Location of Repository

10A-3 (Invited) Design Methods and Tools for 3D Integration

By Giovanni De Micheli, Vasilis Pavlidis, David Atienza and Yusuf Leblebici

Abstract

Abstract—The design of 3-dimensional integrated circuits requires new specialized tools, methods and flows. Whereas some tools are on the market and some design flows for standard ICs are extended to handle die stacking and through-silicon vias, much R&D has still to address relevant and crucial problems. We can roughly classify design problems and tools into three categories: i) synthesis of 3D structures, ii) analysis, verification and test support, and iii) thermal management. We briefly survey methods and tools addressing these problems. Index Terms—3D placement, 3D routing, Network on Chip, GALS, signal integrity, power integrity, thermal management. I

Year: 2013
OAI identifier: oai:CiteSeerX.psu:10.1.1.371.8449
Provided by: CiteSeerX
Download PDF:
Sorry, we are unable to provide the full text but you may find it at the following location(s):
  • http://citeseerx.ist.psu.edu/v... (external link)
  • http://infoscience.epfl.ch/rec... (external link)
  • http://infoscience.epfl.ch/rec... (external link)
  • Suggested articles


    To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.