Recent methods of compacting nanopowders of thermoelectric materials of silicon germanium and
Half-Heusler (HH) compounds based on Ni(Ti,Zr,Hf)Sn are presented. Half-Heusler alloys are known to be
intermetallic compounds with quite large Seebeck coefficient and semiconducting transport properties.
This makes them a potential candidate for thermoelectric applications. In this study we compare compacting
methods applied to raw materials as a function of crystal structure. The results suggest that the thermal
conductivity can be reduced by increasing the phonon scattering via nanostructuring. The effect of
spark plasma sintering (SPS) and hot pressing on Gleeble system was analyzed by TEM and SEM methods.
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