Analysis and Design of Low-Cost Waveguide Filters for Wireless Communications

The area of research of this thesis is built around advanced waveguide filter structures. Waveguide filters and the waveguide technology in general are renowned for high power capacity, low losses and excellent electromagnetic shielding. Waveguide filters are important components in fixed wireless communications as well as in satellite and radar systems. Furthermore, their advantages and utilization become even greater with increase in frequency, which is a trend in modern communication systems because upper frequency bands offer larger channel capacities. However, waveguide filters are relatively bulky and expensive. To comply with more and more demanding miniaturization and cost-cutting requirements, compactness and economical design represent some of the main contemporary focuses of interest. Approaches that are used to achieve this include use of planar inserts to build waveguide discontinuities, additive manufacturing and substrate integration. At the same time, waveguide filters still need to satisfy opposed stringent requirements like small insertion loss, high selectivity and multiband operation. Another difficulty that metal waveguide components face is integration with other circuitry, especially important when solid-state active devices are included. Thus, improvements of interconnections between waveguide and other transmission interfaces are addressed too. The thesis elaborates the following aspects of work: Further analysis and improved explanations regarding advanced waveguide filters with E-plane inserts developed by the Wireless Communications Research Group, using both cross coupled resonators and extracted pole sections (Experiments with higher filter orders, use of tuning screws, degrees of freedom in design, etc. Thorough performance comparison with competing filter technologies) - Proposing novel E-plane filter sections with I-shaped insets - Extension of the E-plane filtering structures with metal fins to new compact dual band filters with high frequency selectivity and miniaturized diplexers. - Introduction of easy-to-build waveguide filters with polymer insert frames and high-performance low-profile cavity filters, taking advantage of enhanced fabrication capabilities when using additive manufacturing - Developing new substrate integrated filters, as well as circuits used to transfer signals between different interfaces Namely, these are substrate integrated waveguide to metal waveguide planar transitions that do not require any modifications of the metal waveguides. Such novel transitions have been designed both for single and orthogonal signal polarizations

A Spoof Surface Plasmon Polaritons (SSPPs) Based Dual-Band-Rejection Filter with Wide Rejection Bandwidth.

This paper presents a novel single-layer dual band-rejection-filter based on Spoof Surface Plasmon Polaritons (SSPPs). The filter consists of an SSPP-based transmission line, as well as six coupled circular ring resonators (CCRRs) etched among ground planes of the center corrugated strip. These resonators are excited by electric-field of the SSPP structure. The added ground on both sides of the strip yields tighter electromagnetic fields and improves the filter performance at lower frequencies. By removing flaring ground in comparison to prevalent SSPP-based constructions, the total size of the filter is significantly decreased, and mode conversion efficiency at the transition from co-planar waveguide (CPW) to the SSPP line is increased. The proposed filter possesses tunable rejection bandwidth, wide stop bands, and a variety of different parameters to adjust the forbidden bands and the filter's cut-off frequency. To demonstrate the filter tunability, the effect of different elements like number (n), width (WR), radius (RR) of CCRRs, and their distance to the SSPP line (yR) are surveyed. Two forbidden bands, located in the X and K bands, are 8.6-11.2 GHz and 20-21.8 GHz. As the proof-of-concept, the proposed filter was fabricated, and a good agreement between the simulation and experiment results was achieved

Heterodyne Instrumentation Upgrade at the Caltech Submillimeter Observatory

Under development at the Caltech Submillimeter Observatory is a dual polarization, continuous comparison (correlation) receiver. The instrument has two beams on the sky; a reference and a signal beam. Using only cooled reflecting optics, two polarizing grids, and a quadrature hybrid coupler, the sky beams are coupled to four tunerless SIS mixers (both polarizations). The 4-8 GHz mixer IF outputs are, after amplification, correlated against each other. In principle, this technique results in flat baselines with very low RMS noise and is especially well suited for high redshift Galaxy work. At the same time an upgrade is planned to the existing facility heterodyne instrumentation. Dual frequency mode receivers are under development for the 230/460 GHz and 345/660 GHz atmospheric windows. The higher frequency receivers are implemented in a balanced configuration, which reduces both the LO power requirement and noise. Each mixer has 4 GHz of IF bandwidth and can be controled remotely. Not only do these changes greatly enhance the spectroscopic capabilities of the CSO, they also enable the observatory to be integrated into the Harvard-Smithsonian Submillimeter Array (SMA) as an additional baseline

Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration

This paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation behavior by using a cost-effective EBG hole configuration for millimeter-wave- and terahertz (THz)-frequency-band applications. Moreover, the mixer MMIC is connected to the proposed hollow rectangular waveguide line via a novel wire-bond wideband transition without using any intermediate substrate. A simple periodical nail structure is utilized to suppress the unwanted modes in the transition. Additionally, the presented solution does not impose any limitations on the chip\u27s dimensions or shape. The packaged mixer module shows a return loss lower than 10 dB for LO (70-85 GHz) and RF (150-170 GHz) ports, achieving a better performance than that of traditional waveguide transitions. The module could be used as a transmitter or receiver, and the conversion loss shows good agreement in multiple samples. The proposed packaging solution has the advantages of satisfactory frequency performance, broadband adaptability, low production costs, and excellent repeatability for millimeter-wave- and THz-band systems, which would facilitate the commercialization of millimeter-wave and THz products

