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Analysis of a PDE Thermal Element Model for Electrothermal Circuit Simulation

By G. Alì, A. Bartel, M. Culpo and C. de Falco

Abstract

In this work we address the well-posedness of the steady-state and transient problems stemming from the coupling of a network of lumped electric elements and a PDE model of heat diffusion in the chip substrate. In particular we consider the thermal element model presented in [1] and we prove that it can be controlled by any combination of voltage sources (imposing the average current in a region of the chip) and current sources (imposing the Joule power per unit area produced in a region) connected to its temperature nodes. This result justifies the implementation of the element as a linear n-port conductance as carried out in [2]

Publisher: 'Springer Science and Business Media LLC'
Year: 2010
DOI identifier: 10.1007/978-3-642-12294-1_35
OAI identifier: oai:re.public.polimi.it:11311/561565
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