Phenil glycidyl ether (PGE), a monofunctional diluent, has been used in epoxy resins formulations in order to increase the toughness of the epoxy molded composite. In a systematic study concerning its influence in the cure kinetics of the epoxy resin, it was used in concentrations of 2,5; 5,0; 10 and 20% in relation to a diglycidyl ether bisphenol-A (DGEBA)/diamino diphenil-sulfone (DDS) base matrix. Dynamic and isothermal scanning analysis were carried out using a differential scanning calorimety (DSC) equipment. For all the concentrations of PGE, a n order kinetics was observed, with n varing between 0,35 -- 0,91 as a function of the increase in the PGE concentration
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