Optimizing Communication for Massively Parallel Processing

The current trends in high performance computing show that large machines with tens of thousands of processors will soon be readily available. The IBM Bluegene-L machine with 128k processors (which is currently being deployed) is an important step in this direction. In this scenario, it is going to be a significant burden for the programmer to manually scale his applications. This task of scaling involves addressing issues like load-imbalance and communication overhead. In this thesis, we explore several communication optimizations to help parallel applications to easily scale on a large number of processors. We also present automatic runtime techniques to relieve the programmer from the burden of optimizing communication in his applications. This thesis explores processor virtualization to improve communication performance in applications. With processor virtualization, the computation is mapped to virtual processors (VPs). After one VP has finished computation and is waiting for responses to its messages, another VP can compute, thus overlapping communication with computation. This overlap is only effective if the processor overhead of the communication operation is a small fraction of the total communication time. Fortunately, with network interfaces having co-processors, this happens to be true and processor virtualization has a natural advantage on such interconnects. The communication optimizations we present in this thesis, are motivated by applications such as NAMD (a classical molecular dynamics application) and CPAIMD (a quantum chemistry application). Applications like NAMD and CPAIMD consume a fair share of the time available on supercomputers. So, improving their performance would be of great value. We have successfully scaled NAMD to 1TF of peak performance on 3000 processors of PSC Lemieux, using the techniques presented in this thesis. We study both point-to-point communication and collective communication (specifically all-to-all communication). On a large number of processors all-to-all communication can take several milli-seconds to finish. With synchronous collectives defined in MPI, the processor idles while the collective messages are in flight. Therefore, we demonstrate an asynchronous collective communication framework, to let the CPU compute while the all-to-all messages are in flight. We also show that the best strategy for all-to-all communication depends on the message size, number of processors and other dynamic parameters. This suggests that these parameters can be observed at runtime and used to choose the optimal strategy for all-to-all communication. In this thesis, we demonstrate adaptive strategy switching for all-to-all communication. The communication optimization framework presented in this thesis, has been designed to optimize communication in the context of processor virtualization and dynamic migrating objects. We present the streaming strategy to optimize fine grained object-to-object communication. In this thesis, we motivate the need for hardware collectives, as processor based collectives can be delayed by intermediate that processors busy with computation. We explore a next generation interconnect that supports collectives in the switching hardware. We show the performance gains of hardware collectives through synthetic benchmarks

On Multicast in Asynchronous Networks-on-Chip: Techniques, Architectures, and FPGA Implementation

