Scalable and Adaptive Agile Framework for Semiconductor Foundry: Advanced Packaging and Heterogeneous Integration Perspective

Abstract

This research addressed the critical requirement for a scalable and adaptive agile framework specifically designed for the unique demands of semiconductor foundries specializing in advanced packaging and heterogeneous integration (HI). The semiconductor industry was encountering growing pressure to innovate and respond quickly to rapidly evolving demands, yet traditional manufacturing processes often struggled to adapt. Existing agile frameworks, mainly developed for the software industry, lacked the necessary adaptations to address the complexities of semiconductor manufacturing, including extended lead times, high capital investment, rigorous quality requirements, and the integration of various technologies. This research gap hindered the ability of semiconductor foundries to optimize their operations and maintain competitiveness. This study utilized a qualitative method, interviewing professionals from semiconductor foundries actively involved in advanced packaging and HI. Through thematic analysis of interview data, this research sought to identify crucial patterns and gain deeper understandings of the factors influencing agile transformation. The primary goal was to develop a tailored agile framework that addressed the particular requirements of advanced packaging and HI, enabling real-time visibility, flexibility, and responsiveness in managing complex workflows. The outcome of this research included improved manufacturing efficiency, enhanced innovation capabilities, and accelerated deployment of next-generation semiconductor technologies. The developed framework would offer actionable guidance for semiconductor foundries seeking to implement agile principles, contributing to the advancement of the semiconductor industry