Electrochemical deposition of Ni and Cu onto monocrystalline n Si 100  wafers and into nanopores in Si SiO2 template

Ivanova, Y.A.; Ivanou, D.K.; Fedotov, A.K.; Streltsov, E.A.; Demyanov, S.E.; Petrov, A.V.; Kaniukov, E.Y.; Fink, D.

research articletext

oai:helmholtz.HZB:-4680

Electrochemical deposition of Ni and Cu onto monocrystalline n Si 100 wafers and into nanopores in Si SiO2 template

Authors: Y.A. Ivanova
D.K. Ivanou
A.K. Fedotov
E.A. Streltsov
S.E. Demyanov
A.V. Petrov
E.Y. Kaniukov
D. Fink
Publication date: 1 January 2007
Publisher
Doi

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oai:helmholtz.HZB:-4680

Last time updated on 12/11/2016

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