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Viscoelastic behavior of an epoxy resin during cure below the glass transition temperature: Characterization and modeling

By Alice Courtois, Martin Hirsekorn, Maria Benavente, Agathe Jaillon, Lionel Marcin, Edu Ruiz and Martin Lévesque
Publisher: SAGE Publications
Year: 2018
DOI identifier: 10.1177/0021998318781226
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Provided by: MUCC (Crossref)
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