is a micromachined array of tiltable mirrors that are discretely addressable. These devices are packaged to provide handling and reliability protection as well as common thermal, optical and electrical interfaces. This article details the historical path that led to the present package design. The present DMD package is constructed of high cost materials with tight tolerances that are seam welded to provide a self-contained and hermetic internal environment. The first of a series of value-added developments is achieved with a non-hermetic package. Future developments and plans which will support high performance projection as well as high volume consumer products are outlined in this article. The Digital Micromirror Device (DMD) is a micromechanical spatial light modulator that is used in Texas Instruments Digital Light Processing TM (DLP TM) display systems. This semiconductor optical device poses packaging challenges that are unique to standard semiconductor and optical device packaging concepts. Over the past seven years, TI has aggressively pursued the development of robust packages for the DMD microchip. This package development and productization effort has contributed to a reliable display product line. This article describes the evolution of DMD packaging from TI’s Airline Ticket Boarding (ATB) device in 1992, to the video graphics array (VGA), super video graphics array (SVGA), extended graphics array (XGA) and super extended graphics array (SXGA) types of packages today (see Figure 1 and Figure 2). The strategy to develop future generations of DMD packages will be presented. ATB package The first production DMD device was used for ATB low-resolution printing of airline boarding passes (Figure 2a). The ATB chip size was approximately 0.64 ” x 0.18 ” and contained 840 mirrors in a 420 x 2 staggered array. The package consisted of a 28-lead ceramic header bonded to a flat glass with a B-staged adhesive cured at 100 o Celsius. The B-stage adhesive HDT
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