalties imposed by long wires within micro-processor circuits. Many recent studies have attempted to partition each microprocessor structure across three dimensions to reduce their access times. In this paper, we implement each microprocessor structure on a single 2D die and leverage 3D to reduce the lengths of wires that communicate data between microprocessor structures within a single core. We begin with a criticality analysis of inter-structure wire delays and show that for most tra- ditional simple superscalar cores, 2D floorplans are already very efficient at minimizing critical wire delays. For an aggressive wire-constrained clustered superscalar architecture, an exploration of the design space reveals that 3D can yield higher benefit. However, this benefit may be negated by the higher power density and temperature entailed by 3D integration. Overall, we report a negative result and argue against leveraging 3D for higher ILP