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GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES VOLUME II OF 2 VOLUMES APPLICATIONS

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Abstract

established procedure. 2. This publication was approved on 29 December 1987 for printing and inclusion in the military standardization handbook series. Vertical lines and asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. 3. This document provides basic and application information on grounding, bonding, and shielding practices recommended for electronic equipment. It will provide valuable information and guidance to personnel concerned with the preparation of specifications and the procurement of electrical and electronic equipment for the Defense Communications System. The handbook is not intended to be referenced in purchase specifications except for informational purposes, nor shall it supersede any specification requirements. 4. Every effort has been made to reflect the latest information on the interrelation of considerations of electrochemistry, metallurgy, electromagnetic, and atmospheric physics. It is the intent to review this handbook periodically to insure its completeness and currency. Users of this document are encouraged to report any errors discovered and any recommendations for changes or inclusions to: Commander, 1842 EEG/EEITE

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Year: 1982
OAI identifier: oai:CiteSeerX.psu:10.1.1.135.9472
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