Design of a Scan Chain for Side Channel Attacks on AES Cryptosystem for Improved Security

Scan chain-based attacks are side-channel attacks focusing on one of the most significant features of hardware test circuitry. A technique called Design for Testability (DfT) involves integrating certain testability components into a hardware design. However, this creates a side channel for cryptanalysis, providing crypto devices vulnerable to scan-based attacks. Advanced Encryption Standard (AES) has been proven as the most powerful and secure symmetric encryption algorithm announced by USA Government and it outperforms all other existing cryptographic algorithms. Furthermore, the on-chip implementation of private key algorithms like AES has faced scan-based side-channel attacks. With the aim of protecting the data for secure communication, a new hybrid pipelined AES algorithm with enhanced security features is implemented. This paper proposes testing an AES core with unpredictable response compaction and bit level-masking throughout the scan chain process. A bit-level scan flipflop focused on masking as a scan protection solution for secure testing. The experimental results show that the best security is provided by the randomized addition of masked scan flipflop through the scan chain and also provides minimal design difficulty and power expansion overhead with some negligible delay measures. Thus, the proposed technique outperforms the state-of-the-art LUT-based S-box and the composite sub-byte transformation model regarding throughput rate 2 times and 15 times respectively. And security measured in the avalanche effect for the sub-pipelined model has been increased up to 95 per cent with reduced computational complexity. Also, the proposed sub-pipelined S-box utilizing a composite field arithmetic scheme achieves 7 per cent area effectiveness and 2.5 times the hardware complexity compared to the LUT-based model

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Design for Test and Hardware Security Utilizing Tester Authentication Techniques

Design-for-Test (DFT) techniques have been developed to improve testability of integrated circuits. Among the known DFT techniques, scan-based testing is considered an efficient solution for digital circuits. However, scan architecture can be exploited to launch a side channel attack. Scan chains can be used to access a cryptographic core inside a system-on-chip to extract critical information such as a private encryption key. For a scan enabled chip, if an attacker is given unlimited access to apply all sorts of inputs to the Circuit-Under-Test (CUT) and observe the outputs, the probability of gaining access to critical information increases. In this thesis, solutions are presented to improve hardware security and protect them against attacks using scan architecture. A solution based on tester authentication is presented in which, the CUT requests the tester to provide a secret code for authentication. The tester authentication circuit limits the access to the scan architecture to known testers. Moreover, in the proposed solution the number of attempts to apply test vectors and observe the results through the scan architecture is limited to make brute-force attacks practically impossible. A tester authentication utilizing a Phase Locked Loop (PLL) to encrypt the operating frequency of both DUT/Tester has also been presented. In this method, the access to the critical security circuits such as crypto-cores are not granted in the test mode. Instead, a built-in self-test method is used in the test mode to protect the circuit against scan-based attacks. Security for new generation of three-dimensional (3D) integrated circuits has been investigated through 3D simulations COMSOL Multiphysics environment. It is shown that the process of wafer thinning for 3D stacked IC integration reduces the leakage current which increases the chip security against side-channel attacks

