Workshop on "Robotic assembly of 3D MEMS".

Proceedings of a workshop proposed in IEEE IROS'2007.The increase of MEMS' functionalities often requires the integration of various technologies used for mechanical, optical and electronic subsystems in order to achieve a unique system. These different technologies have usually process incompatibilities and the whole microsystem can not be obtained monolithically and then requires microassembly steps. Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve high-performance MEMS. Moreover, microassembly also permits to develop suitable MEMS packaging as well as 3D components although microfabrication technologies are usually able to create 2D and "2.5D" components. The study of microassembly methods is consequently a high stake for MEMS technologies growth. Two approaches are currently developped for microassembly: self-assembly and robotic microassembly. In the first one, the assembly is highly parallel but the efficiency and the flexibility still stay low. The robotic approach has the potential to reach precise and reliable assembly with high flexibility. The proposed workshop focuses on this second approach and will take a bearing of the corresponding microrobotic issues. Beyond the microfabrication technologies, performing MEMS microassembly requires, micromanipulation strategies, microworld dynamics and attachment technologies. The design and the fabrication of the microrobot end-effectors as well as the assembled micro-parts require the use of microfabrication technologies. Moreover new micromanipulation strategies are necessary to handle and position micro-parts with sufficiently high accuracy during assembly. The dynamic behaviour of micrometric objects has also to be studied and controlled. Finally, after positioning the micro-part, attachment technologies are necessary

Positioning accuracy characterization of assembled microscale components for micro-optical benches

International audienceThis paper deals with the measurement of microscale components' positioning accuracies used in the assembly of Micro-Optical Benches (MOB). The concept of MOB is presented to explain how to build optical MEMS based on out-of-plane micro-assembly of microcomponents. The micro-assembly platform is then presented and used to successfully assemble MOB. This micro-assembly platform includes a laser sensor that enables the measure of the microcomponent's position after its assembly. The measurement set-up and procedure is displayed and applied on several micro-assembly sets. The measurement system provides results with a maximum deviation less than +/- 0.005°. Based on this measurement system and micro-assembly procedure, the article shows that it is possible to obtain a positioning errors down to 0.009°. These results clearly state that micro-assembly is a possible way to manufacture complex, heterogeneous and 3D optical MEMS with very good optical performances

Workshop on "Control issues in the micro / nano - world".

International audienceDuring the last decade, the need of systems with micro/nanometers accuracy and fast dynamics has been growing rapidly. Such systems occur in applications including 1) micromanipulation of biological cells, 2) micrassembly of MEMS/MOEMS, 3) micro/nanosensors for environmental monitoring, 4) nanometer resolution imaging and metrology (AFM and SEM). The scale and requirement of such systems present a number of challenges to the control system design that will be addressed in this workshop. Working in the micro/nano-world involves displacements from nanometers to tens of microns. Because of this precision requirement, environmental conditions such as temperature, humidity, vibration, could generate noise and disturbance that are in the same range as the displacements of interest. The so-called smart materials, e.g., piezoceramics, magnetostrictive, shape memory, electroactive polymer, have been used for actuation or sensing in the micro/nano-world. They allow high resolution positioning as compared to hinges based systems. However, these materials exhibit hysteresis nonlinearity, and in the case of piezoelectric materials, drifts (called creep) in response to constant inputs In the case of oscillating micro/nano-structures (cantilever, tube), these nonlinearities and vibrations strongly decrease their performances. Many MEMS and NEMS applications involve gripping, feeding, or sorting, operations, where sensor feedback is necessary for their execution. Sensors that are readily available, e.g., interferometer, triangulation laser, and machine vision, are bulky and expensive. Sensors that are compact in size and convenient for packaging, e.g., strain gage, piezoceramic charge sensor, etc., have limited performance or robustness. To account for these difficulties, new control oriented techniques are emerging, such as[d the combination of two or more ‘packageable' sensors , the use of feedforward control technique which does not require sensors, and the use of robust controllers which account the sensor characteristics. The aim of this workshop is to provide a forum for specialists to present and overview the different approaches of control system design for the micro/nano-world and to initiate collaborations and joint projects