Nonlinear and wavelength-tunable plasmonic metasurfaces and devices

textWavelength-tunable optical response from solid-state optoelectronic devices is a desired feature for a variety of applications such as spectroscopy, laser emission tuning, and telecommunications. Nonlinear optical response, on the other hand, has an important role in modern photonic functionalities, including efficient frequency conversions, all-optical signal processing, and ultrafast switching. This study presents the development of optical devices with wavelength tunable or nonlinear optical functionality based on plasmonic effects. For the first part of this study, widely wavelength tunable optical bandpass filters based on the unique properties of long-range surface plasmon polaritons (LR SPP) are presented. Planar metal stripe waveguides surrounded by two different cladding layers that have dissimilar refractive index dispersions were used to develop a wide wavelength tuning. The concept was demonstrated using a set of index-matching fluids and over 200nm of wavelength tuning was achieved with only 0.004 of index variation. For practical application of the proposed concept, a thermo-optic polymer was used to develop a widely tunable thermo-optic bandpass filter and over 220 nm of wavelength tuning was achieved with only 8 ºC of temperature variation. Another novel approach to produce a widely wavelength tunable optical response for free-space optical applications involves integrating plasmonic metasurfaces with quantum-electronic engineered semiconductor layers for giant electro-optic effect, which is proposed and experimentally demonstrated in the second part of this study. Coupling of surface plasmon modes formed by plasmonic nanoresonators with Stark tunable intersubband transitions in multi-quantum well structures induced by applying bias voltages through the semiconductor layer was used to develop tunable spectral responses in the mid-infrared range. Experimentally, over 310 nm of spectral peak tuning around 7 μm of wavelength with 10 ns response time was achieved. As the final part of this study, highly nonlinear metasurfaces based on coupling of electromagnetically engineered plasmonic nanoresonators with quantum-engineered intersubband nonlinearities are proposed and experimentally demonstrated. In the proof-of-concept demonstration, an effective nonlinear susceptibility over 50 nm/V was measured and, after further optimization, over 480 nm/V was measured for second harmonic generation under normal incidence. The proposed concept shows that it is possible to engineer virtually any element of the nonlinear susceptibility tensor of the nonlinear metasurface.Electrical and Computer Engineerin

Effective-Medium-Clad Dielectric Components Towards Terahertz Integrated Platform

Over the past few decades, optics-based time-domain spectroscopic systems have significantly promoted the developments of terahertz science and technology. Despite their success in physics, the bulky and costly optical systems are not readily amendable to various applications such as communications, imaging, sensing, and radar. These applications require devices with structural compactness, integrability, and portability. Leveraging both electronic and photonic technologies, terahertz integrated circuits have emerged and gradually bridged the gap between ’concept’ and ’application’. To realise multifunctional terahertz integrated circuits, efficient and broadband platforms able to accommodate various passive and active components are in great demand, while interconnects with low loss, low dispersion, and broad bandwidth are vital. To this end, this thesis focuses on an efficient and broadband terahertz integrated platform based on silicon. Firstly, a class of self-supported substrateless dielectric waveguides are proposed based on the effective medium theory. The effective-mediumclad dielectric waveguides are purely built into a high-resistivity intrinsic float-zone silicon wafer to achieve extremely low loss and low dispersion. The effective medium is realised by periodically perforating the silicon slab with a deep subwavelength spacing, leading to a tailorable effective relative permittivity tensor. Consequently, an additional degree of freedom is granted in this design to manipulate the waveguides’ modal indices and adapt to different guiding scenarios. Through in-depth investigations of various propagation characteristics, the proposed waveguides show a potential to establish a terahertz integrated platform with a high level of design flexibility. Benefiting from the concept of effective medium to create this new waveguide platform, various fundamental building blocks and functional components are proposed including bends, crossings, directional couplers, filters, and polarisation splitters. All these components inherit high efficiency and broad bandwidth, which are much needed for terahertz applications that typically leverage a vast available bandwidth with limited source power. The proposed concepts can benefit terahertz integrated circuits at large, in analogy to the silicon-on-insulator platform for integrated photonics.Thesis (Ph.D.) -- University of Adelaide,School of Electrical and Electronic Engineering, 202

Synthesis of waveguide antenna arrays using the coupling matrix approach

With the rapid development in communication systems recently, improvements in components of the systems such as antennas and bandpass filters are continuously required to provide improved performance. High gain, wide bandwidth, and small size are the properties of antennas which are demanded in many modern applications, and achieving these simultaneously is a challenge. This thesis presents a new design approach to address this challenge. The coupling matrix is an approach used to represent the circuits made of coupled resonators such as filters and multiplexers. The approach has been utilised here to integrate a single resonator-based antenna with an n$^t$$^h$ order filter. The integrated component is capable of providing a controllable bandwidth and introduces the filtering functionality. The approach is further developed in order to integrate bandpass filters with N×N resonator-based antenna arrays. This is to increase the gain of the array as well. Six novel components have been fabricated for the purpose of validation. This thesis also looks at a 300 GHz communication system which is proposed at The University of Birmingham with the objective to build a 10 metre indoor communication link. A 300 GHz (8×8) waveguide antenna array has been designed and fabricated for the system

Packages for Terahertz Electronics

In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.119Ysciescopu