SCAN CHAIN BASED HARDWARE SECURITY

Hardware has become a popular target for attackers to hack into any computing and communication system. Starting from the legendary power analysis attacks discovered 20 years ago to the recent Intel Spectre and Meltdown attacks, security vulnerabilities in hardware design have been exploited for malicious purposes. With the emerging Internet of Things (IoT) applications, where the IoT devices are extremely resource constrained, many proven secure but computational expensive cryptography protocols cannot be applied on such devices. Thus there is an urgent need to understand the hardware vulnerabilities and develop cost effective mitigation methods. One established field in the semiconductor and integrated circuit (IC) industry, known as IC test, has the goal of ensuring that fabricated ICs are free of manufacturing defects and perform the required functionalities. Testing is essential to isolate faulty chips from good ones. The concept of design for test (DFT) has been integrated in the commercial IC design and fabrication process for several decades. Scan chain, which provides test engineer access to all the flip flops in the chip through the scan in (SI) and scan out (SO) ports, is the backbone of industrial testing methods and can be found in almost all the modern designs. In addition to IC testing, scan chain has found applications in intellectual property (IP) protection and IC identification. However, attackers can also leverage the controllability and observability of scan chain as a side channel to break systems such as cryptographic chips. This dissertation addresses these two important security problems by proposing (1) a practical scan chain based security primitive for IP protection and (2) a partial scan chain framework that can mitigate all the existing scan based attacks. First, we observe the fact that each D-flip-flop has two output ports, Q and Q’, designed to simplify the logic and has been used to reduce the power consumption for IC test. The availability of both Q and Q’ ports provide the opportunity for IP protection. More specifically, we can generate a digital fingerprint by selecting different connection styles between adjacent scan cells during the design of scan chain. This method has two major advantages: fingerprints are created as a post-silicon procedure and therefore there will be little fabrication overhead; altering the connection style requires the modification of test vectors for each fingerprinted IP and thus enables a non-intrusive fingerprint verification method. This addresses the overhead and detectability problems, two of the most challenging problems of designing practical IP fingerprinting techniques in the past two decades. Combined with the recently developed reconfigurable scan networks (RSNs) that are popular for embedded and IoT devices, we design an IC identification (ID) scheme utilizing the different connection styles. We perform experiments on standard benchmarks to demonstrate that our approach has low design overhead. We also conduct security analysis to show that such fingerprints and IC IDs are robust against various attacks. In the second part of this dissertation, we consider the scan chain side channel attack, which has been reported as one of the most severe side channel attacks to modern secure systems. We argue that the current countermeasures are restricted to the requirement of providing direct SI and SO for testing and thus suffers the vulnerability of leaving this side channel open to the attackers as well. Therefore, we propose a novel public-private partial scan chain based approach with the basic idea of removing the flip flops that store sensitive information from the scan chain. This will eliminate the scan chain side channel, but it also limits IC test. The key contribution in our proposed public-private partial scan chain design is that it can keep the full test coverage while providing security to the scan chain. This is achieved by chaining the removed flip flops into one or more private partial scan chains and adding protections to the SI and SO ports of such chains. Unlike the traditional partial scan design which not only fails to provide full fault coverage, but also incur huge overhead in test time and test vector generation time, we propose a set of techniques to ensure that the desired test vectors can be entered into the system efficiently. These techniques include test vector reordering, test vector reusing, and test vector generation based on a novel finite state machine (FSM) structure we have invented. On the other hand, to enable the test engineers the ability to observe the test output to diagnose the chip while not leaking information to the attackers, we propose two lightweight mechanisms, one based on linear feedback shift register (LFSR) and the other one based on configurable physical unclonable function (PUF). Finally, we discuss a protocol on how in-field test can be realized using our public-private partial scan chain. We conduct experiments with industrial scan design tools to demonstrate that the required hardware in our approach has negligible area overhead and gives full test coverage with reduced test time and does not need to re-generate test vectors. In sum, this dissertation focuses on the role of scan chain, a conventional design for test facility, in hardware security. We show that scan chain features can be leveraged to create practical IP protection techniques including IP watermarking and fingerprinting as well as IC identification and authentication. We also propose a novel public-private partial scan design principle to close the scan chain side channel to the attackers. Through this dissertation work, we demonstrate that it is possible to develop highly practical scan chain based techniques that can benefit both the community of IC test and hardware security

Design and test for timing uncertainty in VLSI circuits.