Optical MEMS Switches: Theory, Design, and Fabrication of a New Architecture

The scalability and cost of microelectromechanical systems (MEMS) optical switches are now the important factors driving the development of MEMS optical switches technology. The employment of MEMS in the design and fabrication of optical switches through the use of micromachining fabricated micromirrors expands the capability and integrity of optical backbone networks. The focus of this dissertation is on the design, fabrication, and implementation of a new type of MEMS optical switch that combines the advantages of both 2-D and 3-D MEMS switch architectures. This research presents a new digital MEMS switch architecture for 1×N and N×N optical switches. The architecture is based on a new microassembled smart 3-D rotating inclined micromirror (3DRIM). The 3DRIM is the key device in the new switch architectures. The 3DRIM was constructed through a microassembly process using a passive microgripper, key, and inter-lock (PMKIL) assembly system. An electrostatic micromotor was chosen as the actuator for the 3DRIM since it offers continuous rotation as well as small, precise step motions with excellent repeatability that can achieve repeatable alignment with minimum optical insertion loss between the input and output ports of the switch. In the first 3DRIM prototype, a 200×280 microns micromirror was assembled on the top of the electrostatic micromotor and was supported through two vertical support posts. The assembly technique was then modified so that the second prototype can support micromirrors with dimensions up to 400×400 microns. Both prototypes of the 3DRIM are rigid and stable during operation. Also, rotor pole shaping (RPS) design technique was introduced to optimally reshape the physical dimensions of the rotor pole in order to maximize the generated motive torque of the micromotor and minimize the required driving voltage signal. The targeted performance of the 3DRIM was achieved after several PolyMUMPs fabrication runs. The new switch architecture is neither 2-D nor 3-D. Since it is composed of two layers, it can be considered 2.5-D. The new switch overcomes many of the limitations of current traditional 2-D MEMS switches, such as limited scalability and large variations in the insertion loss across output ports. The 1×N MEMS switch fabric has the advantage of being digitally operated. It uses only one 3DRIM to switch the light signal from the input port to any output port. The symmetry employed in the switch design gives it the ability to incorporate a large number of output ports with uniform insertion losses over all output channels, which is not possible with any available 2-D or 3-D MEMS switch architectures. The second switch that employs the 3DRIM is an N×N optical cross-connect (OXC) switch. The design of an N×N OXC uses only 2N of the 3DRIM, which is significantly smaller than the N×N switching micromirrors used in 2-D MEMS architecture. The new N×N architecture is useful for a medium-sized OXC and is simpler than 3-D architecture. A natural extension of the 3DRIM will be to extend its application into more complex optical signal processing, i.e., wavelength-selective switch. A grating structures have been selected to explore the selectivity of the switch. For this reason, we proposed that the surface of the micromirror being replaced by a suitable gratings instead of the flat reflective surface. Thus, this research has developed a rigorous formulation of the electromagnetic scattered near-field from a general-shaped finite gratings in a perfect conducting plane. The formulation utilizes a Fourier-transform representation of the scattered field for the rapid convergence in the upper half-space and the staircase approximation to represent the field in the general-shaped groove. This method provides a solution for the scattered near-field from the groove and hence is considered an essential design tool for near-field manipulation in optical devices. Furthermore, it is applicable for multiple grooves with different profiles and different spacings. Each groove can be filled with an arbitrary material and can take any cross-sectional profile, yet the solution is rigorous because of the rigorous formulations of the fields in the upper-half space and the groove reigns. The efficient formulation of the coefficient matrix results in a banded-matrix form for an efficient and time-saving solution

Overview of microgrippers and design of a micro-manipulation station based on a MMOC microgripper

International audienceThis paper deals with an overview of recent microgrippers. As the end-effectors of micromanipulation systems, microgrippers are crucial point of such systems for their efficiency and their reliability. The performances of current microgrippers are presented and offer a stroke extending from 50 m to approximately 2mm and a maximum forces varying from 0,1mN to 600 mN. Then, micromanipulation system based on a piezoelectric microgripper and a SCARA robot is presented

Modular robotic platform for silicon micromechanical assembly.

