16,689 research outputs found

    Report on the Status of Payday Lending in California

    Get PDF
    Provides an overview of storefront and Internet payday lending in California, its effects, state and federal laws and regulations, and reform efforts. Includes recommendations for state and local policy, banking access, and consumer education

    Greening Consumer Electronics: Moving Away From Bromine and Chlorine

    Get PDF
    Presents case studies of seven electronics companies that have engineered environmental solutions that eliminate the use of most brominated and chlorinated chemicals that generate toxic materials. Discusses global standards and regulations

    Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections

    Get PDF
    After gathering sufficient microstructural evidence that a practical high-temperature lead-free solder could be produced through liquid-phase diffusion bonding (LPDB) of gas-atomized Cu-Ni powder blended with SN100C (Sn-0.7Cu-0.05Ni, wt.%) commercial solder powder, additional research was completed to enable design of a prototype composite solder paste. By reviewing several experimental alternatives to LPDB for use as replacements and improvements to the currently-used high-Pb solders (which will inevitably be banned by the EU’s RoHS directive), the choice to pursue the prototype solder paste research was verified. One key difference between this research and that of others is the method of pre-alloying Cu with Ni before atomization of the metal powder particles. These Ni additions prevent a detrimental unit cell volume change from occurring in typical Sn-Cu solder alloys by suppressing the hexagonal-to-monoclinic isothermal phase transformation upon cooling during reflow to below 186ðC. Rapid diffusion of the Ni and Cu was explored in order to better design the composite paste’s suggested reflow profile. Research to study and maximize the grain boundary diffusion of Ni and its effect on the resulting intermetallic compounds helped determine the final composition of the composite paste for use in industry

    The case of Foxconn in Turkey: benefiting from free labour and anti-union policy

    Get PDF
    Starting from the 2000s Foxconn invested in Czechia, Slovakia, Hungary, Russia and Turkey, implementing a territorial diversification strategy aimed at getting nearer to its end markets. This chapter investigates the development of Foxconn in Turkey where the multinational owns a plant with about 400 workers. A few kilometres from the city of \uc7orlu and close to highways, ports and international airports, the plant enables Foxconn to implement an efficient global supply chain. We illustrate this process by examining the company\u2019s localisation within a special economic zone, underlining the economic advantages derived from such a tax regime, bringing labour costs down to the Chinese level and obtaining proximity to European, North African and Middle East customers, thus lowering logistic costs. We also analyse the roles of labour flexibility and trade unions. In order to impose far-reaching flexibility on its workers Foxconn put in place a range of strategies, including an hours bank system, multitask operators and the recruitment of apprentices thanks a special programme funded by the state. We show how these have been crucial for Foxconn\u2019s just-in-time production contrasting its labour turnover problem. Finally, we highlight how the company has been able to implement a flexible working pattern, weaken the trade unions and undercut workers\u2019 opposition, thanks to favourable labour laws approved by successive governments in the past thirty years

    Introduction

    Get PDF
    This book investigates restructuring in the electronics industry and in particular the impact of a \u2018Chinese\u2019 labour regime on work and employ - ment practices in electronics assembly in Europe.1 Electronics is an extremely dynamic sector, characterized by an ever-changing organi - zational structure, as well as cut-throat competition, particularly in manufacturing. Located primarily in East Asia, electronics assembly has become notorious for poor working conditions, low unionisation and authoritarian labour relations. However, hostile labour relations and topdown HR policies are not unique to East Asia. They have become associated with the way the sector is governed more broadly, with a number of Western companies also coming to rely on such practices

    Flexible workforces and low profit margins: electronics assembly between Europe and China

    Get PDF
    This book investigates restructuring in the electronics industry and in particular the impact of a \u2018Chinese\u2019 labour regime on work and employ - ment practices in electronics assembly in Europe.1 Electronics is an extremely dynamic sector, characterized by an ever-changing organi - zational structure, as well as cut-throat competition, particularly in manufacturing. Located primarily in East Asia, electronics assembly has become notorious for poor working conditions, low unionisation and authoritarian labour relations. However, hostile labour relations and topdown HR policies are not unique to East Asia. They have become associated with the way the sector is governed more broadly, with a number of Western companies also coming to rely on such practices
    • …
    corecore