由於特徵尺寸不斷縮小，集成電路在生產過程中的工藝偏差在運行環境中溫度和電壓等參數的波動以及在使用過程中的老化等效應越來越嚴重，導致芯片的時序行為出現很大的不確定性。多數情況下，芯片的關鍵路徑會不時出現時序錯誤。加入更多的時序餘量不是一種很好的解決方案，因為這種保守的設計方法會抵消工藝進步帶來的性能上的好處。這就為設計一個時序可靠的系統提出了極大的挑戰，其中的一些關鍵問題包括：(一)如何有效地分配有限的功率預算去優化那些正爆炸式增加的關鍵路徑的時序性能；(二)如何產生能夠捕捉準確的最壞情況時延的高品質測試向量；(三)為了能夠取得更好的功耗和性能上的平衡，我們將不得不允許芯片在使用過程中出現一些頻率很低的時序錯誤。隨之而來的問題是如何做到在線的檢錯和糾錯。為了解決上述問題，我們首先發明了一種新的技術用於識別所謂的虛假路徑，該方法使我們能夠發現比傳統方法更多的虛假路徑。當將所提取的虛假路徑集成到靜態時序分析工具里以後，我們可以得到更為準確的時序分析結果，同時也能節省本來用於優化這些路徑的成本。接著，考慮到現有的延時自動向量生成(ATPG) 方法會產生功能模式下無法出現的測試向量，這種向量可能會造成測試過程中在被激活的路徑周圍出現過多(或過少)的電源噪聲(PSN) ，從而導致測試過度或者測試不足情況。為此，我們提出了一種新的偽功能ATPG工具。通過同時考慮功能約束以及電路的物理佈局信息，我們使用類似ATPG 的算法產生狀態跳變使其能最大化已激活的路徑周圍的PSN影響。最後，基於近似電路的原理，我們提出了一種新的在線原位校正技術，即InTimeFix，用於糾正時序錯誤。由於實現近似電路的綜合僅需要簡單的電路結構分析，因此該技術能夠很容易的擴展到大型電路設計上去。With technology scaling, integrated circuits (ICs) suffer from increasing process, voltage, and temperature (PVT) variations and aging effects. In most cases, these reliability threats manifest themselves as timing errors on speed-paths (i.e., critical or near-critical paths) of the circuit. Embedding a large design guard band to prevent timing errors to occur is not an attractive solution, since this conservative design methodology diminishes the benefit of technology scaling. This creates several challenges on build a reliable systems, and the key problems include (i) how to optimize circuit’s timing performance with limited power budget for explosively increased potential speed-paths; (ii) how to generate high quality delay test pattern to capture ICs’ accurate worst-case delay; (iii) to have better power and performance tradeoff, we have to accept some infrequent timing errors in circuit’s the usage phase. Therefore, the question is how to achieve online timing error resilience.To address the above issues, we first develop a novel technique to identify so-called false paths, which facilitate us to find much more false paths than conventional methods. By integrating our identified false paths into static timing analysis tool, we are able to achieve more accurate timing information and also save the cost used to optimize false paths. Then, due to the fact that existing delay automated test pattern generation (ATPG) methods may generate test patterns that are functionally-unreachable, and such patterns may incur excessive (or limited) power supply noise (PSN) on sensitized paths in test mode, thus leading to over-testing or under-testing of the circuits, we propose a novel pseudo-functional ATPG tool. By taking both circuit layout information and functional constrains into account, we use ATPG like algorithm to justify transitions that pose the maximized functional PSN effects on sensitized critical paths. Finally, we propose a novel in-situ correction technique to mask timing errors, namely InTimeFix, by introducing redundant approximation circuit with more timing slack for speed-paths into the design. The synthesis of the approximation circuit relies on simple structural analysis of the original circuit, which is easily scalable to large IC designs.Detailed summary in vernacular field only.Detailed summary in vernacular field only.Yuan, Feng.Thesis (Ph.D.)