Advanced packaging for SiC power modules

Abstract

The PhD research focuses on exploring solutions to the interconnection challenges in packaging that hinder the exploitation of the full potential of SiC semiconductor power modules. These packaging solutions aim to enable SiC power devices to operate at higher power densities, switching speeds, efficiency, and reliability. To be more specific, a systematic study of topside interconnection and substrate attachment regarding design, materials, process, simulation, testing, and failure analysis for SiC power modules is conducted