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Single-stage sealing of ceramic tiles by means of high power diode laser radiation

By Jonathan Lawrence, Lin Li, Roger E. Edwards and Andrew W. Gale


An investigation has been carried out using a 60 W high power diode laser (HPDL) to determine the feasibility of sealing the void between adjoining ceramic tiles with a specially developed grout material. A single-stage process has subsequently been devised using a new grout material which consists of two distinct components: a crushed ceramic tile mix substrate and a glazed enamel surface; the crushed ceramic tile mix provides a tough, inexpensive bulk substrate, whilst the enamel provides an impervious surface glaze. HPDL processing has resulted in crack and porosity free seals produced in normal atmospheric conditions. The single-stage grout is simple to formulate and easy to apply. Tiles were successfully sealed with power densities as low as 750 W/cm2 and at rates of up to 420 mm/min. Bonding of the enamel to the crushed ceramic tile mix was identified as being primarily due to van der Waals forces and, on a very small scale, some of the crushed ceramic tile mix material dissolving into the glaze

Topics: H680 Optoelectronic Engineering, H700 Production and Manufacturing Engineering
Publisher: Laser Institute of America
Year: 2001
OAI identifier:

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