CORE
🇺🇦Â
 make metadata, not war
Services
Services overview
Explore all CORE services
Access to raw data
API
Dataset
FastSync
Content discovery
Recommender
Discovery
OAI identifiers
OAI Resolver
Managing content
Dashboard
Bespoke contracts
Consultancy services
Support us
Support us
Membership
Sponsorship
Community governance
Advisory Board
Board of supporters
Research network
About
About us
Our mission
Team
Blog
FAQs
Contact us
Filters
2 research outputs found
Thermal via placement in 3D ICs
Author
Publication venue
'Association for Computing Machinery (ACM)'
Publication date
01/01/2005
Field of study
Full text link
Crossref
Development of a Viable 3D Integrated Circuit Technology
Author
Chan Mansun
Ko Ping Keung
Publication venue
Publication date
Field of study
No full text
Hong Kong University of Science and Technology Institutional Repository
Full text link