--Chinese University of Hong Kong, 2012.Includes bibliographical references (leaves 88-100).Abstract also in Chinese.Abstract --- p.iAcknowledgement --- p.ivChapter 1 --- Introduction --- p.1Chapter 1.1 --- Challenges to Solve Timing Uncertainty Problem --- p.2Chapter 1.2 --- Contributions and Thesis Outline --- p.5Chapter 2 --- Background --- p.7Chapter 2.1 --- Sources of Timing Uncertainty --- p.7Chapter 2.1.1 --- Process Variation --- p.7Chapter 2.1.2 --- Runtime Environment Fluctuation --- p.9Chapter 2.1.3 --- Aging Effect --- p.10Chapter 2.2 --- Technical Flow to Solve Timing Uncertainty Problem --- p.10Chapter 2.3 --- False Path --- p.12Chapter 2.3.1 --- Path Sensitization Criteria --- p.12Chapter 2.3.2 --- False Path Aware Timing Analysis --- p.13Chapter 2.4 --- Manufacturing Testing --- p.14Chapter 2.4.1 --- Functional Testing vs. Structural Testing --- p.14Chapter 2.4.2 --- Scan-Based DfT --- p.15Chapter 2.4.3 --- Pseudo-Functional Testing --- p.17Chapter 2.5 --- Timing Error Tolerance --- p.19Chapter 2.5.1 --- Timing Error Detection --- p.19Chapter 2.5.2 --- Timing Error Recover --- p.20Chapter 3 --- Timing-Independent False Path Identification --- p.23Chapter 3.1 --- Introduction --- p.23Chapter 3.2 --- Preliminaries and Motivation --- p.26Chapter 3.2.1 --- Motivation --- p.27Chapter 3.3 --- False Path Examination Considering Illegal States --- p.28Chapter 3.3.1 --- Path Sensitization Criterion --- p.28Chapter 3.3.2 --- Path-Aware Illegal State Identification --- p.30Chapter 3.3.3 --- Proposed Examination Procedure --- p.31Chapter 3.4 --- False Path Identification --- p.32Chapter 3.4.1 --- Overall Flow --- p.34Chapter 3.4.2 --- Static Implication Learning --- p.35Chapter 3.4.3 --- Suspicious Node Extraction --- p.36Chapter 3.4.4 --- S-Frontier Propagation --- p.37Chapter 3.5 --- Experimental Results --- p.38Chapter 3.6 --- Conclusion and Future Work --- p.42Chapter 4 --- PSN Aware Pseudo-Functional Delay Testing --- p.43Chapter 4.1 --- Introduction --- p.43Chapter 4.2 --- Preliminaries and Motivation --- p.45Chapter 4.2.1 --- Motivation --- p.46Chapter 4.3 --- Proposed Methodology --- p.48Chapter 4.4 --- Maximizing PSN Effects under Functional Constraints --- p.50Chapter 4.4.1 --- Pseudo-Functional Relevant Transitions Generation --- p.51Chapter 4.5 --- Experimental Results --- p.59Chapter 4.5.1 --- Experimental Setup --- p.59Chapter 4.5.2 --- Results and Discussion --- p.60Chapter 4.6 --- Conclusion --- p.64Chapter 5 --- In-Situ Timing Error Masking in Logic Circuits --- p.65Chapter 5.1 --- Introduction --- p.65Chapter 5.2 --- Prior Work and Motivation --- p.67Chapter 5.3 --- In-Situ Timing Error Masking with Approximate Logic --- p.69Chapter 5.3.1 --- Equivalent Circuit Construction with Approximate Logic --- p.70Chapter 5.3.2 --- Timing Error Masking with Approximate Logic --- p.72Chapter 5.4 --- Cost-Efficient Synthesis for InTimeFix --- p.75Chapter 5.4.1 --- Overall Flow --- p.76Chapter 5.4.2 --- Prime Critical Segment Extraction --- p.77Chapter 5.4.3 --- Prime Critical Segment Merging --- p.79Chapter 5.5 --- Experimental Results --- p.81Chapter 5.5.1 --- Experimental Setup --- p.81Chapter 5.5.2 --- Results and Discussion --- p.82Chapter 5.6 --- Conclusion --- p.85Chapter 6 --- Conclusion and Future Work --- p.86Bibliography --- p.10

