Skip to main content
Article thumbnail
Location of Repository

Analysis of substrate thermal gradient effects on optimal buffer insertion

By Amir H. Ajami, Kaustav Banerjee and Massoud Pedram

Abstract

Abstract. This paper studies the effects of the substrate thermal gradients on the buffer insertion techniques. Using a non-uniform temperaturedependent distributed RC interconnect delay model, the buffer insertion problem is analyzed and design guidelines are provided to ensure the nearoptimality of the signal performance in the presence of the thermal gradients. In addition, the effect of temperature-dependent driver resistance on the buffer insertion is studied. Experimental results show that neglecting thermal gradients in the substrate and the interconnect lines can result in non-optimal solutions when using standard buffer insertion techniques and that these effects intensify with technology scaling.

Year: 2001
OAI identifier: oai:CiteSeerX.psu:10.1.1.196.6851
Provided by: CiteSeerX
Download PDF:
Sorry, we are unable to provide the full text but you may find it at the following location(s):
  • http://citeseerx.ist.psu.edu/v... (external link)
  • http://www.sigda.org/Archives/... (external link)
  • Suggested articles


    To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.