3D-IC design solution for modular integration of chiplet over silicon interposer

Authors
Publication date
21 January 2019
Publisher
HAL CCSD

Abstract

International audienc

    Similar works

    Full text

    thumbnail-image

    Available Versions

    Hal - Université Grenoble Alpes

    redirect
    oaioai:HAL:hal-02088475v1
    Last time updated on 09/07/2019

    Archive Ouverte en Sciences de l'Information et de la Communication

    redirect
    oaioai:HAL:hal-02088475v1
    Last time updated on 09/07/2019

    HAL-CEA

    redirect
    oaioai:HAL:hal-02088475v1
    Last time updated on 19/04/2019