Low-Temperature III–V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process

By Michael J. Jackson, Li-Min Chen, Ankit Kumar, Yang Yang and Mark S. Goorsky

Publisher: Springer Science and Business Media LLC

Year: 2010

DOI identifier: 10.1007/s11664-010-1397-8

OAI identifier:

Provided by: MUCC (Crossref)

Download PDF:
_{Sorry, we are unable to provide the full text but you may find it at the
following location(s):}

https://link.springer.com/cont... (external link)