A scalable multi-core architecture with heterogeneous memory structures for Dynamic Neuromorphic Asynchronous Processors (DYNAPs)

Neuromorphic computing systems comprise networks of neurons that use asynchronous events for both computation and communication. This type of representation offers several advantages in terms of bandwidth and power consumption in neuromorphic electronic systems. However, managing the traffic of asynchronous events in large scale systems is a daunting task, both in terms of circuit complexity and memory requirements. Here we present a novel routing methodology that employs both hierarchical and mesh routing strategies and combines heterogeneous memory structures for minimizing both memory requirements and latency, while maximizing programming flexibility to support a wide range of event-based neural network architectures, through parameter configuration. We validated the proposed scheme in a prototype multi-core neuromorphic processor chip that employs hybrid analog/digital circuits for emulating synapse and neuron dynamics together with asynchronous digital circuits for managing the address-event traffic. We present a theoretical analysis of the proposed connectivity scheme, describe the methods and circuits used to implement such scheme, and characterize the prototype chip. Finally, we demonstrate the use of the neuromorphic processor with a convolutional neural network for the real-time classification of visual symbols being flashed to a dynamic vision sensor (DVS) at high speed.Comment: 17 pages, 14 figure

A survey on scheduling and mapping techniques in 3D Network-on-chip

Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those cores to achieve higher performance by outsourcing their communication tasks. Mapping and Scheduling methodologies are key elements in assigning application tasks, allocating the tasks to the IPs, and organising communication among them to achieve some specified objectives. The goal of this paper is to present a detailed state-of-the-art of research in the field of mapping and scheduling of applications on 3D NoC, classifying the works based on several dimensions and giving some potential research directions

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Hardware-Amenable Structural Learning for Spike-based Pattern Classification using a Simple Model of Active Dendrites

This paper presents a spike-based model which employs neurons with functionally distinct dendritic compartments for classifying high dimensional binary patterns. The synaptic inputs arriving on each dendritic subunit are nonlinearly processed before being linearly integrated at the soma, giving the neuron a capacity to perform a large number of input-output mappings. The model utilizes sparse synaptic connectivity; where each synapse takes a binary value. The optimal connection pattern of a neuron is learned by using a simple hardware-friendly, margin enhancing learning algorithm inspired by the mechanism of structural plasticity in biological neurons. The learning algorithm groups correlated synaptic inputs on the same dendritic branch. Since the learning results in modified connection patterns, it can be incorporated into current event-based neuromorphic systems with little overhead. This work also presents a branch-specific spike-based version of this structural plasticity rule. The proposed model is evaluated on benchmark binary classification problems and its performance is compared against that achieved using Support Vector Machine (SVM) and Extreme Learning Machine (ELM) techniques. Our proposed method attains comparable performance while utilizing 10 to 50% less computational resources than the other reported techniques.Comment: Accepted for publication in Neural Computatio

Approximate Computing Survey, Part I: Terminology and Software & Hardware Approximation Techniques

The rapid growth of demanding applications in domains applying multimedia processing and machine learning has marked a new era for edge and cloud computing. These applications involve massive data and compute-intensive tasks, and thus, typical computing paradigms in embedded systems and data centers are stressed to meet the worldwide demand for high performance. Concurrently, the landscape of the semiconductor field in the last 15 years has constituted power as a first-class design concern. As a result, the community of computing systems is forced to find alternative design approaches to facilitate high-performance and/or power-efficient computing. Among the examined solutions, Approximate Computing has attracted an ever-increasing interest, with research works applying approximations across the entire traditional computing stack, i.e., at software, hardware, and architectural levels. Over the last decade, there is a plethora of approximation techniques in software (programs, frameworks, compilers, runtimes, languages), hardware (circuits, accelerators), and architectures (processors, memories). The current article is Part I of our comprehensive survey on Approximate Computing, and it reviews its motivation, terminology and principles, as well it classifies and presents the technical details of the state-of-the-art software and hardware approximation techniques.Comment: Under Review at ACM Computing Survey

Machine Learning Techniques to Evaluate the Approximation of Utilization Power in Circuits

The need for products that are more streamlined, more useful, and have longer battery lives is rising in today's culture. More components are being integrated onto smaller, more complex chips in order to do this. The outcome is higher total power consumption as a result of increased power dissipation brought on by dynamic and static currents in integrated circuits (ICs). For effective power planning and the precise application of power pads and strips by floor plan engineers, estimating power dissipation at an early stage is essential. With more information about the design attributes, power estimation accuracy increases. For a variety of applications, including function approximation, regularization, noisy interpolation, classification, and density estimation, they offer a coherent framework. RBFNN training is also quicker than training multi-layer perceptron networks. RBFNN learning typically comprises of a linear supervised phase for computing weights, followed by an unsupervised phase for determining the centers and widths of the Gaussian basis functions. This study investigates several learning techniques for estimating the synaptic weights, widths, and centers of RBFNNs. In this study, RBF networks—a traditional family of supervised learning algorithms—are examined.  Using centers found using k-means clustering and the square norm of the network coefficients, respectively, two popular regularization techniques are examined. It is demonstrated that each of these RBF techniques are capable of being rewritten as data-dependent kernels. Due to their adaptability and quicker training time when compared to multi-layer perceptron networks, RBFNNs present a compelling option to conventional neural network models. Along with experimental data, the research offers a theoretical analysis of these techniques, indicating competitive performance and a few advantages over traditional kernel techniques in terms of adaptability (ability to take into account unlabeled data) and computing complexity. The research also discusses current achievements in using soft k-means features for image identification and other tasks

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount