Early Component-Based System Reliability Analysis for Approximate Computing Systems

A key enabler of real applications on approximate computing systems is the availability of instruments to analyze system reliability, early in the design cycle. Accurately measuring the impact on system reliability of any change in the technology, circuits, microarchitecture and software is most of the time a multi-team multi-objective problem and reliability must be traded off against other crucial design attributes (or objectives) such as power, performance and cost. Unfortunately, tools and models for cross-layer reliability analysis are still at their early stages compared to other very mature design tools and this represents a major issue for mainstream applications. This paper presents preliminary information on a cross-layer framework built on top of a Bayesian model designed to perform component-based reliability analysis of complex systems

Connecting Different Worlds - Technology Abstraction for Reliability-Aware Design and Test

PACS 85.40International audienceThe rapid shrinking of device geometries in the nanometer regime requires new technology-aware design methodologies. These must be able to evaluate the resilience of the circuit throughout all System on Chip (SoC) abstraction levels. To successfully guide design decisions at the system level, reliability models, which abstract technology information, are required to identify those parts of the system where additional protection in the form of hardware or software countermeasures is most effective. Interfaces such as the presented Resilience Articulation Point (RAP) or the Reliability Interchange Information Format (RIIF) are required to enable EDA-assisted analysis and propagation of reliability information. The models are discussed from different perspectives, such as design and test

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems