journal article
oaioai:espace.library.uq.edu.au:UQ:202469

Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders

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Publication date
1 January 2009
Publisher
'Japan Institute of Electronics Packaging'
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    UQ eSpace (University of Queensland)

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    Last time updated on 30/08/2013

    This paper was published in UQ eSpace (University of Queensland).

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