International audienceAs no reliable methods is available to manipulate component whose typical size is up to 100μm, current industrial assembled products contained only components down to this physical limit. In that scale, micro-assembly requires specific handling strategies to overcome adhesion and high precision robots. This paper deals with an original robotic system able to perform reliable micro-assembly of silicon microobjects whose sizes are tens of micrometers. Original hybrid handling strategies between gripping and adhesion handling are proposed. An experimental robotic structure composed of micropositionning stages, videomicroscopes, piezogripper, and silicon end-effectors is presented. A modular control architecture is proposed to easily design and modify the robotic structure. Some experimental teleoperated micromanipulations and micro-assemblies have validated the proposed methods and the reliability of the principles. Future works will be focused on micro-assembly automation

Design, characterisation and testing of SU8 polymer based electrothermal microgrippers

Microassembly systems are designed to combine micro-component parts with high accuracy. These micro-components are fabricated using different manufacturing processes in sizes of several micrometers. This technology is essential to produce miniaturised devices and equipment, especially those built from parts requiring different fabrication procedures. The most important task in microassembly systems is the manipulator, which should have the ability to handle and control micro-particles. Different techniques have been developed to carry out this task depending on the application, required accuracy, and cost. In this thesis, the most common methods are identified and briefly presented, and some advantages and disadvantages are outlined. A microgripper is the most important device utilized to handle micro-objects with high accuracy. However, it is a device that can be used only in sequential microassembly techniques. It has the potential to become the most important tool in the field of micro-robotics, research and development, and assembly of parts with custom requirements. Different actuation mechanisms are employed to design microgrippers such as electromagnetic force, electrostatic force, piezoelectric effect, and electrothermal expansions. Also, different materials are used to fabricate these microgrippers, for example metals, silicon, and polymers such as SU-8. To investigate the limitation and disadvantages of the conventional SU-8 electrothermal based microgrippers, different devices designed and fabricated at IMT, Romania, were studied. The results of these tests showed a small end-effector displacement and short cycling on/off (lifetime). In addition, the actuator part of these microgrippers was deformed after each operation, which results in reduced displacement and inconsistent openings at off state every time it was operated in a power ON/OFF cycle. One of these limitations was caused by the existence of conductors in arms of the end-effectors. These conductor designs have two disadvantages: firstly, it raises temperature in the arms and causing an expansion in the opposite direction of the desired displacement. Secondly, since the conductors pass through the hinges, they should be designed wide enough to reduce the conductor resistance as much as possible. Therefore, the wider the hinges are, the higher the in-plane stiffness and the less out of plane deflection. As a result, it increases the reaction force of the arm reducing the effect of deformation. Based on these limitations a new actuatorstructure of L-shape was proposed to reduce the effects of these drawbacks. This actuator has no conductor in the hinges or the arms of the end-effectors which reduce limitation on the hinge width. . In addition, a further development of this actuator was proposed to increase the stiffness of the actuator by doubling its thickness compared with the other parts of the griper. The results of this actuator proved the improvement in performance and reduction of the actuator deformation. This new actuator structure was used to design several different microgrippers with large displacement and suitable for a wide range of applications. Demonstrations of the capabilities of the microgrippers to be used in microassembly are presented. In addition, a novel tri-directional microactuator is proposed in this thesis. This actuator’s end-effector is capable of displacements in three different directions. This actuator was used with the other designs to develop a novel three-arm (three fingers) multidirectional microgripper. To study the microgripper displacement as a function to the heater temperature, the TCR of the conductor layer of each device was measured. Because different configurations of conductor layers were studied, a significant effect of the metal layer structure on TCR was discovered. The TCR value of gold film is reduced significantly by adding the chromium layers below and about it which were used to improve the adhesion between the gold film and the SU layers. In this thesis, a new method based on a robotic system was developed to characterise these microgrippers and to study the steady state, dynamic response, and reliability (lifetime cycling on/off). An electronic interface was developed and integrated to the robotic system to control and drive the microgrippers. This new system was necessary to carry out automated testing of the microgrippers with accurate and reliable results. Four different new groups of microgrippers were designed and studied. The first group was indirectly actuated using an L-Shaped actuator and two different actuator widths. The initial opening was 120 μm for both designs. The maximum displacement was about 140 μm for both designs. However, the actuator in the wider heater width showed more stable behavior during the cycling and the dynamic tests. The second group was based on direct actuation approach using the L-Shaped actuator. There were eight different designs based on this method with different heater conductor shape, actuator width, and arm thickness. The initial opening was 100 μm and there were different displacements for the eight designs. The study of these microgrippers proved that the actuator stiffness has a significant effect on the microgripper displacement. In addition, the shape of the heater conductor has less effect. The largest displacement achieved using this method of design was about 70 μm. The third group was designed for dual mode operation and has three different designs. The initial openings were 90 μm and 250 μm. The displacement was about 170 μm in both modes. The last microgripper design was a tri-arm design for multi-mode operation. The lifetime study of SU8 based microgrippers in this thesis was the first time such an investigation was carried out. The results of IMT designs showed that the larger is the displacement the less stable is the gripper design because of the high rection force acting on the actuators. The L-shape based microgrippers had better performance and they did not break after more than 400 cycles. In addition, the studies of static displacement and dynamic response of different designed microgripper proved that better performance of the proposed actuator can be obtained by using double thickness for the actuator as compared to the arm thickness