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

<p>As integrated circuits (ICs) continue to scale to smaller dimensions, long interconnects</p><p>have become the dominant contributor to circuit delay and a significant component of</p><p>power consumption. In order to reduce the length of these interconnects, 3D integration</p><p>and 3D stacked ICs (3D SICs) are active areas of research in both academia and industry.</p><p>3D SICs not only have the potential to reduce average interconnect length and alleviate</p><p>many of the problems caused by long global interconnects, but they can offer greater design</p><p>flexibility over 2D ICs, significant reductions in power consumption and footprint in</p><p>an era of mobile applications, increased on-chip data bandwidth through delay reduction,</p><p>and improved heterogeneous integration.</p><p>Compared to 2D ICs, the manufacture and test of 3D ICs is significantly more complex.</p><p>Through-silicon vias (TSVs), which constitute the dense vertical interconnects in a</p><p>die stack, are a source of additional and unique defects not seen before in ICs. At the same</p><p>time, testing these TSVs, especially before die stacking, is recognized as a major challenge.</p><p>The testing of a 3D stack is constrained by limited test access, test pin availability,</p><p>power, and thermal constraints. Therefore, efficient and optimized test architectures are</p><p>needed to ensure that pre-bond, partial, and complete stack testing are not prohibitively</p><p>expensive.</p><p>Methods of testing TSVs prior to bonding continue to be a difficult problem due to test</p><p>access and testability issues. Although some built-in self-test (BIST) techniques have been</p><p>proposed, these techniques have numerous drawbacks that render them impractical. In this dissertation, a low-cost test architecture is introduced to enable pre-bond TSV test through</p><p>TSV probing. This has the benefit of not needing large analog test components on the die,</p><p>which is a significant drawback of many BIST architectures. Coupled with an optimization</p><p>method described in this dissertation to create parallel test groups for TSVs, test time for</p><p>pre-bond TSV tests can be significantly reduced. The pre-bond probing methodology is</p><p>expanded upon to allow for pre-bond scan test as well, to enable both pre-bond TSV and</p><p>structural test to bring pre-bond known-good-die (KGD) test under a single test paradigm.</p><p>The addition of boundary registers on functional TSV paths required for pre-bond</p><p>probing results in an increase in delay on inter-die functional paths. This cost of test</p><p>architecture insertion can be a significant drawback, especially considering that one benefit</p><p>of 3D integration is that critical paths can be partitioned between dies to reduce their delay.</p><p>This dissertation derives a retiming flow that is used to recover the additional delay added</p><p>to TSV paths by test cell insertion.</p><p>Reducing the cost of test for 3D-SICs is crucial considering that more tests are necessary</p><p>during 3D-SIC manufacturing. To reduce test cost, the test architecture and test</p><p>scheduling for the stack must be optimized to reduce test time across all necessary test</p><p>insertions. This dissertation examines three paradigms for 3D integration - hard dies, firm</p><p>dies, and soft dies, that give varying degrees of control over 2D test architectures on each</p><p>die while optimizing the 3D test architecture. Integer linear programming models are developed</p><p>to provide an optimal 3D test architecture and test schedule for the dies in the 3D</p><p>stack considering any or all post-bond test insertions. Results show that the ILP models</p><p>outperform other optimization methods across a range of 3D benchmark circuits.</p><p>In summary, this dissertation targets testing and design-for-test (DFT) of 3D SICs.</p><p>The proposed techniques enable pre-bond TSV and structural test while maintaining a</p><p>relatively low test cost. Future work will continue to enable testing of 3D SICs to move</p><p>industry closer to realizing the true potential of 3D integration.</p>Dissertatio

Design and Validation of Network-on-Chip Architectures for the Next Generation of Multi-synchronous, Reliable, and Reconfigurable Embedded Systems

NETWORK-ON-CHIP (NoC) design is today at a crossroad. On one hand, the design principles to efficiently implement interconnection networks in the resource-constrained on-chip setting have stabilized. On the other hand, the requirements on embedded system design are far from stabilizing. Embedded systems are composed by assembling together heterogeneous components featuring differentiated operating speeds and ad-hoc counter measures must be adopted to bridge frequency domains. Moreover, an unmistakable trend toward enhanced reconfigurability is clearly underway due to the increasing complexity of applications. At the same time, the technology effect is manyfold since it provides unprecedented levels of system integration but it also brings new severe constraints to the forefront: power budget restrictions, overheating concerns, circuit delay and power variability, permanent fault, increased probability of transient faults. Supporting different degrees of reconfigurability and flexibility in the parallel hardware platform cannot be however achieved with the incremental evolution of current design techniques, but requires a disruptive approach and a major increase in complexity. In addition, new reliability challenges cannot be solved by using traditional fault tolerance techniques alone but the reliability approach must be also part of the overall reconfiguration methodology. In this thesis we take on the challenge of engineering a NoC architectures for the next generation systems and we provide design methods able to overcome the conventional way of implementing multi-synchronous, reliable and reconfigurable NoC. Our analysis is not only limited to research novel approaches to the specific challenges of the NoC architecture but we also co-design the solutions in a single integrated framework. Interdependencies between different NoC features are detected ahead of time and we finally avoid the engineering of highly optimized solutions to specific problems that however coexist inefficiently together in the final NoC architecture. To conclude, a silicon implementation by means of a testchip tape-out and a prototype on a FPGA board validate the feasibility and effectivenes