Analysis of a PDE Thermal Element Model for Electrothermal Circuit Simulation

Abstract

In this work we address the well-posedness of the steady-state and transient problems stemming from the coupling of a network of lumped electric elements and a PDE model of heat diffusion in the chip substrate. In particular we consider the thermal element model presented in [1] and we prove that it can be controlled by any combination of voltage sources (imposing the average current in a region of the chip) and current sources (imposing the Joule power per unit area produced in a region) connected to its temperature nodes. This result justifies the implementation of the element as a linear n-port conductance as carried out in [2]