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Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

By Piaopiao He, Jinlong Zhang, Jianhua Zhang and Luqiao Yin
Publisher: Hindawi Limited
Year: 2017
DOI identifier: 10.1155/2017/8658164
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Provided by: MUCC (Crossref)
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