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Packaging technology enabling flexible optical interconnections

By Erwin Bosman, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe, Sandeep Kalathimekkad and Peter Van Daele
Publisher: SPIE
Year: 2011
DOI identifier: 10.1117/12.874959
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Provided by: MUCC (Crossref)

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