A micromanipulation setup for comparative tests of microgrippers

A micromanipulation setup allowing comparative tests of manipulation micro tools has been developed. Repeatability measurements of positioning as well as optimization of manipulation conditions can be run with parts of typically 5 to 50μm over a large set of parameters including environment conditions, substrate and tip specifications, and different strategies (robot trajectories at picking and releasing time). The workstation consists of a high precise parallel robot, the Delta3, to position the gripper, linear stages to place the parts in the field of view and two microscopes for the visual feedback and position measurement. The setup is placed in a chamber for controlling relative humidity and temperature. An interface was developed to integrate every kind of tool on the robot. Automated operations and measurement have been carried out based on localization and tracking of micro objects and gripper. Integration of micro tools was successfully accomplished and comparative tests were executed with micro tweezers. Sub micrometer position repeatability was achieved with a success rate of pick and pick operations of 95%

Automatic Microassembly of Tissue Engineering Scaffold

Ph.DDOCTOR OF PHILOSOPH

Surface characterization of polyvinylidene fluoride (pvdf) in its application as an actuator

Polyvinylidene Fluoride (PVDF) is a common piezoelectric polymer. It is widely utilized because of its advantageous mechanical, chemical, and electromechanical properties. An interesting application for its properties lies in using it as an actuator, specifically for a microgripper device. The microgripper has many applications such as surgeries, microassembly, and micromanipulation. The friction force is an important criterion that greatly affects the gripping. This research studies the frictional behavior of the PVDF and effects of applied electrical potential. Approaches include tribological investigation of the polymer associated with surface properties. The surface characterization was conducted using a profilometer and an Atomic Force Microscope (AFM). In addition, the application of a PVDF material as a microgripper is addressed along with the design of the gripper. It was found that the friction could be turned-on and off because of external applied electrical potential. Such behavior was associated with the microstructure, where dipoles were aligned in an electrical field. Such active-friction has not been reported in the past. This work opens new areas of research in fundamental friction that benefits the design and development of small devices such as a microgripper