DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

Cognitive Radio for Emergency Networks

In the scope of the Adaptive Ad-hoc Freeband (AAF) project, an emergency network built on top of Cognitive Radio is proposed to alleviate the spectrum shortage problem which is the major limitation for emergency networks. Cognitive Radio has been proposed as a promising technology to solve todayâ?~B??~D?s spectrum scarcity problem by allowing a secondary user in the non-used parts of the spectrum that aactully are assigned to primary services. Cognitive Radio has to work in different frequency bands and various wireless channels and supports multimedia services. A heterogenous reconfigurable System-on-Chip (SoC) architecture is proposed to enable the evolution from the traditional software defined radio to Cognitive Radio

Improving reconfigurable systems reliability by combining periodical test and redundancy techniques: a case study

This paper revises and introduces to the field of reconfigurable computer systems, some traditional techniques used in the fields of fault-tolerance and testing of digital circuits. The target area is that of on-board spacecraft electronics, as this class of application is a good candidate for the use of reconfigurable computing technology. Fault tolerant strategies are used in order for the system to adapt itself to the severe conditions found in space. In addition, the paper describes some problems and possible solutions for the use of reconfigurable components, based on programmable logic, in space applications

Octopus - an energy-efficient architecture for wireless multimedia systems

Multimedia computing and mobile computing are two trends that will lead to a new application domain in the near future. However, the technological challenges to establishing this paradigm of computing are non-trivial. Personal mobile computing offers a vision of the future with a much richer and more exciting set of architecture research challenges than extrapolations of the current desktop architectures. In particular, these devices will have limited battery resources, will handle diverse data types, and will operate in environments that are insecure, dynamic and which vary significantly in time and location. The approach we made to achieve such a system is to use autonomous, adaptable modules, interconnected by a switch rather than by a bus, and to offload as much as work as possible from the CPU to programmable modules that is placed in the data streams. A reconfigurable internal communication network switch called Octopus exploits locality of reference and eliminates wasteful data copies

Temperature Evaluation of NoC Architectures and Dynamically Reconfigurable NoC

Advancements in the field of chip fabrication led to the integration of a large number of transistors in a small area, giving rise to the multi–core processor era. Massive multi–core processors facilitate innovation and research in the field of healthcare, defense, entertainment, meteorology and many others. Reduction in chip area and increase in the number of on–chip cores is accompanied by power and temperature issues. In high performance multi–core chips, power and heat are predominant constraints. High performance massive multicore systems suffer from thermal hotspots, exacerbating the problem of reliability in deep submicron technologies. High power consumption not only increases the chip temperature but also jeopardizes the integrity of the system. Hence, there is a need to explore holistic power and thermal optimization and management strategies for massive on–chip multi–core environments. In multi–core environments, the communication fabric plays a major role in deciding the efficiency of the system. In multi–core processor chips this communication infrastructure is predominantly a Network–on–Chip (NoC). Tradition NoC designs incorporate planar interconnects as a result these NoCs have long, multi–hop wireline links for data exchange. Due to the presence of multi–hop planar links such NoC architectures fall prey to high latency, significant power dissipation and temperature hotspots. Networks inspired from nature are envisioned as an enabling technology to achieve highly efficient and low power NoC designs. Adopting wireless technology in such architectures enhance their performance. Placement of wireless interconnects (WIs) alters the behavior of the network and hence a random deployment of WIs may not result in a thermally optimal solution. In such scenarios, the WIs being highly efficient would attract high traffic densities resulting in thermal hotspots. Hence, the location and utilization of the wireless links is a key factor in obtaining a thermal optimal highly efficient Network–on–chip. Optimization of the NoC framework alone is incapable of addressing the effects due to the runtime dynamics of the system. Minimal paths solely optimized for performance in the network may lead to excessive utilization of certain NoC components leading to thermal hotspots. Hence, architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance and energy–efficient multicore systems. This work contributes at exploring various wired and wireless NoC architectures that achieve best trade–offs between temperature, performance and energy–efficiency. It further proposes an adaptive routing scheme which factors in the thermal profile of the chip. The proposed routing mechanism dynamically reacts to the thermal profile of the chip and takes measures to avoid thermal hotspots, achieving a thermally efficient dynamically reconfigurable network on chip architecture