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Reliability analysis for power electronics modules

By Christopher Bailey, Tim Tilford and Hua Lu


This paper discusses the reliability of power electronics modules. The approach taken combines numerical modeling techniques with experimentation and accelerated testing to identify failure modes and mechanisms for the power module structure and most importantly the root cause of a potential failure. The paper details results for two types of failure (i) wire bond fatigue and (ii) substrate delamination. Finite element method modeling techniques have been used to predict the stress distribution within the module structures. A response surface optimisation approach has been employed to enable the optimal design and parameter sensitivity to be determined. The response surface is used by a Monte Carlo method to determine the effects of uncertainty in the design

Topics: TK, QA75
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Year: 2007
OAI identifier:

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