Location of Repository

Multilayer Coplanar Waveguide Transmission Lines Compatible with Standard Digital Silicon Technologies

By Yunliang Zhu, Shang Wang and Hui Wu

Abstract

Abstract — On-chip transmission lines in silicon technologies suffer from the low-resistivity substrate and geometry limitations imposed by layout and metal density design rules. In this paper, we demonstrate that multilayer coplanar waveguide (MCPW) transmission lines can be utilized to overcome both problems by taking advantage of multiple metal layers available. We studied the effects of ground spacing on MCPW characteristics using electromagnetic simulations, based on process parameters from a0.18�m standard digital CMOS technology with 0.01 Å-cm P+ substrate. Simulation results show that by adjusting the ground spacing, we can control the characteristics impedance, effective dielectric constant, and attenuation of MCPW lines. A test chip was designed and fabricated with MCPW, regular CPW, and microstrip lines. Measurement results verified the analysis and simulation results. I

Year: 2011
OAI identifier: oai:CiteSeerX.psu:10.1.1.183.7620
Provided by: CiteSeerX
Download PDF:
Sorry, we are unable to provide the full text but you may find it at the following location(s):
  • http://citeseerx.ist.psu.edu/v... (external link)
  • http://www.ece.rochester.edu/r... (external link)
  • Suggested articles


    To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.