In this era of exascale computing, conventional synchronous design techniques are facing unprecedented challenges. The consumer electronics market is replete with many-core systems in the range of 16 cores to thousands of cores on chip, integrating multi-billion transistors. However, with this ever increasing complexity, the traditional design approaches are facing key issues such as increasing chip power, process variability, aging, thermal problems, and scalability. An alternative paradigm that has gained significant interest in the last decade is asynchronous design. Asynchronous designs have several potential advantages: they are naturally energy proportional, burning power only when active, do not require complex clock distribution, are robust to different forms of variability, and provide ease of composability for heterogeneous platforms. Networks-on-chip (NoCs) is an interconnect paradigm that has been introduced to deal with the ever-increasing system complexity. NoCs provide a distributed, scalable, and efficient interconnect solution for today’s many-core systems. Moreover, NoCs are a natural match with asynchronous design techniques, as they separate communication infrastructure and timing from the computational elements. To this end, globally-asynchronous locally-synchronous (GALS) systems that interconnect multiple processing cores, operating at different clock speeds, using an asynchronous NoC, have gained significant interest. While asynchronous NoCs have several advantages, they also face a key challenge of supporting new types of traffic patterns. Once such pattern is multicast communication, where a source sends packets to arbitrary number of destinations. Multicast is not only common in parallel computing, such as for cache coherency, but also for emerging areas such as neuromorphic computing. This important capability has been largely missing from asynchronous NoCs. This thesis introduces several efficient multicast solutions for these interconnects. In particular, techniques, and network architectures are introduced to support high-performance and low-power multicast. Two leading network topologies are the focus: a variant mesh-of-trees (MoT) and a 2D mesh. In addition, for a more realistic implementation and analysis, as well as significantly advancing the field of asynchronous NoCs, this thesis also targets synthesis of these NoCs on commercial FPGAs. While there has been significant advances in FPGA technologies, there has been only limited research on implementing asynchronous NoCs on FPGAs. To this end, a systematic computeraided design (CAD) methodology has been introduced to efficiently and safely map asynchronous NoCs on FPGAs. Overall, this thesis makes the following three contributions. The first contribution is a multicast solution for a variant MoT network topology. This topology consists of simple low-radix switches, and has been used in high-performance computing platforms. A novel local speculation technique is introduced, where a subset of the network’s switches are speculative that always broadcast every packet. These switches are very simple and have high performance. Speculative switches are surrounded by non-speculative ones that route packets based on their destinations and also throttle any redundant copies created by the former. This hybrid network architecture achieved significant performance and power benefits over other multicast approaches. The second contribution is a multicast solution for a 2D-mesh topology, which is more complex with higher-radix switches and also is more commonly used. A novel continuous-time replication strategy is introduced to optimize the critical multi-way forking operation of a multicast transmission. In this technique, a multicast packet is first stored in an input port of a switch, from where it is sent through distinct output ports towards different destinations concurrently, at each output’s own rate and in continuous time. This strategy is shown to have significant latency and energy benefits over an approach that performs multicast using multiple distinct serial unicasts to each destination. Finally, a systematic CAD methodology is introduced to synthesize asynchronous NoCs on commercial FPGAs. A two-fold goal is targeted: correctness and high performance. For ease of implementation, only existing FPGA synthesis tools are used. Moreover, since asynchronous NoCs involve special asynchronous components, a comprehensive guide is introduced to map these elements correctly and efficiently. Two asynchronous NoC switches are synthesized using the proposed approach on a leading Xilinx FPGA in 28 nm: one that only handles unicast, and the other that also supports multicast. Both showed significant energy benefits with some performance gains over a state-of-the-art synchronous switch

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

Scaling High-Performance Interconnect Architectures to Many-Core Systems.

The ever-increasing demand for performance scaling has made multi-core (2-8 cores) chips prevalent in today’s computing systems and foreshadows the shift toward many-core (10s- 100s of cores) chips in the near future. Although the potential performance gains from many-core systems remain appealing, the widespread adoption of these systems hinges on their ability to scale performance while simultaneously satisfying Quality-of-Service (QoS) and energy-efficiency constraints. This work makes the case that the interconnect for these many-core systems has a significant impact on the aforementioned scalability issues. The impact of interconnects on many-core systems is illustrated by observing that the degree of the interconnect has a signicant effect on system scalability and demonstrating that the architecture of high-radix, many-core systems are feasible, energy-efficient, and high-performance. The feasibility of high-radix crossbars for many-core systems is first shown through a new circuit-level building block called the Swizzle-Switch which can operate at frequencies up to 1.5GHz for 128-bit, radix-64 crossbars. This work then shows how a many-core system called the Swizzle-Switch Network (SSN) can use the Swizzle-Switch as the central building block for a flat crossbar interconnect. The SSN is shown to be advantageous to traditional Network-on-Chip (NoC) for systems up to 64 cores. The SSN performance by 21% relative to a Mesh while also providing a 25% energy savings over the Mesh. The Swizzle-Switch is also leveraged as a building block for high-radix NoC topologies that can support many-core architectures. The Swizzle-Switch-based Flattened Butterfly topology is demonstrated to provide a 15% speedup and 10% energy savings over the Mesh. Finally, the impact that 3D stacking technology has on many-core scalability is evaluated for bus and crossbar interconnects. A 3D-optimized Swizzle-Switch Network is able to leverage frequency gains to achieve a 15-28% speedup over a 2D-Swizzle-Switch Network when using memory- intensive benchmarks. Additionally, a bus-based 64-core architecture is shown to provide an average speedup of 49× over a baseline uniprocessor system when using 3D technology.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/93980/1/ksewell_1.pd

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast