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Low-Temperature III–V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process

By Michael J. Jackson, Li-Min Chen, Ankit Kumar, Yang Yang and Mark S. Goorsky
Publisher: Springer Science and Business Media LLC
Year: 2010
DOI identifier: 10.1007/s11664-010-1397-8
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Provided by: MUCC (Crossref)
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