Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

By Piaopiao He, Jinlong Zhang, Jianhua Zhang and Luqiao Yin

Publisher: Hindawi Limited

Year: 2017

DOI identifier: 10.1155/2017/8658164

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Provided by: MUCC (Crossref)

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